Special instructions for DS26334DK01B0:
1.	Silk screen top and bottom white with supplied artwork.

2.	Copper external / internal 0.5 ounce. External plated to 1 ounce.

3.	Hole sizes are finished size.  Tolerance is +/-0.003"   - via size

4.	Finish: LPI Soldermask, color BLUE, with exposed copper 
        areas plated with standard 3-8 micro inches 
        immersion gold over 100 minimum micro inches electroless nickel.

5.	Material FR4, dielectric constant 4.5.

6.      Board thickness .084" +/- 10%.

7.	Conductor width has .005" or greater width traces.

8.	Build / Manufacture to best commercial standards.

9.   	Dielectric thicknesses: 13 mil dielectric between layers 1/2, 2/3, 8/9, 9/10. 
        dielectric totaling 5-6 mils between layers 3-4, 5-6, 7-8.

10.	DO NOT MODIFY SILKSCREEN, SOLDERMASK OR COPPER LAYERS TO ADD COMPANY LOGO,
	ELECTRICAL TEST DATA OR LOT INFORMATION!

Enclosed files:
1)	Top.art		Top layer positive image artwork.
2)	L2.art through L9.art	Layer 2 to Layer 9 positive image artwork (respectively)
3)	Bottom.art	Bottom layer positive image artwork.
4)	SILKT.art	Top layer silk screen.
5)	SILKB.art	Bottom layer silk screen.
6)	SDRMT.art Top layer Soldermask.
7)	SDRMB.art Bottom layer Soldermask.
8)	Drill.art	Drill chart and board dimension.
9)	ncdrill1.tap	
10)	ncdrill.log
11) 	nc_param.txt

