
Special instructions for DS26518DK01A0:
1.	Silk screen top and bottom white with supplied artwork.
2.	Copper external / internal 0.5 ounce. External plated to 1 ounce.
3.	Hole sizes are finished size.  Tolerance is +/-0.003" except 0.064 nonplated hole which is +-0.001.  Also via (.010 hole) tolerance is +0.003" - via size.
4.	Finish: LPI Soldermask, color BLUE, with exposed copper areas plated with standard 3-8 micro inches immersion gold over 100 minimum micro inches electroless nickel.
5.	Material FR4, dielectric constant 4.5.
6.    Board thickness .084" +/- 10%.
7.	The board has .005" or greater width traces with 5 mil space.
8.	Build / Manufacture to best commercial standards.
9.   	Dielectric thicknesses: 20 mil cores between layers 2/3, 4/5, 6/7. Pre-pregs totaling 5-6 mils between layers 1-2, 3-4, 5-6, 7-8



Enclosed files:
1)	Top.art		Top layer positive image artwork.
2)	L3*.art through L7*.art	Layer 3 to Layer 7 positive image artwork (respectively)
3)	Bottom.art	Bottom layer positive image artwork.
4)	TSS.art	Top layer silk screen.
5)	BSS.art	Bottom layer silk screen.
6)	TSM.art Top layer Soldermask.
7)	BSM.art Bottom layer Soldermask.
8)	NCDrill.art	Drill chart and board dimension.
9)	ncdrill1.tap	
10)	ncdrill.log
11) 	nc_param.txt

