Special instructions for DSs33x4201A0:
1.	Silk screen top and bottom white with supplied artwork.
2.	Copper external / internal 0.5 ounce. External plated to 1 ounce.
3.	Hole sizes are finished size. Tolerance in this file supersedes all other files.  
    Tolerances are: 
    Tolerance for Via is +0" - via size
    Tolerance for all other holes is +/- 0.003"            
4.	Finish: LPI Soldermask, color BLUE, with exposed copper areas plated with standard 3-8 micro inches immersion gold over 100 minimum micro inches electroless nickel.
5.	Material FR4, dielectric constant 4.5.
6.      Build / Manufacture to best commercial standards.
7.	Required stackup shown at end of this file
8.    	Clip silkscreen if needed, based on soldermask (not pad-etch).

Enclosed files:
1)	Etch:
    TOP.art          Top layer positive image artwork.
    L2_GND.art       Layer 2 positive image artwork
    L3.art           Layer 3 positive image artwork  
    L4.art           Layer 4 positive image artwork  
    L5_V3V.art           Layer 5 positive image artwork      
    BOTTOM.art       Bottom layer positive image artwork.
2)	silk_T.art	Top layer silk screen.
3)	silk_B.art	Bottom layer silk screen.
4)	sdr_m_t.art Top layer Soldermask.
5)	sdr_m_b.art Bottom layer Soldermask.
6)	Drill.art	Drill chart and board dimension.
7)	ncdrill1-1-6.tap	
8)	ncdrill.log
9) 	nc_param.txt
10)	dimension.art	Outline / Dimension

----------------------Stackup (+- 10%) ------------------------------
Etch - Top    (Signal)	
  			  Separation	4.2 Mil
Etch - L2_GND (Plane)	
  			  Separation	6.0 Mil	
Etch - L3     (Signal)	

  			  Separation	65 to 75 Mil

Etch - L4     (Signal)	
  			  Separation	6.0 Mil	
Etch - L5_V3V (Plane)	
  			  Separation	4.2 Mil		
Etch - Bot    (Signal)
---------------------------------
Total thickness [ref]  90 Mil