Panel Specifications SMT:
Max Size: 14"x16"
Minimum Board Thickness: 0.4mm
Maximum Board Thickness: 2.0mm
Minimum Border Thickness: 2.5mm
1/2" Borders On 2 Sides Only.
Use Breakaway Tabs Or V Groove.

Panel Specifications THRU HOLE:
Max Size: 16"x16"
Minimum Board Thickness: 0.4mm
Maximum Board Thickness: 2.0mm
Minimum Border Thickness: 2.6mm
1/2" Borders On 2 Sides Only.
Use Breakaway Tabs Or V Groove.

Board Materials
Board material shall be FR-4 with an Er of 4.3-4.6, a volume resistivity of at least 10^8 MOhm and a finished thickness 0.062 +/- 0.005.
Soldermask shall be LPI, GREEN, no tent, both sides.
Silkscreen shall be white nonconductive epoxy ink.
Copper shall have finished thickness 2oz.

Process Requirements
Smear removal is not required; however, board fabricator may opt to do so provided etchback does not exceed 0.001".
Board is designed for maximum land/hole fabrication allowance of 0.007" of 0.007".
Board is designed to a copper clearance of 0.006".
Minimun anular ring requirement is 0.002".

Stencils:
Generate And Email Necessary Stencil Information For The Top And Bottom Layers To Sean McNally (smcnally@linear.com).

Spacing and Clearance Requirements
Board is designed for maximum Fabrication Allowance of 0.010" (ref. IPC-2221 sec.9.1.1)
Internal Plane Clearance shall be 0.012" minimum.
Minimum copper to copper clearance shall be 0.010".
Minimum clearance from board edge to internal conductors shall be 0.015".
Soldermask Clearance shall be no greater than 0.010".
Minimum trace width requirement is 0.006".
Minimum annular ring requirement is 0.002".
Bow and twist shall be 1.5% maximum.

Hole Detail Requirements
Diameter tolerance for all holes up to and including 0.075" is +/-0.003".
Diameter tolerance all holes greater than 0.075". is +/-0.006".
0.003" Via Wall Thickness Required On All Vias.

Manufacturing Requirements
Soldermask Clearances:
Ensure any via that has a drill size of 0.008" or less DOES NOT have exposed copper!
Ensure no traces or copper are exposed as a result of large soldermask clearances.
The FAB house may adjust the soldermask clearances to avoid exposing copper.
Notify sean_mcnally@pcisys.net and smcnally@linear.com if the supplied soldermask Gerbers have been altered.

Text overlays on pads:
The FAB house may adjust violating text.
Notify sean_mcnally@pcisys.net and smcnally@linear.com if the supplied silkscreen Gerbers have been altered.

Overlapping text:
Any reference designators are not permitted to have text overlapping, any other text overlays are permissable.
Notify sean_mcnally@pcisys.net and smcnally@linear.com if the supplied silkscreen Gerbers have been altered.

PCB Shipment:
Ship Finished PCB's To Alice Silva @ Linear Technology Corporation, 1630 McCarthy Blvd, Milpitas, CA 95035-7487.
Notify Sean McNally (smcnally@linear.com) Via Email About PCB Shipment.
Notify Alice Silva (asilva@linear.com) Via Email About PCB Shipment.

Fab House Working Files For LTC Archival Purposes:
Please email smcnally@linear.com approved working files prior to PCB Fabrication.

Administrative Details:
Invoice: Linear Technology Corporation, 1630 McCarthy Blvd, Milpitas, CA 95035-7487 Fax (408)434-0507.
Notify sean_mcnally@pcisys.net and smcnally@linear.com when P.O. is received, and request final CAM data.
Notify sean_mcnally@pcisys.net and smcnally@linear.com of any delivery date delays.
Email sean_mcnally@pcisys.net and smcnally@linear.com the tracking number after shipment.
Cam files require approval before board fabrication begins!
