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{"sheet":"Guidance","index":0,"n_rows":24,"n_cols":1,"rows_kept":24,"cut":false,"hidden":false,"merged":[[8,1,8,5]]}
["DeltaQualificationMatrix"]
["Attention!\nIn case of a failure report when activating the macros, you might need to run the Microsoft Fixit https://support.microsoft.com/kb/3025036/en-us."]
["General\nShort product and technology cycles as well as new environmental regulations frequently result in process and material changes of components, printed circuit boards, assembly techniques and circuit layout which have to be evaluated. The ZVEI \"Guideline for Customer Notifications of Product and /or Process Changes (PCN) of Electronic Components specified for Automotive Applications” describes an appropriate methodology for dealing with changed electronic components. The qualification matrices in this guideline are recommendations for how to assess typical changes of electronic components. These recommendations promote an open risk-based discussion between supplier and customer regarding qualifications. \nThe DeltaQualificationMatrices were developed by the Industry Task Force Team \"PCN DeltaQualificationMatrix\" together with component experts from the ZVEI Working Group \"PCN-Methodology\". Actual content represents state-of-the-art technology and does not claim to be comprehensive. Deviation from proposed guideline should be mutually agreed as customer specific requirements have to be considered.\n"]
["DeltaQualificationMatrix Application (completion by component manufacturer)\na) This table has to be used for changes only. The matrices are not applicable for new product, \n     special qualifications (for instance for encapsulation of module) or Information Notes.\nb) If a change is not listed in this table, the qualification plan has to be defined and agreed\n    between customer and supplier.\nc) The matrix for Active Components requires the user to choose between integrated circuits\n    AEC-Q100 and discrete semiconductors AEC-Q101 (cell D4).  \n    For Passive Components AEC-Q200 is used. For Optoelectronic Components the AEC-Q102 is used. \n    For Multi-Chip-Modules the AEC-Q104 is used. For MEMS the AEC-Q103 is used.\nd) All changes as listed in the PCN have to be marked  by a cross (x) in column B and will \n    appear colored. The relevant reliability tests are then shown in \"Tests, which should be\n    considered for the appropriate process change\".   \ne) In \"Tests, which should be considered for the appropriate process change after selection of \n    condition table\" is for modification of the found relevant tests under consideration of the weight \n    of change. \n    Related table “Conditions” has to be assessed per proposed letters with an (x).\nf) In \"Suppliers performed tests\" the component manufacturer documents the planned and \n    performed tests.\ng) In case of deviations from tests, which should be considered this should be notified and\n    commented by the component manufacturer in the area \"Reason for exception of tests\". \n    Test results in form of generic data (G) are allowed when notified and justified."]
["Evaluation Levels are categorized as follows   \n\"C: Component level\": The evaluation of a change at component has to be done by the component manufacturer at the component only. Generic data from other relevant evaluations can be used.\n\n\"B: Board level\": The intended change described in the PCN may influence handling/processability/manufacturability of the component at the customer. Therefore, additional evaluation by the customer may be necessary.\n\n\"A: Application level\": The intended change described in the PCN may influence the properties of the application (e.g. ECU). In addition to the evaluation under C or B the influence of the change in the application is evaluated by suitable investigations by the customer. It has to be considered whether the application / assembly requirements are already sufficiently safeguarded by other qualifications (application-specific risk assessment).\n\n\" *: Not relevant for qualification matrix\": Changes which fulfill neither A,B nor C definitions\n"]
["Infomation Notes \nChanges indicated as “I” shall not be marked in the DeQuMa.  For those changes the Information Note sheet shall be used.  As the DeQuMa is desired for PCN only, a marking of “I”-changes would automatically influence evaluation level and test effort."]
[" Important Notes\n- To use the matrices in the right form the ZVEI working group provides a Tutorial on its homepage \n  (ZVEI-Tutorial )\n- ID number: is a unique identification number for each indicated change defined in the ZVEI PCN \n  DeltaQualificationMatrices. The same ID number is used in the PCN Form sheet to identify the \n  change.\n- Tests identified by the matrix have to be considered and checked if they are necessary to\n  assess the specific change. Test modifications or generic data have to be justified in detail.\n- \"Further applicable conditions\", comments and notes need attention, as they provide important \n  hints and limitations.\n- In order to use all functions in EXCEL, macros have to be allowed."]
[]
["Form provided by ZVEI -  Revision 5.0  -  December 2021"]
[]
[]
[]
["History"]
[]
["Version 0.2:  03.03.11"]
["Version 0.3:  15.04.11, Entwurf seitens Tier1 Continental AG, Hella KGaA Hueck & Co., Robert Bosch GmbH"]
["Version 0.4:  19.07.12, Anpassung des Entwurfs durch Dr. R. Winter (ZVEI), J. Uhlenhut (ELMOS) und Dr. O. Autzen (Robert Bosch GmbH) zum aktuellen Stand der \n                                  Matrix und dem einhergehenden Verständnis der Anwendung."]
["Version 0.5:  01.09.12, Bearbeitung durch Robert Bosch GmbH (AE/QMS-E-Abteilungen)"]
["Version 0.6:  08.10.12, Ergänzung und Nachträge aus ZVEI AK PCN Methodik durch Dr. R. Winter (ZVEI) und Dr. O. Autzen (Robert Bosch)"]
["Version 0.7:  23.10.12, Ergänzung und Nachträge aus ZVEI AK PCN Methodik durch Dr. R. Schmidt (Siemens AG) und Dr. O. Autzen (Robert Bosch)"]
["Version 0.8:  12.11.12, Überarbeitung von Rückmeldungen durch ZVEI Expertenkreis"]
["Version Final: 14.12.12. Korrektur der englischen Beschreibung (Spalte B dieses Blatt)  "]
["Version Final: 15.01.12. Anpassung deuutsche Beschreibung wg. Rechtsverbindlichkeit "]
["Version Final: 16.01.13. Verteilte Version an ZVEI AK jeweils mit und ohne Makros"]

{"sheet":"History","index":1,"n_rows":17,"n_cols":3,"rows_kept":17,"cut":false,"hidden":false,"merged":[[0,1,0,2]]}
[null,"History of DeQuMa "]
[]
[null,"Version","Remarks"]
[null,"2.0","Revised by ZVEI PCN Methodology Workgroup in March 2015"]
[null,"2.1","Released March 2015"]
[null,"2.1.1","Active Components - delete write protection in comments "]
[null,"2.2","Solved problems with some ActiveX configurations"]
[null,"2.2.2","Solved Problems in Active Components"]
[null,"2.2.3","Solved Problems ActiveX, Active Components  SEM-DE-02 (Design changes in routing) error fixed "]
[null,"2.2.4","Minor fixes"]
[null,"3.0","General Revision by ZVEI PCN Methodology Workgroup in June 2016\nChanges are indicated by underlining in the read only version named Changes_DeQuMa_rev3_vs_rev2.xlsx"]
[null,"3.0.4","Expert Release"]
[null,"3.0.5","Fixing of macro bugs"]
[null,"3.1","Final Release (orthographic and punctuation corrections) "]
[null,"4.0","General Revision by ZVEI PCN Methodology Workgroup in July 2019.\nMuliti Chip Modules newly added to DeQuMa \nLED Components now based on the AEC Q102 \nFurther Changes see separate PDF’s Excel-File, where changes are indicated by underlining "]
[null,"4.1","LED worksheet: Content of columns had been swapped due to rearrangement and omission of columns.  "]
[null,"5.0","General Revision by ZVEI PCN Methodology Workgroup in October 2021.\nAdd MEMS pressure sensor"]

{"sheet":"Definition","index":2,"n_rows":18,"n_cols":5,"rows_kept":18,"cut":false,"hidden":true,"merged":[[3,4,5,4],[11,3,14,4],[17,1,17,3]]}
["ZVEI123987","Scope: Die Deltaqualifikationsmatrix betrachtet nur Änderungen, die gem. ZVEI Guideline als PCN mitgeteilt werden müssen."]
[]
[null,"Assessment","Mindset:","Responsible","Criteria"]
[null,"A (application)","Specific ECU","Tier1","Who has the best means (test method, test structures, experiences, and efficency) for validating the change effects?\nSufficient coverage for approval of the change.\n"]
[null,"B (board level)","On test board or generic or family releases","Tier1"]
[null,"C (component)","Semiconductor, passive, and electromechanic component","Tier2"]
[]
[]
[null,null,"recommendation: to be deleted"]
[null,null,"additional / changed /split topic to original ZVEI PCN guideline"]
[]
["Interactions:","I","Wechselwirkung bewerten","Bei I ist die Wechselwirkung mit geeigneten Untersuchungen zu bewerten.\nMit R ist das Risiko einer möglichen Wechselwirkung zu betrachten und ggf. mit geeigneten Untersuchungen zu bewerten."]
["Risk assessment","R","Risikobetrachtung notwendig"]
[]
[]
[]
[]
["Electronic component change qualification","\n● or letter:  Test schould be considered\nG:  Generic data\nR:  Risk assessment",null,null,"Im AEC-Teil sind die Tests markiert, die zur Bewertung zu betrachten sind."]

{"sheet":"Active Components","index":3,"n_rows":228,"n_cols":82,"rows_kept":228,"cut":false,"hidden":false,"merged":[[5,45,6,45],[5,20,6,20],[5,23,6,23],[5,48,6,48],[88,3,88,9],[82,3,82,7],[86,3,86,7],[89,3,89,9],[5,6,5,7],[4,77,4,78],[3,77,3,78],[3,10,8,10],[5,43,6,43],[5,54,6,54],[3,46,3,76],[4,11,4,45],[4,46,4,76],[5,18,6,18],[5,19,6,19],[5,21,6,21],[5,69,6,69],[5,27,6,27],[5,26,6,26],[5,13,6,13],[5,14,6,14],[5,15,6,15],[5,16,6,16],[5,17,6,17],[5,34,6,34],[5,35,6,35],[5,57,6,57],[5,47,8,47],[5,33,6,33],[173,2,173,3],[5,50,6,50],[5,51,6,51],[5,59,6,59],[5,53,6,53],[5,52,6,52],[163,2,163,3],[164,2,164,3],[165,2,165,3],[166,2,166,3],[5,40,6,40],[5,49,6,49],[5,55,6,55],[5,56,6,56],[5,46,8,46],[5,58,6,58],[5,39,6,39],[5,36,6,36],[84,3,84,7],[172,2,172,3],[169,2,169,3],[170,2,170,3],[171,2,171,3],[5,22,6,22],[157,2,157,3],[158,2,158,3],[159,2,159,3],[160,2,160,3],[161,2,161,3],[162,2,162,3],[4,0,4,2],[167,2,167,3],[168,2,168,3],[100,2,101,5],[5,80,8,80],[5,65,6,65],[5,66,6,66],[5,67,6,67],[5,61,6,61],[5,60,6,60],[5,75,6,75],[5,76,6,76],[5,77,6,77],[5,78,6,78],[7,77,8,77],[7,78,8,78],[5,68,6,68],[5,63,6,63],[5,62,6,62],[5,72,6,72],[5,70,6,70],[5,71,6,71],[5,73,6,73],[5,74,6,74],[5,64,6,64],[2,0,2,2],[1,0,1,2],[3,0,3,2],[0,0,0,2],[5,11,8,11],[5,12,8,12],[6,8,7,8],[6,4,6,5],[5,9,7,9],[6,6,7,6],[6,7,7,7],[3,11,3,45],[5,41,6,41],[5,32,6,32],[5,37,6,37],[5,30,6,30],[5,28,6,28],[5,38,6,38],[5,29,6,29],[5,31,6,31],[5,42,6,42],[5,24,6,24],[5,25,6,25],[5,44,6,44]]}
["Worked on:\n (Name, Function)",null,null,"Chaitrali Joshi "]
["Signature:"]
["Date:",null,null,"2025-05-30"]
["PCN number:",null,null,"PCN 25_0143",null,null,null,null,null,null,"Line evaluation\n(can be evaluated by data or audit/on site check)","Device evaluation",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Device evaluation"]
["For integrated circuits or discrete semiconductors select below:",null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q100 Revision H)\nincludes integrated circuits (e.g. ASICs, µ-Controller, memories, voltage regulators, smart power devices, logic devices, analog devices,... )",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q101 Revision E)\nincludes e.g. small signal diodes (bipolar - and Schottky diodes), small signal transistors, MOSFETS, IGBTs, power diodes, …",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q10x"]
[null,null,"  ",null,null,null,{"$f":"Guidance!A9","v":"Form provided by ZVEI -  Revision 5.0  -  December 2021"},null,"Evaluation level\n A / B / C","Further applicable conditions",null,"AEC-Q100 Revision H","Check of specification \n(for raw material only)","Temperature Humidity Bias or biased HAST","Autoclave or Unbiased HAST","Temperature Cycling","Power Temperature Cycling","High Temperature Storage Life","High Temperature Operating Life","Early Life Failure Rate","NVM Endurance, Data Retention, and Operational Life","Wire Bond Shear","Wire Bond Pull","Solderability","Physical Dimensions","Solder Ball Shear","Lead Integrity","Electromigration","Time Depending Dielectric Breakdown","Hot Carrier Injection","Negative Bias Temperature Instability","Stress Migration","Electronic Discharge\nHuman Body Model ","Electronic Discharge\nCharged Device Model","Latch up","Electrical Distribution","Characterisation","Electromagnetic Compatibility","Short Circuit Characterization","Soft Error Rate","Lead free","Hermetic Package Test","Package Drop","Lid Torque","Die Shear","Internal Water Vapor","AEC-Q101 Revision E","Check of specification \n(for raw material only)","Highly Accelerated Stress Test\nHigh Humidity High Temp. Reverse Bias\nHigh Temperature High Humidity Bias","Unbiased Highly Accelerated Stress Test\nAutoclave","Temperature Cycle","Temperature Cycling Hot Test\nTC Delamination Test\nWire Bond Integrity","Intermittent Operational Life\nPower and Temperature Cycle","High Temperature Reverse Bias\nAC blocking voltage\nSteady State Operational","High Temp. Gate Bias","Destruct. Phy. Analysis","Physical Dimensions","Wire Bond Strength","Wire Bond Shear","Die Shear","Terminal Strength","Resistance to Solvents","Resist. to Solder Heat","Thermal Resistance","Solderability / AEC-Q005","Whisker Growth","Constant Acceleration","Vibration Variable Frequency","Mechanical Shock","Hermeticity","Dielectric Integrity","External Visual","Parametric Verification","ESD Characterization","Unclamp.Induct.Switch","Short Circuit Reliability Characterization","Notes / Remarks","Whisker test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution",null,"Remarks"]
[null,null,null,"Assessment of impact regarding following aspects\n  - contractual agreements\n  - technical interface of handling/processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Potential impact?",null,"Understanding of semiconductors experts ","Examples to explain","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: Not relevant for qualification matrix",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Dielectric Integrity",null,null,null,"Unclamp.Induct.Switch",null,null,null,null,"For Cu Wire Products: Consider AEC-Q006"]
[null,null,"ID","Type of change","No","Yes",null,null,null,null,null,null,null,"THB","AC","TC","PTC","HTSL","HTOL","ELFR","EDR","WBS","WBP","SD","PD","SBS","LI","EM","TDDB","HCI","NBTI","SM","HBM","CDM","LU","ED","CHAR","EMC","SC","SER","LF","MECH","DROP","LT","DS","IWV",null,null,"HAST\nH3TRB\nHTHHB","UHAST \nAC","TC","TC Hot\nTC Delam\nWBI","IOL\nPTC","HTRB\nACBV\nSSOP","HTGB","DPA","PD","WBS","BS","DS","TS","RTS","RSH","TR","SD","WG","CA","VVF","MS","HER","DI","EV","PV","ESD","UIS","SCR"]
[null,"Headings",null,"ANY",null,null,null,null,null,null,null,null,null,"A2","A3","A4","A5","A6","B1","B2","B3","C1","C2","C3","C4","C5","C6","D1","D2","D3","D4","D5","E2","E3","E4","E5","E7","E9","E10","E11","E12","G1-4","G5","G6","G7","G8",null,null,"A2/alt \n(9/alt/a)","A3/alt\n(8/alt)","A4\n(7)","A4/a/alt\n(7ab)","A5/alt\n(10/alt)","B1/a/b\n(5/ac)","B2\n(6)","C1\n(12)","C2\n(13)","C3\n(23)","C4\n(24)","C5\n(25)","C6\n(14)","C7\n(15)","C8\n(20)","C9\n(22)","C10\n(21)","C11\n(-)","C12\n(16)","C13\n(17)","C14\n(18)","C15\n(19)","D1\n(27)","E0\n(3)","E2\n(4)","E3/E4\n(11)","E5\n(26)","E6\n(28)"]
[null,null,"SEM-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.",null,"*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-AN-02","Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below.","P","P","Any change which is not covered in the matrix below, but risk assessment at customer is recommended.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DATA SHEET"]
[null,null,"SEM-DS-01","Change of data sheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update of data sheet because of technical change of the product.","e.g. recommendations for pull-up/pull-down or NC pins, MSL","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!","e.g. Errata","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. No technical change of the product.\n(I): Definition of new parameter which was not documented before.\n(P): Not known as single change. Only in combination with other changes. ","(I): e.g. adding new tested parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DESIGN"]
[null,null,"SEM-DE-01","Design changes in active elements. 1)","P","P","Any device relevant changes in design / layout of elements with effect on specified electrical behavior.\n1) Not included: \nModification to adjust product parameter within specified process window and design rules.","e.g. change of ESD structure\ne.g. add / remove a transistor in layout ","A","Please check if data sheet is affected (SEM-DS-01).","-","●","-","-","●","●","M","-","●","●","D,J","-","-","-","-","-","-","D","D","D","D","D","●","●","●","●","●","●","●","●","-","-","F","-","-","-","●","-","-","-",3,"-","●","●","●",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","E","M","●","-","-","●","-"]
[null,null,"SEM-DE-02","Design changes in routing . 2)","P","P","Any change of wiring between elements in chip design / layout with effect on specified electrical behavior.\n2) Not included: \nModification to adjust product parameter within specified design rules.","e.g. mask changes in metal fix for corrective action (based on external 8D report)\ne.g. Connecting / disconnecting an already existing transistor through routing","C","A: Impact on EMC behavior cannot be evaluated / excluded on component level.\nA: If impact on electrical function is not excluded on component level.\nPlease check if data sheet is affected (SEM-DS-01).","-","●","-","-","-","A","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","-","-","-","-","-","-","-","●","-","-","-",3,"-","●","●","●",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","E","M","●","-","-","●","-"]
[null,null,"SEM-DE-03","Die shrink 3)","P","P","Shrink of active area.\n3) Not included: sawing street/kerf/scribe line","Typical shrink of die.","A","Please check if change in process technology (SEM-PW-09) is also affected.","-","●","-","●","●","-","M","-","●","●","D,J","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","●","-","-","-","●","-","●","●","-","●","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","●","E","M","●","F","-","●","●"]
[null,null,"SEM-DE-04","Firmware modification","I","P","Integrated software by design or memory as defined by supplier.\n(I): Firmware modification or update without effect of functional performance at the customer (bug fix).\n(P): Firmware modification or update with effect of functional performance at the customer.","(I): e.g. addition of Firmware opportunities\n(P): e.g. bug fix with impact on functional performance","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"PROCESS - WAFER PRODUCTION"]
[null,null,"SEM-PW-01","New / change of wafer substrate material","P","P","New wafer material.","e.g. different wafer material to currently released material (like change from EPI material into non-EPI material)","C",null,"-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","-","9, M","-","R","-","●","●","Qualification effort acc. AEC-Q100: see diffusion/doping"]
[null,null,"SEM-PW-02","New wafer diameter","P","P","Change of wafer diameter resulting in equipment and process changes.",null,"C","Impact on changes in SEM-PW-09 and/or SEM-EQ-01.","●","●","-","-","-","E","M","-","●","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","AEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,"X","SEM-PW-03","New final wafer thickness","P","P","Change in final wafer thickness. ","e.g. change in final chip/die thickness ","C","A: If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)\nA: If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.","-","●","-","-","-","E","M","-","●","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","●","●","●","●","-","●","-","●","●","-","-","-","X","●","-","-","-","-","-","-","-","-","●","-","-","-","F","-","●","●"]
[null,null,"SEM-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.",null,"A",null,"-","●","-","-","-","-","M","-","●","#","-","-","-","-","-","-","-","-","-","@●","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-",6,6,"-","-","-","5,6,0","●",6,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","M","-","P, R","-","●","-"]
[null,null,"SEM-PW-05","Change of gate material / dielectrics","P","P","Change of gate material (incl. Poly silicon gate electrodes) and / or gate dielectric material or process",null,"A",null,"-","●","-","-","-","●","M","-","●","@N","D,J","-","-","-","-","-","-","-","@●","@●","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","●","-","-","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","E","M","●","P","-","●","-"]
[null,null,"SEM-PW-06","New / change of backside operation (grinding / metallization) ","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions necessary.\nAlternative see SEM-PW-09","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","C","A: If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)\nA: If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.","-","●","-","-","-","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","M","M","●","-","●","-","-","-","-","H","-","-","H","-","●","-","●","Z","●","-","●","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","AEQ-Q100: Applicable to all smart power devices"]
[null,null,"SEM-PW-07","New / change of metallization / vias / contacts","P","P","Change in metallization of bondpads, material, layer thickness specifically for chip frontside and internal layers.","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metallization","C",null,"-","●","-","●","●","●","M","-","●","-","-","●","●","-","-","-","-","●","-","-","-","●","-","-","-","●","●","-","●","-","-","-","-","-","-","-","●","-","●","●","●","●","●",8,"-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","●","E","-","●","-","-","●","●"]
[null,null,"SEM-PW-08","New / change of passivation or die coating (without bare die)","P","P","Change of top layer on die (between mold compound and die). ","e. g. addition of polyimide","C","Change of intrinsic mechanical stress might influence electrical function.","-","●","-","●","●","●","M","-","●","#","D,J","●","●","-","-","-","-","-","-","-","-","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-","●","●","●","-","●","●","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","●","●"]
[null,null,"SEM-PW-09","Change in process technology not covered by any other type of change","--","P","(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(--): e.g. change from wet to dry etching, \ne. g. change from horizontal to vertical oven for oxidation\n(P): e.g. change of layer thickness","A","Please also check changes described under EQUIPMENT.\nPlease check if change is described by specific type of change in this matrix.","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","Qualification effort depends on type of change."]
[null,null,"SEM-PW-10","Process integrity: tuning within process specification","--","P","Variation within process specification\n(--):  If tuning within process specification does not influence the integrity of the final product.\n(P): If remaining risk on product specification is anticipated.","(--): e.g. process control","C","Please check if DATA SHEET is affected. \nPlease check if SEM-PW-09 is affected.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"SEM-PW-11","Change of wafer supplier.","--","P","(--): If no remaining risk in supply chain exist\n(P): If the change of wafer supplier can  influence the integrity of the final product.","(--): e.g. change of wafer supplier with same material composition.\ne.g. same material composition and does not influence electrical behavior.\n(P): e.g. new supplier with impact on substrate material and / or electrical behavior. ","C","Not on component, tested on test structure (typical for IC).\nInteraction on component level for discrete components expected.\nIn case of SOI substrate HF properties have to be qualified. \nPlease check if SEM-PW-01 and SEM-DS-01 is affected.","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","-","9, M","-","R","-","●","-","Qualification for IC & µ-Controller difficult on product level. Characterisation on wafer level only on test structure.\nSupplier should perform a risk assessment if there is a technology dependend risk requiring additional qualification effort.\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 ofQ100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PW-12","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Impact is to be assessed.\n","(--): e.g. change of cleaning process in wafer production\n(P): e.g. additional sinker implantation after standard implantation (to protect circuit against interference impulses). ","C","Please check also changes described under EQUIPMENT.\n\nA: If impact on application cannot be evaluted on component level","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PW-13","Move all or parts of production to a different wafer fab site.","P","P","Wafer fab transition with additional changes (described above).\nIncludes transfer as well as additional site.","e.g. dual source / fab strategy","A","Check if any other type of process change is applicable due to the transfer","●","●","-","●","●","●","M","-","●","●","J","●","●","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","H","-","-","H","-","●","-","●","●","●","●","●","●","●","●","-","●","●","●","-","-","-","●","-","-","-","-","-","-","●","-","●","E","M","-","A,I,P,R,S","-","●","●","AEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PW-14","Lithography","--","P","Change in process technique for lithographic process and material\n(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(--): e.g. exchange of defect mask\n(P): e.g. change from E-beam process to X-ray process\ne.g. change from contact into projection mode","C","Please also check changes described under EQUIPMENT.","-","●","-","●","-","●","M","-","●","#","-","●","●","-","-","-","-","-","-","-","●","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","6, 7","-","-","-","-",4,4,"-","-",1,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","P","-","●","-"]
[null,null,"SEM-PW-15","Oxide / Interlayer Dielectric (excl. gate oxide)","--","P","Change in process technique for oxide (excl. gate oxide) / interlayer dielectric process\n(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.",null,"C","Please also check changes described under EQUIPMENT.","-","●","-","-","-","●","M","-","●","#,N","D,J","-","●","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-",6,6,7,"-","●","-","●",6,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","E","-","-","-","-","●","-"]
[null,"Headings",null,"BARE DIE (Wafer process changes not covered in this section shall be handled according to section \"PROCESS - WAFER PRODUCTION\")"]
[null,null,"SEM-BD-01","New final wafer thickness","P","P","Change in final wafer thickness. ","Change in final chip/die thickness ","A",null,"-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","ELFR can only be performed on packaged test vehicles.\nNBTI was removed in deviation from the AEC-Q100 Matrix because there it is a combined type of change (Wafer Dimension/Thickness). NBTI is applicable for wafer dimension change only."]
[null,null,"SEM-BD-02","Change of top metallization or bond pad stack","P","P","Change in bondpads (incl. stack below), material, pad pitch, surface changes, layer thickness","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metalization","B",null,"-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-",8,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","E","-","●","-","-","-","-"]
[null,null,"SEM-BD-03","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions.","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","A",null,"-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","M","M","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-"]
[null,null,"SEM-BD-04","Change of wafer setup or number of possible good dies on wafer.","I","P","Needed information for pick & place machine.\n(I): amount of possible good dies on wafer\n(P): influence on wafer setup and wafer mapping","(I): e.g. change from 350 to 240 good dies on wafer\n(P): e.g. information change for pick & place machine.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-BD-05","Change of optical appearance of wafer edge region (like imide coverage or edge exclusion)","I","P","Selection of dies in wafer edge region which have full electrical functionality. \n(I): in case of wafer edge is affected only\n(P): in case of single die is affected","(I): e.g. appearance of wafer edge (rounded instead of square)\n(P): e.g. polyimide as new coating on die","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"SEM-BD-06","Die scribe or separation","I","P","Needed information for sawing and pick & place machine.\n(I): If the change in sawing process does not influence the integrity of the final product.\n(P): in case if product is delivered on wafer","(I): e.g. if product is delivered as known good die (in tape and reel)\n(P): e.g. information change for pick & place machine.\ne.g. information change for sawing machine.","B","Please check if SEM-BD-04 is affected.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-"]
[null,null,"SEM-BD-07","Die Preparation / Clean","--","P","Change in process technique for die preparation / cleaning\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of cleaning time.\n(P): e.g. change in cleaning procedure after change of sawing equipment.","B","Please check if SEM-BD-06 is affected.","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-"]
[null,null,"SEM-BD-08","New / change of passivation or die coating ","P","P","Change of top layer on die.","e.g. addition of polyimide\ne.g. change of polyimide thickness","B",null,"-","-","-","-","-","-","-","-","●","#,N","D,J","-","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","●","-"]
[null,"Headings",null,"PROCESS - ASSEMBLY"]
[null,null,"SEM-PA-01","Change in critical dimensions of package","P","P","Change in dimensions of existing package.","e. g. changes in package dimensions (further development).","B",null,"-","●","-","●","●","●","M","●","●","●","-","●","●","●","●","T","●","-","-","-","-","-","●","●","-","●","-","-","●","-","L","H","-","-","H","H","●","-","●","●","●","●","●","●","●","●","●","-","-","●","●","B","●","●","●","L","H","H","H","H","●","●","●","●","-","●","-","-","-","-"]
[null,null,"SEM-PA-02","Change of leadframe base material","P","P","New leadframe material in new composition.","e. g. change from alloy42 to copper\ne. g. change between two different copper alloys","B",null,"-","●","●","-","●","●","M","●","-","-","-","-","●","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","L","H","-","-","H","-","●","●","●","●","●","●","●","-","-","-","●",2,"-","●","●","-","●","●","●","L","-","-","-","H","-","●","-","-","-","●","A,F,X","●","-","●"]
[null,null,"SEM-PA-03","Change in leadframe dimensions","P","P","Change in leadframe dimensions which has impact to the specified electrical parameter acc. data sheet or specification (e.g. heat sink, pin dimensions, die paddle size, ...)\nNot included: Variation within specification.","e. g. change in lead frame geometry","B","ESD investigations are only necessary if internal ground and power supply connection of leadframe is affected.\nA: If impact on EMC behavior cannot be evaluated / excluded on component level.\n","-","●","-","-","●","●","M","-","-","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","L","H","-","-","-","-","●","-","●","-","●","-","●","-","-","-","●","-","-","●","-","-","-","●","-","L","-","-","-","H","-","-","-","-","-","●","-","-","-","●"]
[null,null,"SEM-PA-04","Change of lead frame finishing material / area (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e. g. change from Ag flash to NiP protection layer\ne. g. change from Ag spot to Au spot\ne. g. increase of silver plating area","C",null,"-","●","●","●","●","●","M","●","-","-","-","-","C","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","L","H","-","-","H","-","●","●","C","C","C","-","-","-","-","-","D","C","2,C","-","-","D","-","D","-","L","-","-","-","H","-","D","-","-","C","-","-","-","-","●","For wire bond strengh test: Pre- & Post-process change comparison to evaluate\nprocess change robustness (AEC-Q101)."]
[null,null,"SEM-PA-05","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and / or process resulting in a new technology (e.g. pure tin).","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness \ne.g. change of external bumps of a BGA\ne.g. Change of external pins of a hermetic package","B",null,"-","●","●","●","●","●","M","●","-","-","-","-","C","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","L","H","-","-","H","-","-","●","-","-","-","-","-","-","-","-","●","-","-","-","-","●","-","-","●","L","-","-","-","H","-","●","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-06","Bump Material / Metal System (internal)","P","P","Stack die or die to substrate (flip chip)","e. g. change to Pb-free material\ne. g. change of copper pillars","C","B: If chip-board-package interaction cannot be evaluated by component manufacturer","-","●","●","●","●","●","M","●","●","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●","L","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-07","Die attach material","P","P","Change of die attach material and / or process  resulting in a new technology (e.g. soft solder, epoxy, etc.) ",null,"C","A: If impact on EMC behavior cannot be evaluated / excluded on component level (if die attach has impact on electrical conductivity).","-","●","●","●","●","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","●","-","L","H","-","-","H","H","●","●","●","●","●","-","●","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","H","-","-","●","-","-","●","A,X","-","●","●"]
[null,null,"SEM-PA-08","Change of wire bonding\n","P","P","Material, diameter, change in bonding diagram and / or change in process resulting in a new technology.","e.g. change from Au to Cu material\ne.g. change from 25µm to 23µm diameter\ne.g. change from single to double bond\ne.g. change from stich bond to stich on ball bond.","C","A: In case of bond diagram change and EMC cannot be evaluated on component level.\n\nPlease also check changes described under \nSEM-EQ-01.","●","●","●","●","●","●","Q","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","●","-","-","H","-","-","-","-","●","●","●","-","●","●","●","-","-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","●","-","-","●","-","-","●","●","Parameter Analysis: Strictly required only for Power devices.\nIn general: Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended.\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null," ","SEM-PA-09","Substrate / Interposer","P","P","Change of BGA substrate","e.g. changes in routing ","B","A: Impact on EMC behavior cannot be evaluated / excluded on component level.\nA: If impact on electrical function is not excluded on component level.","-","●","●","●","●","●","M","●","●","-","-","●","●","-","-","T","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","L","H","-","-","H","H","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
[null,null,"SEM-PA-10","Die Overcoat / Underfill","--","P","Supporting layers for complex packages like flip chip and / or change in process resulting in a new technology.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of dispensing speed\n(P): e.g. change of underfill material ","C",null,"-","●","●","●","●","●","M","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","H","-","-","●","●","●","-","●","●","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","H","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-11","Change of mold compound / encapsulation material","P","P","Change of mold compound / encapsulation material.","e.g. change to green mold compound\ne.g. change of filler particles","C","B: impact on thermo-mechanical stress caused by mismatch of mold compound, interconnecting technology and carrier is  anticipated (specific for Power Devices). \nB: for wave soldered devices \nA: in case of high frequency signals (> 3GHz) it should be assessed if possible changes in permeability of mold compound could affect signal behavior (e.g. digital signal processor).","-","●","●","●","●","●","M","●","●","●","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","L","-","-","-","-","-","●","●","●","●","●","●","●","●","●","●","●","-","-","-","-","B","●","●","●","-","-","-","-","H","●","●","●","-","-","-","A,F,#","-","-","●"]
[null,null,"SEM-PA-12","Change of hermetic sealing","P","P","Affected areas are material and process of hermetic (e.g. ceramic ) packages, capped die and sealed devices (e.g. pressure sensors) ","e.g. change of sealing material for RoHS","B","A: impact on EMC behavior cannot be evaluated / excluded on component level (if encapsulation / sealing has impact on electrical conductivity).","-","●","●","-","●","●","-","●","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","-","●","●","●","H","H","H","-","-","-","-","H","-","-","-","-","H","-","H","-","-","-","H","H","H","H","-","H","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-13","Change of product marking","I","P","Change of marking on device and / or change in process resulting in a new technology..\n(I): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(I): e.g. change of appearance (additional marking)\n(P): e.g. change from inked marking to laser marking\ne.g. marking of pin 1","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-14","Change in process technology\n(e.g. trim and form, leadframe preparation …)","--","P","(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(P): e.g. change from punched to sawn QFN","B","Please also check changes described under \nSEM-EQ-01.\nPlease check if change is described by specific type of change in this matrix.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-15","Process integrity: tuning within process specification","--","P","Variation within process specification\n(--): If tuning within process specification does not influence the integrity of the final product.\n(P): If impact on product specification is anticipated.","(--): e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-16","Change of direct material supplier","--","P","Change of suppliers for direct materials which are used in assembly process (BOM).\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of wire material supplier.\n(P): e.g. change to new mold compound supplier\ne.g. additional leadframe supplier with specific leadframe manufacturing technology\ne.g. Change of BGA substrate supplier, if impact on board level reliablity cannot be excluded","C","Please check if material is changed!","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
[null,null,"SEM-PA-17","Change of specified assembly process sequence (deletion and/or additional process step)","--","P","(--): no influence in final product integrity or specified sequence\n(P): influence in final product integrity or specified sequence","(--): e.g. additional cleaning step \ne.g. deletion of optical inspection\n(P): e.g. change lead finishing pre trim & form to post trim & form","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","Qualification depends on specific change."]
[null,null,"SEM-PA-18"," Move all or parts of production to a different assembly site.","P","P","Assembly transfer or relocation.\n Includes transfer as well as additional site.","e.g. dual source / fab strategy","C","A or B: impact on other type of changes described under PROCESS  ASSEMBLY and SEM-EQ-01.\n\nCheck if any other type of process change is applicable due to the transfer","●","●","-","●","●","●","M","-","●","●","-","●","●","●","●","T","●","-","-","-","-","-","-","-","-","●","-","-","-","-","L","H","-","-","H","H","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","●","●","-","●","L","-","-","H","H","-","●","●","-","-","-","A,I,S,X,#","●","●","●","Whisker tests have to be done on monitoring basis!\n\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PA-19","Die scribe or separation","--","P","Separation process from single wafer to dies. \n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of kerf width\n(P): e.g. change from sawing to laser cut","C",null,"-","●","-","●","●","●","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-20","Die Preparation / Clean","--","P","Change in process technique for die preparation / cleaning\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of cleaning time.","C",null,"-","●","-","●","●","-","M","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","H","-","●","-","●","●","●","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","X","-","-","-"]
[null,null,"SEM-PA-21","Molding / Encapsulation process","--","P","Change in process technique for molding / encapsulation.\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. tuning within process specification","C",null,"-","●","-","●","●","●","M","●","●","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","L","-","-","-","-","-","●","-","●","●","●","●","●","●","●","●","●","-","-","-","-","B","●","-","●","L","-","-","-","H","-","●","-","-","-","-","A,#","-","-","-"]
[null,"Headings",null,"PACKING/SHIPPING"]
[null,null,"SEM-PS-01","Packing/shipping specification change","P","P","Packing/shipping specification change.",null," *",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-02","Dry pack requirements change ","I","P","(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","(I): MSL 3 → MSL 1\n(P): MSL 1  → MSL 3","B","Please check if data sheet is affected (SEM-DS-01 or SEM-DS-02).","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-03","Change of carrier (tray, reel)","P","P","Change of carrier (tray, reel)",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-04","Change of labelling","I","P","Change of labelling also on reel.\n(I): Change of material label without impact on barcode.\n(P): Changes of material label information which affects data processing at customer.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of defined nomenclature for data processing","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"EQUIPMENT"]
[null,null,"SEM-EQ-01","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique.","Change from single wafer to batch process (e.g. over pad metalization)\ne.g. dambar cutting (mechanical to laser cutting)","A","Check which other type of change is applicaple due to this equipment change.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. extension of existing equipment pool\n(P): e.g. extension of dedicated equipment in case basic technology still need to be proven","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-EQ-03","Change in final test equipment type leading to a different test concept.","P","P","Change of tester platform with differences in HW or SW that makes a change in test concept necessary (only in case of bare die: final test means wafer test).",null,"C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","Gage R&R / delta correlation"]
[null,"Headings",null,"TEST FLOW"]
[null,null,"SEM-TF-01","Move of all or part of electrical wafer test and/or final test to a different test site.","P","P","Tester transfer or relocation. \nCheck impact on SEM-AN-01\n Includes transfer as well as additional site.","Dual source strategy","C","Check if any other type of process change is applicable due to the transfer","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","Gage R&R / delta correlation"]
[null,"Headings",null,"Q-GATE"]
[null,null,"SEM-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. test implemented without customer requirement\n(P): e.g. reduction from three temperature measurements to two temperature measurements\ne.g. change in burn in / run in process.","C",null,"●","-","-","-","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","Parameter Analysis: Delta correlation\n\n* For \"burn in\" changes ELFR recommended \n\nIn case of introduction of new test flow steps consider assessment of influence on product reliability."]
[]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,"C",null,"-","●","-","-","-","E","M","-","●","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","●","●","●","●","-","●","-","●","●","-","-","-","X","●","-","-","-","-","-","-","-","-","●","-","-","-","F","-","●","●",null,"-"]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,"-","●","-","-","-","E","-","-","●","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","●","●","●","●","-","●","-","●","●","-","-","-","X","●","-","-","-","-","-","-","-","-","●","-","-","-","F","-","●","●",null,"-"]
[]
[null,null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) ",null,null,null,null,null,null,null,null,null,null,null,"X",null,null,"X","G",null,null,null,null,null,null,null,null,null,null,"G",null,null,null,"X","G",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"X"]
[]
[null,null,null,"Reason for exception of tests and/or usage of generic data: "]
[null,null,null,"WBS & WBP - Not applicable as LTC3313 is not a wire bonded part.\nHBM, CDM - Not performed. For the die thickness change from 450um to 200um, expect same ESD performance, if not better."]
[]
[]
[]
[]
[null,null,"--","Not required."]
[null,null,"I","Information Note required."]
[null,null,"P","PCN required."]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," "]
[]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the \nappropriate process change.\nA @ recommended additionally by ZVEI "]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Only for peripheral routing"]
[null,null,"B","For symbol rework, new cure time, temp"]
[null,null,"C","If bond to leadfinger"]
[null,null,"D","Design rule change"]
[null,null,"E","Thickness only"]
[null,null,"F","MEMS element only"]
[null,null,"H","Hermetic only"]
[null,null,"J","EPROM or EEPROM"]
[null,null,"L","Lead free"]
[null,null,"M","For devices requiring PTC","x"]
[null,null,"N","Passivation and gate oxide"]
[null,null,"P","Passivation and interlevel dielectric"]
[null,null,"Q","Wire diameter decrease"]
[null,null,"T","Only for Solder Ball SMD"]
[null,null,"#","Only from non-100% burned-in parts"]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Acoustic Microscopy"]
[null,null,"B","If not laser etched",null,null,null,null,null," "]
[null,null,"C","Only for Leadframe Plating change"]
[null,null,"D","Only for Lead Finish change"]
[null,null,"E","If Applicable"]
[null,null,"F","Finite Element Analysis"]
[null,null,"G","Generic Data available"]
[null,null,"H","Hermetic device only"]
[null,null,"I","Infant Mortality Rate"]
[null,null,"L","Lead free"," "]
[null,null,"M","Power MOS/IGBT devices only"]
[null,null,"P","CV Plot (MOS only)"]
[null,null,"R","Spreading Resistance Profile"]
[null,null,"S","Steady State Mortality Rate"]
[null,null,"X","X-Ray"]
[null,null,"Z","For backside operation changes"]
[null,null,1,"If bond pads are affected"]
[null,null,2,"Verify #2 (package) post"]
[null,null,3,"Only for changes at the periphery"]
[null,null,4,"Only for oxide etches or etches prior to oxidation"]
[null,null,5,"For source or channel region changes"]
[null,null,6,"For field termination changes"]
[null,null,7,"For passivation changes"]
[null,null,8,"For contact changes"]
[null,null,9,"For epitaxial changes"]
[null,null,0,"Required for Schottky barrier changes."]
[null,null,"#","Glass Transition Temperature"," "]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[]
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[]
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[]
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[]
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[]
["Worked on:\n (Name, Function)",null,null,"Max Mustermann"]
["Signature:"]
["Date:",null,null,null,null,null,null,null,null,null,"Line evaluation\n(can be evaluated by data or audit/on site check)","Device evaluation"]
["PCN number:",null,null,null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCEE TEST RESULTS (on the basis of AEC-Q102 Revision A - April 6, 2020)"]
[null,null,null,null,null,null,{"$f":"Guidance!A9","v":"Form provided by ZVEI -  Revision 5.0  -  December 2021"},null,"Evaluation level\n A / B / C",null,null,"AEC-Q102 Revision A","Check of specification \n(for raw material only)","Wet High Temperature Operating Life","High Humidity High Temperature Reverse Bias","Power Temperature Cycling","Intermittent Operating Life","Temperature Cycling","High Temperature Operating Life","High Temperature Reverse  Bias","Low Temperature Operating Life","Pulsed Life","Physical Dimensions","Wire Bond Pull","Wire Bond Shear","Die Shear","Terminal Strength","Dew","Resistance to Solder Heat","Thermal Resistance","Solderability","Whisker Growth","Hydrogen Sulphide","Flowing Mixed Gas","Board Flex","ESD Characterization- Human Body Model","ESD Characterization- CDM ","Constant Acceleraton","Vibration Variable Frequency","Mechanical Shock","Hermiticity","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution","Remarks"]
[null,null,null,"Assessment of impact regarding following aspects\n  - contractual agreements\n  - technical interface of handling/processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Potential impact?",null,"Understanding of semiconductors experts ","Examples to explain","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: Not relevant for qualification matrix","Further applicable conditions",null,null,null,null,null,null,"Intermittent Operating Life",null,"High Temperature Operating Life","High Temperature Reverse  Bias","Low Temperature Operating Life","Pulse Life Test","Physical Dimensions","Wire Bond Pull","Wire Bond Shear","Die Shear","Terminal Strength","Dew Test","Resistance to Solder Heat","Thermal Resistance","Solderability","Whisker Grows","Hydrogen Sulphide","Flow Mixed Gas","Board flex","ESD Characterization- Human Body Model","ESD Characterization- CDM ","Constant Acceleraton","Vibration Variable Frequency","Mechanical Shock","Hermiticity"]
["Selection of\n component",null,"ID","Type of change","No","Yes",null,null,null,null,null,null,null,"WHTOL","H3TRB","PTC","IOL","TC","HTOL","HTRB","LTOL","PLT","PD","WBP","BS","DS","TS","DEW","RSH(-wave)","TR","SD","WG","H2S","FMG","BF","ESD-HBM","ESD-CDM","CA","VVF","MS","HER"]
["LED","Headings",null,"LIGHT EMITTING DIODE (LED)"]
["LED","Headings",null,"ANY"]
["LED",null,"OEC-LED-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change i applicable but the change affects agreed technical contractual agreements.",null,"*",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-AN-02","Any change with impact on technical interface or processability/manufacturability of customer, which is not covered in the matrix below","P","P","See processability on board level\ntechnical interface means component terminals",null,"B","Check if OEC-LED-DS-01 is affected\nProcessability should be assessed.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","S,T","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED","Headings",null,"DATA SHEET"]
["LED",null,"OEC-LED-DS-01","Change of data sheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification ","P","P","Change of application relevant information (e.g. maximum pulse current)  due to a technical product or process change.","e.g. change of die substrate material.\ne.g. change of MSL\n","A",null,"-","●","-","E,@S","-","@S","-","E,@S","E","-","-","E","-","-","-","-","-","-","S","E","-","-","-","-","-","E","E","-","-","-","-","E"]
["LED"," ","OEC-LED-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test. New description of behaviorwhich was not specified before or whichis different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required","e.g. Errata\ne.g. change of typ. values due to new information about component behavior \ne.g. improved statistics.\ne.g. reduction of max. allowed forward voltage due to improved statistics.","A",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-DS-03","Specification of additional parameters ","I","P","I: Definition of an additional parameter which was not specified before \nP: If there is a risk on supply chain where at least one additional other PCN-relevant change category will apply.","I: e.g.: adding new tested parameter\nI: e.g.: additional temperature coefficient parameter","A",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Formalism since this is not a product change, ony addtional information\nClassification: C"]
["LED","Headings",null,"DESIGN"]
["LED",null,"OEC-LED-DE-01","Design changes in epitaxy.","P","P","Any device relevant changes in design / layout of epitaxial layers\nNot included:  Changes within design rules and design specification without affecting specified functions, parameters and reliability.","e.g. change of barrier thickness\n","C","A: change from Double hetero to Quantum wells --> OEC-LED-DS-01 (spectrum is affected)","-","●","-","●","-","●","-","-","●","-","-","●","-","-","-","-","-","H","-","-","-","-","-","-","-","●","●","-","-","-","-","●"]
["LED",null,"OEC-LED-DE-02","Design changes in routing/layout.","P","P","Any change in chip design / layout. Provide information if design/layout change is optical or electrical.\nNot included:  Changes within design rules and design specification without affecting specified functions, parameters and reliability.","e.g. reduction of bond pad size\ne.g. number / arrangement of micro prisms / via holes\n"," C","A: change in layout of current spreader --> OEC-LED-DS-01 (radiation pattern changes)\nA: change in Ag mirror --> OEC-LED-DS-01 (Popt, radiation pattern changes)\n","-","●","-","●","-","●","-","●","●","-","-","●","-","B","B","D,M","-","M","●","-","-","-","M","M","●","-","-","-","-","-","-","●","TR might be considered for complex die bond technologies"]
["LED",null,"OEC-LED-DE-03","Die shrink ","P","P","Shrink of active area.\nNot included: sawing street/kerf/scribe line","Typical shrink of die.","A","Please check if change in process technology (OEC-LED-PW-08) is also affected.","-","●","-","●","-","●","-","●","●","-","-","●","-","B","B","●","-","-","●","●","-","-","-","-","-","●","●","-","-","-","-","●"]
["LED",null,"OEC-LED-DE-04","LED package (except leadframe)","P","P","any change in housing thickness\nany change in form or dimensions","e.g. change of dimensions\ne.g. change of x, y, or z dimension of the package","B","Check if OEC-LED-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","-","●","-","●","-","●","●","-","-","-","●","B","B","D","-","D","●","L","T","-","D","D","●","-","-",5,5,5,4,"●"]
["LED",null,"OEC-LED-DE-05","Design of leadframe ","P","P","any change of leadframe / submount dimensions\nany change of outer dimensions","e.g. change in leadframe / submount dimensions in x,y, or z direction\ne.g. change in wirebond looping\ne.g. change inner design of the leadfeame not affecting the e/o performance & reliability of the device","B","Check if OEC-LED-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\n\nA: In case looping of wirebond is affected.","-","●","●","●","-","●","-","●","●","-","-","-","●","B","B","D","-","-","●","●","T",2,"-","-","●","●","●",5,5,5,4,"●"]
["LED","Headings",null,"PROCESS - WAFER PRODUCTION"]
["LED",null,"OEC-LED-PW-01","New / change of wafer substrate or carrier material","P","P","New wafer substrate material.","e.g. different wafer material to currently released material (change from Sapphire to Silicon)","C","Check if OEC-LED-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","●","P","-","●","-","P","●","-","-","●","-","-","-","●","-","P","●","●","-","-","P","P","P","P","P","-","-","-","-","●"]
["LED",null,"OEC-LED-PW-02","Wafer diameter","P","P","change of wafer diameter resulting in equipment and process changes","e.g. 4\" to 6\"","C","Typically this type of change affects other changes i.e equipment/process technology - they need to be identified in addition","●","●","●","●","-","-","-","-","●","-","-","●","-","-","-","-","-","-","●","●","-",null,"-","-","-","P","P","-","-","-","-","●"]
["LED",null,"OEC-LED-PW-03","New final wafer thickness","P","P","Change in final wafer thickness","e.g. change in final chip/die thickness ","C","Check if OEC-LED-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","-","P","-","●","-","●","●","-","-","●","-","B","B","●","-","-","-","●","-","-","-","-","●","P","P","-","-","-","-","●"]
["LED",null,"OEC-LED-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.","e.g. change from Be to C as dopant","C",null,"-","●","C","C","-","C","-","-","●","-","-","●","-","-","-","-","-","-","-","●","-","-","-","-","-","●","●","-","-","-","-","●"]
["LED",null,"OEC-LED-PW-05","Change of stacking","P","P","change in layer sequence or thickness","e.g. change of isolation layer thickness between n- and p-material ","A","customer application needs to be checked due to potential system voltage differences","-","●","-","●","-","●","-","F","●","-","-","●","-","-","-","-","-","F","-","-","-","-","-","-","-","●","●","-","-","-","-","●"]
["LED",null,"OEC-LED-PW-06","New / change of metallization (specifically chip frontside)","P","P","Change in metallization of bondpads, material, layer thickness","e.g. change in bond pad metallization thickness","C","A: In case of change to Aluminium metallization","-","●","M","●","-","●","-","●","●","-","-","●","-","●","●","-","-","M","-","-","-","-","M","M",null,"M,B","M,B",null,"-","-",null,"●"]
["LED",null,"OEC-LED-PW-07","New / change of metallization (specifically chip backside)","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions necessary.","e.g. change from Au to Au/Ge","C",null,"-","●","M","●","-","●","-","●","●","-","-","●","-","-","-","●","-","D,M","●","D,M","-","-","D,M","D,M","D,M","D,M","D,M","-","-","-","-","●"]
["LED",null,"OEC-LED-PW-08","Change in process technique (e.g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)","--","P","Change from wet to dry etching, change from horizontal to vertical oven for oxidation, change from contact litho into stepper litho, …","e.g. change from wet etch to dry etch\ne.g. change from laser cutting (sawing) to plasma cutting (sawing)\ne.g. change from contact litho to stepper litho","C","B: change from CVD dep to sputter dep for backside/frontside metallization. \nIn case of new equipment please check if OEC-LED-PA-14 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED",null,"OEC-LED-PW-09","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-PW-10","Change of material supplier with no impact on agreed specifications","--","P","Change of wafer supplier. Change of supplier for chemicals needed for wafer production.","P: e.g. change of wafer supplier.","C","Change of wafer supplier please check if OEC-LED-PW-01 is affected. ","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED",null,"OEC-LED-PW-11","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Risk is to be assessed.","e.g. additional cleaning process in wafer production","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change.\nPPAP has to be updated."]
["LED",null,"OEC-LED-PW-12","Change in die coating or passivaton","P","P","Change in material, thickness, and process for coating and passivation","e.g. change from SiO2 to SiN3","C",null,"-","●","P","●","-","P","-","●","●","-","-","-","-","P","P","-","-","P","-","-","-","-","P","P","P,@● ","P","P","-","-","-","-","●"]
["LED",null,"OEC-LED-W-13","New wafer production location or transfer of wafer production to a different not previously released location/site/subcontractor ","P","P","New wafer propduction location or transfer of wafer production with possible additional changes.",null,"C","A or B: Impact on other type of changes described under PROCESS - WAFER PRODUCTION and EQUIPMENT categories of this DeQuMa","●","●","-","●","-","-","-","●","●","-","-","●","-","●","●","●","-","-","●","J","-","-","-","-","-","●","●","-","-","-","-","●"]
["LED","Headings",null,"BARE DIE DELIVERIES (Wafer process changes not covered in this section shall be handled according to section \"Process - Wafer Production\" )"]
["LED",null,"OEC-LED-BD-01","New / change of front side metallization","P","P","Change in bondpads, material, pad pitch, surface changes, layer thickness","e.g. change from Au to Au alloy\ne.g. change in over pad metalization","B","A: In case of chip-on-board technology","-","-","M","●","-","●","-","●","●","-","-","●","-","●","●","-","-","●","-","●","-","-","●","●","-","M,B","M,B","-","-","-","-","-","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LED",null,"OEC-LED-BD-02","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions.","e.g. change from Au to Au alloy","B","Check if OEC-LED-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\nA: In case of chip-on-board technology","-","-","M","●","-","●","-","●","●","-","-","●","-","-","-","●","-","●","●","●","-","-","●","●","@●","D,M","D,M","-","-","-","-","-","Customer application needs to be checked due to potential system voltage differences\nReasonable package type for reliability testing to be aligned between supplier and customer"]
["LED",null,"OEC-LED-BD-03","Change of wafer setup or number of dies on wafer.","I","P","Needed information for pick & place machine.\nI: only additional number of chips\nP: change in spacing between chips and form of wafer","e.g. information change for pick & place machine.","B","A: In case of chip-on-board technology","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LED",null,"OEC-LED-BD-04","New final wafer thickness","P","P","Changes in final Chip height (including carrier); very rare and usually combined with a material change (change of carrier material)","e.g. change on converter thickness","B","Check if OEC-LED-DS-01 is also affected.\nA: In case of chip-on-board technology","-","-","P","P","-","●","-","●","●","-","-","●","●","B","B","●","-","-","●","●","-","-","-","-","@P","P","P","-","-","-","-","●","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LED",null,"OEC-LED-BD-05","Change in die coating or passivation","P","P","Change in material, thickness, and process for coating and passivation","e.g. change from SiO2 to SiN3","B","Check if OEC-LED-DS-01 is also affected.\nA: In case of chip-on-board technology","-","-","P","●","-","P","-","●","●","-","-","-","-","P","P","-","-","P","●","-","-","-","P","P","@P","P","P","-","-","-","-","●","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LED","Headings",null,"PROCESS - ASSEMBLY"]
["LED",null,"OEC-LED-PA-01","Change of leadframe/submount base material","P","P","New leadframe/submount material (new in composition)","e.g. change from copper alloy to bare copper","B","Check if OEC-LED-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","●","●","-","-","-","●","P","-","-","-","-","●","●","●",3,"A","●","P,1","●","P","A,@●","A,@●","●","-","-","-","-","-","-","-","@● is required for corrosive tests H2S/FMG. AEC Q102 will be updated accordingly at next revision.\nExplanation should be provided in case H2S test is not applicable\nRegarding applicable materials please refer to the Whisker standard."]
["LED",null,"OEC-LED-PA-02","Change of leadframe/submount finishing material (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e.g. change from Ag flash to NiPd protection layer\ne.g. change from Ag spot to Au spot","A",null,"-","●","●","●","-","●","-","●","P","-","-","-","-","●","●","●","-","A","●","P,1","●","-","A,@●","A,@●","@P","-","-","-","-","-","-","-","@● is required for corrosive tests H2S/FMG. AEC Q102 will be updated accordingly at next revision.\nExplanation should be provided in case H2S test is not applicable\n"]
["LED",null,"OEC-LED-PA-03","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and process technique for final pin termination (e.g. pure tin). Herein package, processability and reliability on board level can be verified by generic data. Classification depends on impact of change","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness ","B",null,"-","●","M","K","-","-","-","●","P","-","-","-",1,"-","-","-","-","A","●","P,1","●","K","A,@●","A,@●","-","-","-","-","-","-","-","-","@● is required for corrosive tests H2S/FMG. AEC Q102 will be updated accordingly at next revision.\nExplanation should be provided in case H2S test is not applicable\nRegarding applicable materials please refer to the Whisker standard."]
["LED",null,"OEC-LED-PA-04","Bump Material / Metall System (internal)","P","P","Stack die or die to substrate","e.g. change to Pb-free material","A",null,"-","●","●","●","-","●","-","●","●","-","-","-","-","-","-","●","-","W","●","●","-","-","W","W","●","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-PA-05","Die attach material","P","P","Change of die attach material (e.g. soft solder, epoxy, etc). Thermal managment must be respected.","e.g. change of Ag glue to Au glue; ","B","A: In case Rth is changing","-","●","●","●","-","●","-","●","●","-","-","-","-","-","-","●","-","N","●","●","-","-","Q","Q","●","-","-","N","N","N","-","-"]
["LED",null,"OEC-LED-PA-06","Change of wire bonding","P","P","Material, diameter, change in bonding diagram and / or change in process resulting in a new technology.","e.g. change from Au to Cu material\ne.g. change from 25µm to 23µm diameter\ne.g. change from single to double bond\ne.g. change from stitch bond to stitch on ball bond.","A",null,"-","●","●","P,D","-","●","-","●","●","-","-","●","-","●","●","-","-","-","●","-","-","-","P,D","P,D","-","-","-","D,@P","D,@P","D,@P","-","-","Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended."]
["LED",null,"OEC-LED-PA-07","Change in material for sub-components (excluding LED chip & LED package related items) with impact on agreed specifications","P","P","Change of sub-component supplier using different technology/materials\nNote: Jump start test at OEMs might be necessary","e.g. using a different ESD-diode in technology and material than previously","A","Check if OEC-LED-DS-01 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED",null,"OEC-LED-PA-08","Die Overcoat / Underfill","--","P","Supporting layers for complex packages like flip chip.\n--: No change in product integrity\nP: change can influence the integrity of final product","P: e.g. change of underfill with change of thermal resistance","B","Check if OEC-LED-DS-01 is also affected.\n","-","●","P","P,@●","-","●","-","●","●","-","-","●","-","-","-","U","-","-","●","U","-","-","P","P","●","-","-","P","P","P","-","-"]
["LED",null,"OEC-LED-PA-09","Change of mold compound/encapsulation/sealing material","P","P","Change of mold compound, encapsulation, or sealing material might be affected optical function in case of package related effect (e.g. browning). Component assembly and board coating has to be assessed. MSL might be changed.","e.g. PPA mold compound","A","Check if OEC-LED-DS-01 is also affected.\n","-","●","●","●","-","●","-","-","●","-","-","P","D","-","-","-",3,"P","●","P","T","-","P","P","●","-","-","D,@P","D,@P","D,@P",4,"-"]
["LED",null,"OEC-LED-PA-10","Change of conversion material","P","P","Change of material class.","e.g. change from granats to nitrides","C","Check if OEC-LED-DS-01 is affected for optical/photometric parameters","-","●","●","●","-","●","-","Y","●","-","-","P","-","-","-","-","-","P","●","Y","-","-","P","P","●","-","-","Y","Y","Y","-","●"]
["LED",null,"OEC-LED-PA-11","Change of direct supplier for converter material","--","P","New supplier with same material specification",null,"C",null,"-","●","●","●","-","●","-","P","●","-","-","P","-","-","-","-","-","P","●","P","-","-","P","P","P","-","-","P","P","P","-","●"]
["LED",null,"OEC-LED-PA-12","Change of converter process technology","I","P","new technology for converter production\nI: no influence on e/o performance of product\nP: in case of impact on product integrity","e.g. change from volume conversion to layer conversion; e.g. change from stamping to printing of layer","C","Check if any change in  electro-optical characteristics results in change of data sheet OEC-LED-DS-01 ","-","●","-","●","-","●","-","Y","●","-","-","Z","-","-","-","-","-","Z","●","Y","-","-","Z","Z","Z","-","-","Y","Y","Y","-","●"]
["LED",null,"OEC-LED-PA-13","Change of product marking","I","P","Marking on device.\nI: change in appearance; readability not affected\nP: change of content or change of appearance of data matrix code","e.g. marking of cathode;","B",null,"-","●","-","-","-","-","-","O","-","-","-","-","-","-","-","-","-","-","T","-","T","-","-","-","-","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-PA-14","Change in process technique (e.g., die attach, molding, plating, trim and form, …)","P","P","Any change in assembly process technique","e.g. change die attached from gluing to soldering; ","B","A or B: Please check if  EQUIPMENT and other type of changes of material (OEC-LED-PA-04/05/07/08/09/10) are affected.\nIf the process change is covered in a separate change ID only this is applicable.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED",null,"OEC-LED-PA-15","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-PA-16","Change of direct material supplier with no impact on specification","--","P","Change of suppliers e.g. for lead frames, wire material, die attach, electronical components …","Change of suppliers e.g. for lead frames, wire material, ESD-diode …","C","Assumption that change material specification remains unchanged. Otherwise see change of material.","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
["LED",null,"OEC-LED-PA-17","Change of specified assembly process sequence (additional and/or deletion of process step)","I","P","Addition or deletion of a process step in assembly process sequence with potentially significant impact on the product performance\nI: no influence on product integrity\nP: influence on product integrity expected","e.g. additional or deletion plasma cleaning process","C","Single case assessment necessary to identify possible interactions or risk.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED",null,"OEC-LED-PA-18","New assembly location or transfer of assembly to a different not previously released location/site/subcontractor ","P","P","Assembly transfer or relocation.\nIncludes transfer as well as additional site.","e.g. dual source / fab strategy","C","A or B: Impact on other type of changes described under PROCESS ASSEMBLY and EQUIPMENT OEC-LED-EQ-01","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED","Headings",null,"PACKING/SHIPPING"]
["LED",null,"OEC-LED-PS-01","Outer Packing/shipping specification change","I","P","dimension changes indirect product packing\nI: small changes in dimension or appearance\nP: number of reels in the packing are changing","e.g. pizza box","*",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-PS-02","Dry pack requirement change","I","P","(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","(I): MSL 3 → MSL 1\n(P): MSL 1  → MSL 3","B","Check if OEC-LED-DS-01 is also affected.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED",null,"OEC-LED-PS-03","Inner Packing/shipping specification change","P","P","dimension change of direct product packing","e.g. SMT pocket in tape changes","B",null,"-","●","P","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","T","-","-","-","-","P","P","-","-","-","-","-"]
["LED",null,"OEC-LED-PS-04","Change of labelling","I","P","Change of labelling also on reel.\nI: additional information no change of previous information\nP: change in content of previous information","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B","Check if OEC-LED-DS-01 is also affected.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LED","Headings",null,"EQUIPMENT"]
["LED",null,"OEC-LED-EQ-01","Production from a new equipment/tool which uses a different basic technology ","P","P","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.","e.g change from single wafer to batch process \ne.g. over pad metalisation\ne.g. dambar cutting (mechanical to laser cutting)","B","Check if LED-DS-01 is also affected.\nCorrosion stability should be assessed.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED",null,"OEC-LED-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.  \n(--): If change does not influence the ingetrity of the final product\n(P): If impact on product intergrity is anticipated.","e.g. change from single site to multi site handler. \n(--): e.g. extension of existing equipment pool, already qualified.\n(P): e.g. extension of dedicated equipment in case basic technology still need to be proven.","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LED",null,"OEC-LED-EQ-03","Change in final test equipment type that uses a different technology","I","P","Change of tester platform (e.g. major test program changes , new tester interface, …).\nI: product specification is not affected\nP: product specification is affected","e.g. change in test method from cd to lumen","C","B: In case of bare die delivery","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","T","-","-","-","-","●","●","-","-","-","-","●","Gage R&R / delta correlation"]
["LED","Headings",null,"TEST FLOW"]
["LED",null,"OEC-LED-TF-01","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor","P","P","Tester transfer or relocation. ","e.g. Dual source strategy","C","B: In case of bare die delivery","●","●","-","●","-","B","-","●","B","-","-","B","-","B","B","B","-","-","●","-","T","-","-","-","-","●","●","-","-","-","-","●","Gage R&R / delta correlation; addtional specification check\nB should be considered for Wafer testing"]
["LED","Headings",null,"Q-GATE"]
["LED",null,"OEC-LED-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. test implemented without customer requirement\n(P): e.g. reduction from three temperature measurements to two temperature measurements\ne.g. change in burn in / run in process.","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["LASER DIODE","Headings",null,"LASER DIODE (LD)"]
["LASER DIODE","Headings",null,"ANY"]
["LASER DIODE"," ","OEC-LAS-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change if applicable but the change affects agreed technical contractual agreements.",null,"*",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-AN-02","Any change with impact on technical interface or processability/manufacturabiliy of customer, which is not covered in the matrix below","P","P","See processability on board level\ntechnical interface means component terminals",null,"B","Check if OEC-LAS-DS-01 is affected\nProcessability should be assessed.","-","●","-","-","-","-","-","T","-","-","-","-","-","-","-","-","-","-","S,T","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LASER DIODE","Headings",null,"DATA SHEET"]
["LASER DIODE",null,"OEC-LAS-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification ","P","P","Change of application relevant information (e.g. maximum pulse current)  due to a technical product or process change.","e.g. change of die substrate material.\ne.g. change of resonator cavity length\ne.g. change of MSL","A",null,"-","●","-","E,@S","-","@S","-","E,@S","E","-","E","E","-","-","-","-","-","-","S","E","-","-","-","-","-","E","E","-","-","-","-","E"]
["LASER DIODE",null,"OEC-LAS-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test. New description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required","e.g. Errata\ne.g. change of typ. values due to new information about component behavior \ne.g. improved statistics.\ne.g. reduction of max. allowed forward voltage due to improved statistics.","A",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-DS-03","Specification of additional parameters ","I","P","I: Definition of an additional parameter which was not specified before \nP: If there is a risk on supply chain where at least one additional other PCN-relevant change category will apply.","I: e.g.: adding new tested parameter\nI: e.g.: additional temperature coefficient parameter","A",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Formalism since this is not a product change, ony addtional information\nClassification: C"]
["LASER DIODE","Headings",null,"DESIGN"]
["LASER DIODE",null,"OEC-LAS-DE-01","Design changes in epitaxy.","P","P","Any device relevant changes in design / layout of epitaxial layers\nNot included:  Changes within design rules and design specification without affecting specified functions, parameters and reliability.","e.g. change of barrier thickness\ne.g change of waveguide layers","C","A: In case of LiDAR application is affected","-","●","-","●","-","●","-","-","●","-","●","●","-","-","-","-","-","H","-","-","-","-","-","-","-","●","●","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-DE-02","Design changes in routing/layout.","P","P","Any change in chip design / layout. Provide information if design/layout change is optical or electrical.\nNot included:  Changes within design rules and design specification without affecting specified functions, parameters and reliability.","e.g. change in layout of current spreader; thickness of current spreader\ne.g. reduction of bond pad size\ne.g. set-back of bond pad from laser facet\ne.g. change of heat spreader dimension and positioning of laser die"," C","A: In case of LiDAR application is affected \n","-","●","-","●","-","●","-","●","●","-","●","●","-","B","B","D,M","-","M","●","-","-","-","M","M","●","-","-","-","-","-","-","●","TR might be considered for complex die bond technologies"]
["LASER DIODE",null,"OEC-LAS-DE-03","Die shrink ","P","P","Shrink of active area.\nNot included: sawing street/kerf/scribe line","Typical shrink of die.","A","Please check if change in process technology (OEC-LAS-PW-08) is also affected.","-","●","-","●","-","●","-","●","●","-","●","●","-","B","B","●","-","-","●","●","-","-","-","-","-","●","●","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-DE-04","Laser package (except leadframe)","P","P","any change in housing thickness\nany change in form or dimensions","e.g. change of dimensions\ne.g. change of x, y, or z dimension of the package\n","B","Check if OEC-LAS-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\n\nA: In case of LiDAR appliaction is affected.","-","●","-","●","-","●","-","●","●","-","●","-","●","B","B","D","-","D","●","L","T","-","D","D","●","-","-",5,5,5,4,"●"]
["LASER DIODE",null,"OEC-LAS-DE-05","Design of leadframe ","P","P","any change of leadframe / submount dimensions\nany change of outer dimensions","e.g. change in leadframe / carrier dimensions in x,y, or z direction\ne.g. change in wirebond looping\ne.g. change inner design of the leadfeame not affecting the e/o performance & reliability of the device","B","Check if OEC-LAS-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\n\nA: In case looping of wirebond is affected.","-","●","●","●","-","●","-","●","●","-","@6","-","●","B","B","D","-","-","●","●","T",2,"-","-","●","●","●",5,5,5,4,"●"]
["LASER DIODE","Headings",null,"PROCESS - WAFER PRODUCTION"]
["LASER DIODE",null,"OEC-LAS-PW-01","New / change of wafer substrate or carrier material","P","P","New wafer substrate material.","e.g. different wafer material to currently released material (change from Sapphire to Silicon)\ne.g. different orientation of epitaxial substrate","C","Check if OEC-LAS-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\n\nA: In case of LiDAR application is affected.","-","●","●","P","-","●","-","P","●","-","-","●","-","-","-","●","-","P","●","●","-","-","P","P","P","P","P","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-02","Wafer diameter","P","P","change of wafer diameter resulting in equipment and process changes","e.g. 4\" to 6\"","C","Typically this type of change affects other changes i.e equipment/process technology - they need to be identified in addition","●","●","●","●","-","-","-","-","●","-","-","●","-","-","-","-","-","-","●","●","-",null,"-","-","-","P","P","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-03","New final wafer thickness","P","P","Change in final wafer thickness","e.g. change in final chip/die thickness ","C","Check if OEC-LAS-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","-","P","-","●","-","●","●","-","@6 ","●","-","B","B","●","-","-","-","●","-","-","-","-","●","P","P","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.","e.g. change from Be to C as dopant","C",null,"-","●","C","C","-","C","-","-","●","-","-","●","-","-","-","-","-","-","-","●","-","-","-","-","-","●","●","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-05","Change of stacking","P","P","change in layer sequence or thickness","e.g. change of isolation layer thickness between n- and p-material ","A","For LiDAR: Typical change of electrical or optical parameters within specification needs to be evaluated on application level.","-","●","-","●","-","●","-","F","●","-","@6 ","●","-","-","-","-","-","F","-","-","-","-","-","-","-","●","●","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-06","New / change of metallization (specifically chip frontside)","P","P","Change in metallization of bondpads, material, layer thickness","e.g. change in bond pad metallization thickness","C",null,"-","●","M","●","-","●","-","●","●","-","-","●","-","●","●","-","-","M","-","-","-","-","M","M","D,M","M,B","M,B","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-07","New / change of metallization (specifically chip backside)","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions necessary.","e.g. change from Au to Au/Ge","C",null,"-","●","M","●","-","●","-","●","●","-","-","●","-","-","-","●","-","D,M","●","D,M","-","-","D,M","D,M","D,M","D,M","D,M","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-08","Change in process technique (e.g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)","--","P","Change from wet to dry etching, change from horizontal to vertical oven for oxidation, change from contact litho into stepper litho, …","e.g. change from wet etch to dry etch\ne.g. change from laser cutting (sawing) to plasma cutting (sawing)\ne.g. change from contact litho to stepper litho","C","B: change from CVD dep to sputter dep for backside/frontside metallization.\nIn case of new equipment please check if OEC-LAS-PA-17 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-PW-09","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","_"]
["LASER DIODE",null,"OEC-LAS-PW-10","Change of material supplier with no impact on agreed specifications","--","P","Change of wafer supplier. Change of supplier for chemicals needed for wafer production. ","P: e.g. change of wafer supplier.","C","Change of wafer supplier please check if OEC-LAS-PW-01  is affected. ","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-PW-11","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Risk is to be assessed.","e.g. additional cleaning process in wafer production","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change.\nPPAP has to be updated."]
["LASER DIODE",null,"OEC-LAS-PW-12","New / change of facet passivation","--","P","Change of material, thickness, process and stacking for AR/HR mirror coating","e.g. reduction of AR reflectivity by  reducing no of stacks\ne.g. change from SiO2 to SiN3","C","Check if OEC-LAS-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\n\nA: In case of LiDAR application is affected.","-","●","-","V","-","●","-","●","●","-","●","●","-","-","-","-","-","V","●","-","-","-","P,V","P,V","-","●","●","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-PW-13","Change in die coating or passivation","P","P","Change in material, thickness, and process for coating and passivation","e.g. change from SiO2 to SiN3","C",null,"-","●","P","●","-","P","-","●","●","-","●","-","-","P","P","-","-","P","-","-","-","-","P","P","@●","P","P","-","-","-","-","●"]
["LASER DIODE",null,"OEC-LAS-PW-14","New wafer production location or transfer of wafer production to a different not previously released location/site/subcontractor ","P","P","New wafer propduction location or transfer of wafer production with possible additional changes.",null,"C","A or B: Impact on other type of changes described under PROCESS - WAFER PRODUCTION and EQUIPMENT categories of this DeQuMa\n\nA: In case of LiDAR application is affected.","●","●","-","●","-","-","-","●","●","-","-","●","-","●","●","●","-","-","●","J","-","-","-","-","-","●","●","-","-","-","-","●"]
["LASER DIODE","Headings",null,"BARE DIE DELIVERIES (Wafer process changes not covered in this section shall be handled according to section \"Process - Wafer Production\" )"]
["LASER DIODE",null,"OEC-LAS-BD-01","New / change of front side metallization","P","P","Change in bondpads, material, pad pitch, surface changes, layer thickness","e.g. change from Au to Au alloy\ne.g. change in over pad metalization","B","A: In case of chip-on-board technology","-","-","M","●","-","●","-","●","●","-","●","●","-","●","●","-","-","●","-","●","-","-","●","●","-","M,B","M,B","-","-","-","-","-","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LASER DIODE",null,"OEC-LAS-BD-02","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions.","e.g. change from Au to Au alloy","B","Check if OEC-LAS-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\nA: In case of chip-on-board technology","-","-","M","●","-","●","-","●","●","-","●","●","-","-","-","●","-","●","●","●","-","-","●","●","●","D,M","D,M","-","-","-","-","-","Customer application needs to be checked due to potential system voltage differences\nReasonable package type for reliability testing to be aligned between supplier and customer"]
["LASER DIODE",null,"OEC-LAS-BD-03","Change of wafer setup or number of dies on wafer.","I","P","Needed information for pick & place machine.\nI: only additional number of chips\nP: change in spacing between chips and form of wafer","e.g. information change for pick & place machine.","B","A: In case of chip-on-board technology","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LASER DIODE",null,"OEC-LAS-BD-04","New final wafer thickness","P","P","Changes in final Chip height (including carrier); very rare and usually combined with a material change (change of carrier material)",null,"B","Check if OEC-LAS-DS-01 is also affected.\nA: In case of chip-on-board technology","-","-","P","P","-","P","-","P","P","-","●","P","P","B","B","P","-","-","P","P","-","-","-","-","P","P","P","-","-","-","-","●","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LASER DIODE",null,"OEC-LAS-BD-05","Change in die coating or passivation","P","P","Change in material, thickness, and process for coating and passivation","e.g. change from SiO2 to SiN3","B","Check if OEC-LAS-DS-01 is also affected.\nA: In case of chip-on-board technology","-","-","P","●","-","P","-","●","●","-","●","-","-","P","P","-","-","P","●","-","-","-","P","P","P","P","P","-","-","-","-","●","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["LASER DIODE","Headings",null,"PROCESS - ASSEMBLY"]
["LASER DIODE",null,"OEC-LAS-PA-01","Change of leadframe/submount base material","P","P","New leadframe/submount material (new in composition)","e.g. change from copper alloy to bare copper\ne.g. change from SiC to AlN","B","Check if OEC-LAS-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","●","●","-","-","-","●","P","-","-","-","-","●","●","●",3,"A","●","P,1","●","P","A","A","●","-","-","-","-","-","-","-","Explanation should be provided in case H2S test is not applicable\nRegarding applicable materials please refer to the Whisker standard."]
["LASER DIODE",null,"OEC-LAS-PA-02","Change of leadframe/submount finishing material (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e.g. change from Ag flash to NiPd protection layer\ne.g. change from Ag spot to Au spot\ne.g. change from NiPd to NiPdAu","A",null,"-","●","●","●","-","●","-","●","P","-","-","-","-","●","●","●","-","A","●","P,1","●","-","A","A","@P","-","-","-","-","-","-","-","H2S test should be considered for automotive exterrior applications.\nexplanation should be provided in case H2S test is not applicable\n"]
["LASER DIODE",null,"OEC-LAS-PA-03","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and process technique for final pin termination (e.g. pure tin). Herein package, processability and reliability on board level can be verified by generic data. Classification depends on impact of change","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness ","B",null,"-","●","M","K","-","-","-","●","P","-","-","-",1,"-","-","-","-","A","●","P,1","●","K","A","A","-","-","-","-","-","-","-","-","Explanation should be provided in case H2S test is not applicable\nRegarding applicable materials please refer to the Whisker standard."]
["LASER DIODE",null,"OEC-LAS-PA-04","Bump Material / Metal System (internal)","P","P","Stack die or die to substrate","e.g. change to Pb-free material","A",null,"-","●","●","●","-","●","-","●","●","-","-","-","-","-","-","●","-","W","●","●","-","-","W","W","●","-","-","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-PA-05","Die attach material","P","P","Change of die attach material (e.g. soft solder, epoxy, etc). Thermal management must be respected.","e.g. Au glue to AuSn soldering ","B","A: In case Rth is changing","-","●","●","●","-","●","-","●","●","-","-","-","-","-","-","●","-","N","●","●","-","-","Q","Q","●","-","-","N","N","N","-","-"]
["LASER DIODE",null,"OEC-LAS-PA-06","Change of wire bonding\n","P","P","Material, diameter, change in bonding diagram and / or change in process resulting in a new technology.","e.g. change from Au to Cu material\ne.g. change from 25µm to 23µm diameter\ne.g. change from single to double bond\ne.g. change from stich bond to stich on ball bond.","A",null,"-","●","●","P,D","-","●","-","●","●","-","-","●","-","●","●","-","-","-","●","-","-","-","P,D","P,D","-","-","-","D,@P","D,@P","D,@P","-","-","Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended."]
["LASER DIODE",null,"OEC-LAS-PA-07","Change in material for sub-components (excluding Laser chip & Laser package related items) with impact on agreed specifications","P","P","Change of sub-component supplier using different technology/materials\nNote: Jump start test at OEMs might be necessary","e.g. using a different ESD- or photodiode in technology and material than previously","A","Check if OEC-LAS-DS-01 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-PA-08","Die Overcoat / Underfill","--","P","Supporting layers for complex packages like flip chip.\n--: No change in product integrity\nP: change can influence the integrity of final product","P: e.g. change of underfill with change of thermal resistance","B","Check if OEC-LAS-DS-01 is also affected.\n","-","●","P","P,@●","-","●","-","●","●","-","-","●","-","-","-","U","-","-","●","U","-","-","P","P","●","-","-","P","P","P","-","-"]
["LASER DIODE",null,"OEC-LAS-PA-09","Change of mold compound/encapsulation/sealing material","P","P","Change of mold compound, encapsulation, or sealing material might be affected optical function in case of package related effect (e.g. browning). Component assembly and board coating has to be assessed. MSL might be changed.","e.g. PPA mold compound","A","Check if OEC-LAS-DS-01 is also affected.\n","-","●","●","●","-","●","-","-","●","-","@6","P","D","-","-","-",3,"P","●","P","T","-","P","P","●","-","-","D,@P","D,@P","D,@P",4,"-"]
["LASER DIODE",null,"OEC-LAS-PA-10","Change of conversion material","P","P","Change of material class.","e.g. change from granats to nitrides","A","Check if OEC-LAS-DS-01 is affected for optical/photometric parameters","-","●","●","●","-","●","-","Y","●","-","@6","P","-","-","-","-","-","P","●","Y","-","-","P","P","●","-","-","Y","Y","Y","-","●"]
["LASER DIODE",null,"OEC-LAS-PA-11","Change of direct supplier for converter material","--","P","New supplier with same material specification",null,"A",null,"-","●","●","●","-","●","-","P","●","-","@6","P","-","-","-","-","-","P","●","P","-","-","P","P","P","-","-","P","P","P","-","●"]
["LASER DIODE",null,"OEC-LAS-PA-12","Change of converter process technology","I","P","new technology for converter production\nI: no influence on e/o performance of product\nP: in case of impact on product integrity","e.g. change from volume conversion to layer conversion; e.g. change from stamping to printing of layer\ne.g. change converter attach technology","A","Check if any change in  electro-optical characteristics results in change of data sheet OEC-LAS-DS-01 ","-","●","-","●","-","●","-","Y","●","-","@6","Z","-","-","-","-","-","Z","●","Y","-","-","Z","Z","Z","-","-","Y","Y","Y","-","●"]
["LASER DIODE",null,"OEC-LAS-PA-13","Change of assembly of additional internal components (e.g. lenses)","--","P","Change in assembly process for internal components\n\nP: in case of impact on product integrity","e.g. change from soldering to gluing process","C","Check if any change in  electro-optical characteristics results in change of data sheet OEC-LAS-DS-01 ","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-PA-14","Change of material and / or supplier of additional internal components ","--","P","Change of supplier using different technology/materials\n\nP: in case of impact on product integrity","e.g  change of lens material, optic properties\ne.g. change of submount material","C","Check if any change in  electro-optical characteristics results in change of data sheet OEC-LAS-DS-01 ","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-PA-15","Generation of hermeticity","P","P","new technology for hermeticity ","e.g.  change of welding process for metal cans\ne.g.  change of gluing of transmissive window","C","Check if any change in  electro-optical characteristics results in change of data sheet OEC-LAS-DS-01 \n\nB: In case processability is affected (e.g. laser soldering)","-","●","-","-","-",4,"-",4,4,"-","-","-","-","-","-","-","-","-",4,"-","-","-",4,4,"-","-",null,4,4,4,4,"-"]
["LASER DIODE",null,"OEC-LAS-PA-16","Change of product marking","I","P","Marking on device.\nI: change in appearance; readability not affected\nP: change of content or change of appearance of data matrix code","e.g. marking of cathode;","B",null,"-","●","-","-","-","-","-","O","-","-","-","-","-","-","-","-","-","-","T","-","T","-","-","-","-","-","-","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-PA-17","Change in process technique (e.g., die attach, molding, plating, trim and form, …)","P","P","Any change in assembly process technique","e.g. change die attached from gluing to soldering; ","B","A or B: Please check if  EQUIPMENT and other type of changes of material (OEC-LAS-PA-04/05/07/08/09/10) are affected \nIf the process change is covered in a separate change ID only this is applicable.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-PA-18","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-PA-19","Change of direct material supplier with no impact on specification","--","P","Change of suppliers e.g. for lead frames, wire material, die attach, electronical components …","Change of suppliers e.g. for lead frames, wire material, ESD-diode …","C","Assumption that change material specification remains unchanged. Otherwise see change of material.","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
["LASER DIODE",null,"OEC-LAS-PA-20","Change of specified assembly process sequence (additional and/or deletion of process step)","I","P","Addition or deletion of a process step in assembly process sequence with potentially significant impact on the product performance\nI: no influence on product integrity\nP: influence on product integrity expected","e.g. additional or deletion plasma cleaning process","C","Single case assessment necessary to identify possible interactions or risk.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-PA-21","New assembly location or transfer of assembly to a different not previously released location/site/subcontractor ","P","P","Assembly transfer or relocation.\nIncludes transfer as well as additional site.","e.g. dual source / fab strategy","C","A or B: Impact on other type of changes described under PROCESS ASSEMBLY and EQUIPMENT OEC-LAS-EQ-01\n\nA: In case LiDAR application is affected","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE","Headings",null,"PACKING/SHIPPING"]
["LASER DIODE",null,"OEC-LAS-PS-01","Outer Packing/shipping specification change","I","P","dimension changes indirect product packing\nI: small changes in dimension or appearance\nP: number of reels in the packing are changing","e.g. pizza box","*",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-PS-02","Dry pack requirement change","I","P","(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","(I): MSL 3 à MSL 1\n(P): MSL 1  à MSL 3","B","Check if OEC-LAS-DS-01 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-PS-03","Inner Packing/shipping specification change","P","P","dimension change of direct product packing","e.g. SMT pocket in tape changes\ne.g. change of tube/tray layout","B",null,"-","●","P","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","T","-","-","-","-","P","P","-","-","-","-","-"]
["LASER DIODE",null,"OEC-LAS-PS-04","Change of labelling","I","P","Change of labelling also on reel.\nI: additional information no change of previous information\nP: change in content of previous information","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B","Check if OEC-LAS-DS-01 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["LASER DIODE","Headings",null,"EQUIPMENT"]
["LASER DIODE",null,"OEC-LAS-EQ-01","Production from a new equipment/tool which uses a different basic technology ","P","P","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.","e.g change from single wafer to batch process \ne.g. over pad metalisation\ne.g. dambar cutting (mechanical to laser cutting)","B","Check if OEC-LAS-DS-01 is also affected.\nCorrosion stability should be assessed.\n\nA: In case LiDAR application is affected.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.  \n(--): If change does not influence the ingetrity of the final product\n(P): If impact on product intergrity is anticipated.","e.g. change from single site to multi site handler. \n(--): e.g. extension of existing equipment pool, already qualified.\n(P): e.g. extension of dedicated equipment in case basic technology still need to be proven.","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["LASER DIODE",null,"OEC-LAS-EQ-03","Change in final test equipment type that uses a different technology","I","P","Change of tester platform (e.g. major test program changes , new tester interface, …).\nI: product specification is not affected\nP: product specification is affected","e.g. change in test method from cd to lumen\ne.g. change of nearfield measurement (LiDAR)","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","T","-","-","-","-","●","●","-","-","-","-","●","Gage R&R / delta correlation"]
["LASER DIODE","Headings",null,"TEST FLOW"]
["LASER DIODE",null,"OEC-LAS-TF-01","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor","P","P","Tester transfer or relocation. ","e.g. Dual source strategy","C",null,"●","●","-","●","-","B","-","●","B","-","-","B","-","B","B","B","-","-","●","-","T","-","-","-","-","●","●","-","-","-","-","●","Gage R&R / delta correlation; addtional specification check\nB should be considered for Wafer testing"]
["LASER DIODE","Headings",null,"Q-GATE"]
["LASER DIODE",null,"OEC-LAS-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. test implemented without customer requirement\n(P): e.g. reduction from three temperature measurements to two temperature measurements\ne.g. change in burn in / run in process.","C","A: In case LiDAR application is affected","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PD","Headings",null,"PHOTO DIODE / PHOTO TRANSISTOR (PD)"]
["PD","Headings",null,"ANY"]
["PD",null,"OEC-PD-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change if applicable but the change affects agreed technical contractual agreements.",null,"*",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-","-","-","-","-"]
["PD",null,"OEC-PD-AN-02","Any change with impact on technical interface or processability/manufacturabiliy of customer, which is not covered in the matrix below","P","P","See processability on board level\ntechnical interface means component terminals",null,"B","Check if OEC-PD-DS-01 is affected \nProcessability should be assessed.","-","●","-","-","-","-","-","T","-","-","-","-","-","-","-","-","-","-","S,T","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PD","Headings",null,"DATA SHEET"]
["PD",null,"OEC-PD-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification ","P","P","Change of application relevant information (e.g. maximum pulse current)  due to a technical product or process change.","e.g. change of die substrate material.\ne.g. PD: change of doping level (sensitivity) \ne.g. change of MSL","A",null,"-","●","-","-","E","-","-","E","-","E","-","-","-","-","-","-","-","-","S","E","-","-","-","-","-","E","E","-","-","-","-","E"]
["PD",null,"OEC-PD-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test. New description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required","e.g. Errata\ne.g. change of typ. values due to new information about component behavior \ne.g. improved statistics.\ne.g. reduction of max. allowed forward voltage due to improved statistics.","A",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PD",null,"OEC-PD-DS-03","Specification of additional parameters ","I","P","I: Definition of an additional parameter which was not specified before \nP: If there is a risk on supply chain where at least one additional other PCN-relevant change category will apply.","I: e.g.: adding new tested parameter\nI: e.g.: additional temperature coefficient parameter","A",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Formalism since this is not a product change, ony addtional information\nClassification: C"]
["PD","Headings",null,"DESIGN"]
["PD",null,"OEC-PD-DE-01","Design changes in epitaxy.","P","P","Any device relevant changes in design / layout of epitaxial layers\nNot included:  Changes within design rules and design specification without affecting specified functions, parameters and reliability.","e.g. change of barrier thickness\ne.g. change of doping profile / layer thickness\n","C","A: In case of Avalanche Photodiode (APD)\nand Single-Photon Avalanche Diode (SPAD)","-","●","-","-","●","-","●","-","-","●","-","-","-","-","-","-","-","H","-","-","-","-","-","-","-","●","●","-","-","-","-","●"]
["PD",null,"OEC-PD-DE-02","Design changes in routing/layout.","P","P","Any change in chip design / layout. Provide information if design/layout change is optical or electrical.\nNot included:  Changes within design rules and design specification without affecting specified functions, parameters and reliability.","e.g. reduction of bond pad size\ne.g. change in pixel size and fill factor\n\n"," C","A: Change of optical characteristics","-","●","-","-","●","-","●","●","-","●","-","-","-","B","B","D,M","-","M","●","-","-","-","M","M","●","-","-","-","-","-","-","●","TR might be considered for complex die bond technologies"]
["PD",null,"OEC-PD-DE-03","Die shrink ","P","P","Shrink of active area.\nNot included: sawing street/kerf/scribe line","Typical shrink of die.","A","Please check if change in process technology (OEC-PD-PW-08) is also affected.","-","●","-","-","●","-","●","●","-","●","-","-","-","B","B","●","-","-","●","●","-","-","-","-","-","●","●","-","-","-","-","●"]
["PD",null,"OEC-PD-DE-04","PD package (except leadframe)","P","P","any change in housing thickness\nany change in form or dimensions","e.g. change of dimensions\ne.g. change of x, y, or z dimension of the package\n","B","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\n\nA: In case of LiDAR appliaction is affected.","-","●","-","-","●","-","●","●","-","●","-","-","●","B","B","D","-","D","●","L","T","-","D","D","●","-","-",5,5,5,4,"●"]
["PD",null,"OEC-PD-DE-05","Design of leadframe ","P","P","any change of leadframe / submount dimensions\nany change of outer dimensions","e.g. change in leadframe / carrier dimensions in x,y, or z direction\ne.g. change inner design of the leadfeame not affecting the e/o performance & reliability of the device","B","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","●","-","●","-","●","●","-","●","-","-","●","B","B","D","-","-","●","●","T",2,"-","-","●","●","●",5,5,5,4,"●"]
["PD","Headings",null,"PROCESS - WAFER PRODUCTION"]
["PD",null,"OEC-PD-PW-01","New / change of wafer substrate or carrier material","P","P","New wafer substrate material.","e.g. different wafer material to currently released material (change from Sapphire to Silicon)","C","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\n\nA: In case of LiDAR application is affected.","-","●","●","-","P ","-","●","P","-","●","-","-","-","-","-","●","-","P","●","●","-","-","P","P","P","P","P","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-02","Wafer diameter","P","P","change of wafer diameter resulting in equipment and process changes","e.g. 4\" to 6\"","C","Typically this type of change affects other changes i.e equipment/process technology - they need to be identified in addition","●","●","●","-","●","-","-","-","-","●","-","-","-","-","-","-","-","-","●","●","-",null,"-","-","-","P","P","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-03","New final wafer thickness","P","P","Change in final wafer thickness","e.g. change in final chip/die thickness ","C","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","-","-","P","-","●","●","-","●","-","-","-","B","B","●","-","-","-","●","-","-","-","-","●","P","P","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.","e.g. change from Be to C as dopant","C",null,"-","●","C","-","C","-","C","-","-","●","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","●","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-05","Change of stacking","P","P","change in layer sequence or thickness","e.g. change of isolation layer thickness between n- and p-material \ne.g. change of micro lens layer","A",null,"-","●","-","-","●","-","●","F","-","●","-","-","-","-","-","-","-","F","-","-","-","-","-","-","-","●","●","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-06","New / change of metallization (specifically chip frontside)","P","P","Change in metallization of bondpads, material, layer thickness","e.g. change in bond pad metallization thickness","C","A: In case of change to Aluminium metallization","-","●","M","-","●","-","●","●","-","●","-","-","-","●","●","-","-","M","-","-","-","-","M","M","D,M","M,B","M,B","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-07","New / change of metallization (specifically chip backside)","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions necessary.","e.g. change from Au to Au/Ge","C",null,"-","●","M","-","●","-","●","●","-","●","-","-","-","-","-","●","-","D,M","●","D,M","-","-","D,M","D,M","D,M","D,M","D,M","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-08","Change in process technique (e.g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)","--","P","Change from wet to dry etching, change from horizontal to vertical oven for oxidation, change from contact litho into stepper litho, …","e.g. change from wet etch to dry etch\ne.g. change from laser cutting (sawing) to plasma cutting (sawing)\ne.g. change from contact litho to stepper litho","C","B: change from CVD dep to sputter dep for backside/frontside metallization.\nIn case of new equipment please check if OEC-PD-PA-15 is also affected.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD",null,"OEC-PD-PW-09","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","_"]
["PD",null,"OEC-PD-PW-10","Change of material supplier with no impact on agreed specifications","--","P","Change of wafer supplier. Change of supplier for chemicals needed for wafer production. ","P: e.g. change of wafer supplier.","C","Change of wafer supplier please check if OEC-PD-PW-01  is affected. ","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD",null,"OEC-PD-PW-11","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Risk is to be assessed.","e.g. additional cleaning process in wafer production","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change.\nPPAP has to be updated."]
["PD",null,"OEC-PD-PW-12","Change in die coating or passivation","P","P","Change in material, thickness, and process for coating and passivation","e.g. change from SiO2 to SiN3\ne.g. change of anti-reflective coating\ne.g. change of micro lens layer (Avalanche Photodiode (APD) / Single-Photon Avalanche Diode (SPAD))","C","B: In case optical characteristics of anti-reflectice coating (ARC) are changed","-","●","P","-","●","-","P","●","-","●","-","-","-","P","P","-","-","P","-","-","-","-","P","P","P","P","P","-","-","-","-","●"]
["PD",null,"OEC-PD-PW-13","New wafer production location or transfer of wafer production to a different not previously released location/site/subcontractor ","P","P","New wafer propduction location or transfer of wafer production with possible additional changes.",null,"C","A or B: Impact on other type of changes described under PROCESS - WAFER PRODUCTION and EQUIPMENT categories of this DeQuMa\n\nA: In case of LiDAR application is affected.","●","●","-","-","●","-","-","●","-","●","-","-","-","●","●","●","-","-","●","J","-","-","-","-","-","●","●","-","-","-","-","●"]
["PD","Headings",null,"BARE DIE DELIVERIES (Wafer process changes not covered in this section shall be handled according to section \"Process - Wafer Production\" )"]
["PD",null,"OEC-PD-BD-01","New / change of front side metallization","P","P","Change in bondpads, material, pad pitch, surface changes, layer thickness","e.g. change from Au to Au alloy\ne.g. change in over pad metalization","B","A: In case of chip-on-board technology","-","-","M","-","●","-","●","●","-","●","-","-","-","●","●","-","-","●","-","●","-","-","●","●","-","M,B","M,B","-","-","-","-","-","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["PD",null,"OEC-PD-BD-02","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions.","e.g. change from Au to Au alloy","B","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\nA: In case of chip-on-board technology","-","-","M","-","●","-","●","●","-","●","-","-","-","-","-","●","●","●","●","●","-","-","●","●","●","D,M","D,M","-","-","-","-","-","Customer application needs to be checked due to potential system voltage differences\nReasonable package type for reliability testing to be aligned between supplier and customer"]
["PD",null,"OEC-PD-BD-03","Change of wafer setup or number of dies on wafer.","I","P","Needed information for pick & place machine.\nI: only additional number of chips\nP: change in spacing between chips and form of wafer","e.g. information change for pick & place machine.","B","A: In case of chip-on-board technology","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["PD",null,"OEC-PD-BD-04","New final wafer thickness","P","P","Changes in final Chip height (including carrier); very rare and usually combined with a material change (change of carrier material)",null,"B","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\nA: In case of chip-on-board technology","-","-","P","-","P","-","●","●","-","●","-","-","●","B","B","●","-","-","●","●","-","-","-","-","P","P","P","-","-","-","-","●","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["PD",null,"OEC-PD-BD-05","Change in die coating or passivation","P","P","Change in material, thickness, and process for coating and passivation","e.g. change from SiO2 to SiN3\ne.g. change anti-reflective coating\ne.g. change of micro lens layer (APD, SPAD)","B","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.\nA: In case of chip-on-board technology","-","-","P","-","●","-","P","●","-","●","-","-","-","P","P","-","-","P","●","-","-","-","P","P","P","P","P","-","-","-","-","●","Reasonable package type for reliability testing to be aligned between supplier and customer"]
["PD","Headings",null,"PROCESS - ASSEMBLY"]
["PD",null,"OEC-PD-PA-01","Change of leadframe/submount base material","P","P","New leadframe/submount material (new in composition)","e.g. change from copper alloy to bare copper","B","Check if OEC-PD-DS-01 is affected which leads to a change of the electrooptic parameters or distributions.","-","●","●","-","●","-","-","●","-","P","-","-","-","●","●","●",3,"A","●","P,1","●","P","A","A","●","-","-","-","-","-","-","-","Explanation should be provided in case H2S test is not applicable\nRegarding applicable materials please refer to the Whisker standard."]
["PD",null,"OEC-PD-PA-02","Change of leadframe/submount finishing material (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e.g. change from Ag flash to NiPd protection layer\ne.g. change from Ag spot to Au spot","A",null,"-","●","●","-","●","-","-","●","-","P","-","-","-","●","●","●","-","A","●","P,1","●","-","A","A","@P","-","-","-","-","-","-","-","H2S test should be considered for automotive exterrior applications.\nexplanation should be provided in case H2S test is not applicable\n"]
["PD",null,"OEC-PD-PA-03","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and process technique for final pin termination (e.g. pure tin). Herein package, processability and reliability on board level can be verified by generic data. Classification depends on impact of change","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness ","B",null,"-","●","M","-","K","-","-","●","-","P","-","-",1,"-","-","-","-","A","●","P,1","●","K","A","A","-","-","-","-","-","-","-","-","Explanation should be provided in case H2S test is not applicable\nRegarding applicable materials please refer to the Whisker standard."]
["PD",null,"OEC-PD-PA-04","Bump Material / Metal System (internal)","P","P","Stack die or die to substrate","e.g. change to Pb-free material","A",null,"-","●","●","-","●","-","●","●","-","●","-","-","-","-","-","●","-","W","●","●","-","-","W","W","●","-","-","-","-","-","-","-"]
["PD",null,"OEC-PD-PA-05","Die attach material","P","P","Change of die attach material (e.g. soft solder, epoxy, etc). Thermal managment must be respected.","e.g. change of Ag glue to Au glue; ","B",null,"-","●","●","-","●","-","●","●","-","●","-","-","-","-","-","●","-","N","●","●","-","-","Q","Q","●","-","-","N","N","N","-","-"]
["PD",null,"OEC-PD-PA-06","Change of wire bonding","P","P","Material, diameter, change in bonding diagram and / or change in process resulting in a new technology.","e.g. change from Au to Cu material\ne.g. change from 25µm to 23µm diameter\ne.g. change from single to double bond\ne.g. change from stich bond to stich on ball bond.","A",null,"-","●","●","-","P,D","-","●","●","-","●","-","-","-","●","●","-","-","-","●","-","-","-","P,D","P,D","-","-","-","D,@P","D,@P","D,@P","-","-","Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended."]
["PD",null,"OEC-PD-PA-07 ","Change in material for subcomponents (excluding\nphotodiode/transistor chip & package related items) with impact on agreed specifications","P","P","Change of sub-component supplier using different technology/materials","e.g. using different NTC diode in technology and material than previously","A","Check if OEC-PD-DS-01 is also affected.","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD",null,"OEC-PD-PA-08","Die Overcoat / Underfill ","--","P","Supporting layers for complex packages like flip chip.\n--: No change in product integrity\nP: change can influence the integrity of final product","P: e.g. change of underfill with change of thermal resistance","B","Check if OEC-PD-DS-01 is also affected.\n","-","●","P","-","P,@●","-","●","●","-","●","-","-","-","-","-","U","-","-","●","U","-","-","P","P","●","-","-","P","P","P","-","-"]
["PD",null,"OEC-PD-PA-09","Change of mold compound/encapsulation/sealing material","P","P","Change of mold compound, encapsulation, or sealing material might be affected optical function in case of package related effect (e.g. browning). Component assembly and board coating has to be assessed. MSL might be changed.","e.g. PPA mold compound","A","Check if OEC-PD-DS-01 is also affected.\n","-","●","●","-","●","-","●","-","-","●","-","-","D","-","-","-",3,"P","●","P","T","-","P","P","●","-","-","D,@P","D,@P","D,@P",4,"-"]
["PD",null,"OEC-PD-PA-10","Change of product marking","I","P","Marking on device.\nI: change in appearance; readability not affected\nP: change of content or change of appearance of data matrix code","e.g. marking of cathode;","B",null,"-","●","-","-","-","-","-","O","-","-","-","-","-","-","-","-","-","-","T","-","T","-","-","-","-","-","-","-","-","-","-","-"]
["PD",null,"OEC-PD-PA-11","Change in process technique (e.g., die attach, molding, plating, trim and form, …)","P","P","Any change in assembly process technique","e.g. change die attached from gluing to soldering; ","B","A or B: Please check if  EQUIPMENT and other type of changes of material (OEC-PD-PA-04/05/07/08/09) are affected.\nIf the process change is covered in a separate change ID only this is applicable.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD",null,"OEC-PD-PA-12","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PD",null,"OEC-PD-PA-13","Change of direct material supplier with no impact on specification","--","P","Change of suppliers e.g. for lead frames, wire material, die attach, electronical components …","Change of suppliers e.g. for lead frames, wire material, ESD-diode …","C","Assumption that change material specification remains unchanged. Otherwise see change of material.","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
["PD",null,"OEC-PD-PA-14","Change of specified assembly process sequence (additional and/or deletion of process step)","I","P","Addition or deletion of a process step in assembly process sequence with potentially significant impact on the product performance\nI: no influence on product integrity\nP: influence on product integrity expected","e.g. additional or deletion plasma cleaning process","C","Single case assessment necessary to identify possible interactions or risk.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD",null,"OEC-PD-PA-15","New assembly location or transfer of assembly to a different not previously released location/site/subcontractor ","P","P","Assembly transfer or relocation.\nIncludes transfer as well as additional site.","e.g. dual source / fab strategy","C","A or B: Impact on other type of changes described under PROCESS ASSEMBLY and EQUIPMENT OEC-PD-EQ-01\n\nA: In case LiDAR application is affected","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD","Headings",null,"PACKING/SHIPPING"]
["PD",null,"OEC-PD-PS-01","Outer Packing/shipping specification change","I","P","dimension changes indirect product packing\nI: small changes in dimension or appearance\nP: number of reels in the packing are changing","e.g. pizza box","*",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PD",null,"OEC-PD-PS-02","Dry pack requirement change","I","P","(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","(I): MSL 3 à MSL 1\n(P): MSL 1  à MSL 3","B","Check if OEC-PD-DS-01 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PD",null,"OEC-PD-PS-03","Inner Packing/shipping specification change","P","P","dimension change of direct product packing","e.g. SMT pocket in tape changes","B",null,"-","●","P","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","T","-","-","-","-","P","P","-","-","-","-","-"]
["PD",null,"OEC-PD-PS-04","Change of labelling","I","P","Change of labelling also on reel.\nI: additional information no change of previous information\nP: change in content of previous information","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B","Check if OEC-PD-DS-01 is also affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PD","Headings",null,"EQUIPMENT"]
["PD",null,"OEC-PD-EQ-01","Production from a new equipment/tool which uses a different basic technology ","P","P","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.","e.g change from single wafer to batch process \ne.g. over pad metalisation\ne.g. dambar cutting (mechanical to laser cutting)","B","Check if OEC-PD-DS-01 is also affected.\nCorrosion stability should be assessed.","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD",null,"OEC-PD-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.  \n(--): If change does not influence the ingetrity of the final product\n(P): If impact on product intergrity is anticipated.","e.g. change from single site to multi site handler. \n(--): e.g. extension of existing equipment pool, already qualified.\n(P): e.g. extension of dedicated equipment in case basic technology still need to be proven.","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
["PD",null,"OEC-PD-EQ-03","Change in final test equipment type that uses a different technology","I","P","Change of tester platform (e.g. major test program changes , new tester interface, …).\nI: product specification is not affected\nP: product specification is affected","e.g. change illumination methods / spectrum","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","T","-","-","-","-","●","●","-","-","-","-","●","Gage R&R / delta correlation"]
["PD","Headings",null,"TEST FLOW"]
["PD"," ","OEC-PD-TF-01","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor","P","P","Tester transfer or relocation. ","e.g. Dual source strategy","C","B: In case of bare die delivery","●","●","-","-","●","-","B","●","-","B","-","-","-","B","B","B","-","-","●","-","T","-","-","-","-","●","●","-","-","-","-","●","Gage R&R / delta correlation; addtional specification check\nB should be considered for Wafer testing"]
["PD","Headings",null,"Q-GATE"]
["PD",null,"OEC-PD-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. test implemented without customer requirement\n(P): e.g. reduction from three temperature measurements to two temperature measurements\ne.g. change in burn in / run in process.","C","A: In case LiDAR application is affected","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
[]
[]
[null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) "]
[]
[null,null,"Reason for exception of tests and/or usage of generic data:"]
[]
[]
[]
[null,null,"--","Not required."]
[null,null,"I","Information Note required."]
[null,null,"P","PCN required."]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the appropriate process change.\nA @ recommended additionally by ZVEI "]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Not for Ag plated devices applicable (Ag intended to fail for this test)"]
[null,null,"B","Only if Bondarea/Wirebond is changed/affected"]
[null,null,"C","Only if dopand/implantation material is changed"]
[null,null,"D","Only if Dimensions are changing"]
[null,null,"E","Only if min/max Values are changing"]
[null,null,"F","Sequence change only"]
[null,null,"H","Non Epoxy Casted Devices only"]
[null,null,"J","Only for chip technology using wafer bonding"]
[null,null,"K","Not for Au plated devices"]
[null,null,"L","Only if Leadframe/Substrate Dimensions are changed"]
[null,null,"M","Only if metal composition is changed including sequence"]
[null,null,"N","Only for glued chips "]
[null,null,"O","Only if process is changing"]
[null,null,"P","Only if material properties are changed"]
[null,null,"Q","Only if glue components are changing"]
[null,null,"R","Only if marking technology changes"]
[null,null,"S","Only if Floor Life is affected"]
[null,null,"T","Only if Board Reliability is affected"]
[null,null,"U","Only if underfill is affected"]
[null,null,"V","Only for non-hermetic devices"]
[null,null,"W","Only if risk of corrosion is increasing"]
[null,null,"Y","Only for layer technology"]
[null,null,"Z","Only if conversion technology changes"]
[null,null,1,"Only if data sheet parameters are affected"]
[null,null,2,"Only if  outer dimensions are critical"]
[null,null,3,"Only for leaded parts"]
[null,null,4,"Only for hermetic parts"]
[null,null,5,"Only for uncasted parts"]
[null,null,6,"Only for IR pulse laser"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
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[]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,null,null,null,null,null,"-","-"]

{"sheet":"MEMS","index":5,"n_rows":156,"n_cols":66,"rows_kept":156,"cut":false,"hidden":false,"merged":[[4,61,4,62],[3,61,3,62],[3,10,8,10],[5,46,6,46],[4,11,4,60],[5,56,6,56],[5,57,6,57],[5,58,6,58],[5,27,6,27],[5,28,6,28],[5,29,6,29],[5,48,6,48],[5,49,6,49],[5,50,6,50],[5,51,6,51],[5,60,6,60],[5,53,6,53],[5,54,6,54],[5,55,6,55],[5,38,6,38],[5,52,6,52],[5,43,6,43],[5,36,6,36],[5,33,6,33],[5,31,6,31],[5,18,6,18],[5,19,6,19],[5,21,6,21],[5,30,6,30],[5,26,6,26],[5,22,6,22],[5,20,6,20],[5,23,6,23],[177,2,177,3],[167,2,167,3],[168,2,168,3],[169,2,169,3],[170,2,170,3],[165,2,165,3],[166,2,166,3],[171,2,171,3],[176,2,176,3],[173,2,173,3],[174,2,174,3],[175,2,175,3],[172,2,172,3],[163,2,163,3],[164,2,164,3],[5,42,6,42],[5,39,6,39],[89,3,89,7],[5,11,8,11],[6,7,7,7],[5,6,5,7],[93,3,93,9],[87,3,87,7],[91,3,91,7],[105,2,106,5],[94,3,94,9],[161,2,161,3],[162,2,162,3],[5,13,6,13],[2,0,2,2],[1,0,1,2],[3,0,3,2],[0,0,0,2],[5,64,8,64],[5,61,6,61],[5,62,6,62],[7,61,8,61],[7,62,8,62],[5,59,6,59],[5,47,6,47],[5,14,6,14],[5,15,6,15],[5,16,6,16],[5,17,6,17],[5,37,6,37],[3,11,3,60],[5,44,6,44],[5,35,6,35],[5,40,6,40],[4,0,4,2],[5,41,6,41],[5,32,6,32],[5,34,6,34],[5,45,6,45],[5,24,6,24],[5,25,6,25],[5,12,8,12],[6,8,7,8],[6,4,6,5],[5,9,7,9],[6,6,7,6]]}
[]
["Worked on:\n (Name, Function)",null,null,"Max Mustermann"]
["Signature:"]
["Date:",null,null,null,null,null,null,null,null,null,"Line evaluation\n(can be evaluated by data or audit/on site check)","Device evaluation"]
["PCN number:",null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q103 Revision 2)\nincludes integrated circuits (e.g. ASICs, µ-Controller, memories, voltage regulators, smart power devices, logic devices, analog devices,... )",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q10x"]
[null,null,"  ",null,null,null,{"$f":"Guidance!A9","v":"Form provided by ZVEI -  Revision 5.0  -  December 2021"},null,"Evaluation level\n A / B / C","Further applicable conditions",null,"AEC-Q103 Revision 2","Check of specification \n(for raw material only)","Temperature Humidity Bias or biased HAST","Autoclave or Unbiased HAST","Temperature Cycling","Power Temperature Cycling","High Temperature Storage Life","High Temperature Operating Life","Early Life Failure Rate","NVM Endurance, Data Retention, and Operational Life","Wire Bond Shear","Wire Bond Pull","Solderability","Physical Dimensions","Solder Ball Shear","Lead Integrity","Bump Shear","Die Pull / Peeling","Lid Pull","Electromigration","Time Depending Dielectric Breakdown","Hot Carrier Injection","Negative Bias Temperature Instability","Stress Migration","Electronic Discharge\nHuman Body Model ","Electronic Discharge\nCharged Device Model","Latch up","Electrical Distribution","Characterisation","Electromagnetic Compatibility","Short Circuit Characterization","Soft Error Rate","Lead free","Mechanical Series","Package Drop","Lid Torque","Die Shear","Internal Water Vapor","Pressure & high temp operating life","biased Pulsed Pressure Temp Cycling","Pressure & low Temp operating Life","Condesing Humidity with Sulphur","Corrosive Atmosphere","Chemical Resistance","Burst Pressure","Proof Pressure","Salt Immersion","Dust","Internal Visual Inspection","Die Shear","Whisker test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution",null,"Remarks"]
[null,null,null,"Assessment of impact regarding following aspects\n  - contractual agreements\n  - technical interface of handling/processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Potential impact?",null,"Understanding of semiconductors experts ","Examples to explain","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: Not relevant for qualification matrix",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"For Cu Wire Products: Consider AEC-Q006"]
[null,null,"ID","Type of change","No","Yes",null,null,null,null,null,null,null,"THB","AC","TC","PTC","HTSL","HTOL","ELFR","EDR","WBS","WBP","SD","PD","SBS","LI","BST","DPT","LPT","EM","TDDB","HCI","NBTI","SM","HBM","CDM","LU","ED","CHAR","EMC","SC","SER","LF","MECH","DROP","LT","DS","IWV","PrHTOL","B_PPrTC","PrLTOL","CHS","CAtm","CR","BPr","PPr","SIT","DST","IV","DIS"]
[null,"Headings",null,"ANY",null,null,null,null,null,null,null,null,null,"A2","A3","A4","A5","A6","B1","B2","B3","C1","C2","C3","C4","C5","C6","C7","C8","C9","D1","D2","D3","D4","D5","E2","E3","E4","E5","E7","E9","E10","E11","E12","G1-3","G5","G6","G7","G8","PS1","PS2","PS3","PS4","PS5","PS6","PS7","PS8","PS9","PS10","PS11","PS12"]
[null," ","MEMS-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.",null,"*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-AN-02","Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below.","P","P","Any change which is not covered in the matrix below, but risk assessment at customer is recommended.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DATA SHEET"]
[null,null,"MEMS-DS-01","Change of data sheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update of data sheet because of technical change of the product.","e.g. recommendations for pull-up/pull-down or NC pins, MSL","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!","e.g. Errata","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. No technical change of the product.\n(I): Definition of new parameter which was not documented before.\n(P): Not known as single change. Only in combination with other changes. ","(I): e.g. adding new tested parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DESIGN"]
[null,null,"MEMS-DE-01","Design changes in active elements. 1)","P","P","Any device relevant changes in design / layout of elements with effect on data sheet\n1) Not included: \nModification to adjust product parameter within specified process window and design rules.","e.g. change of ESD structure\ne.g. add / remove a transistor in layout ","A","Please check if data sheet is affected (MEMS-DS-01).","-","●","-","-","●","●","M","-","●","●","D,J","-","-","-","-","-","-","-","-","-","D","D","D","D","D","●","●","●","●","●","●","●","●","-","-","F","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-DE-02","Design changes in routing . 2)","P","P","Any change of wiring between elements in chip design / layout with effect on data sheet.\n2) Not included: \nModification to adjust product parameter within specified design rules.","e.g. mask changes in metal fix for corrective action (based on external 8D report)","C","A: Impact on EMC behavior cannot be evaluated / excluded on component level.\nA: If impact on electrical function is not excluded on component level.\nPlease check if data sheet is affected (MEMS-DS-01).","-","●","-","-","-","A","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"MEMS-DE-03","MEMS (pressure Sensing Element) Design Change","P","P","Dimensional change affecting electrical parameter (e.g. Sensitivity).","e.g. Numbers on membrane cells, change of partioning / segmentation of sensor device element;  changes of lateral height of cavity >1% (lateral cavity dimension)","A","Please check if data sheet is affected (MEMS-DS-01).",null,"●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-"]
[null,"Headings",null,"PROCESS - WAFER PRODUCTION"]
[null,null,"MEMS-PW-01","New / change of wafer substrate material","P","P","New wafer material.","e.g. different wafer material to currently released material (like change from EPI material into non-EPI material)","C",null,"-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●"]
[null,null,"MEMS-PW-02","New wafer diameter","P","P","Change of wafer diameter resulting in equipment and process changes.",null,"C","Impact on changes in MEMS-PW-09 and/or MEMS-EQ-01.","●","●","-","-","-","E","M","-","●","●","-","E","E","-","-","-","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","S","-","-","-","-","●","E","E","-","-","-","E","E","-","-","●","●","-","●","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification"]
[null,null,"MEMS-PW-03","New final wafer thickness (including pressure sensor membrane)","P","P","Change in Wafer thickness","e.g.  change in final die thickness","C",null,"-","●","-","-","-","E","M","-","●","●","-","E","E","-","-","-","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","S","-","-","-","-","●","E","E","-","-","-","E","E","-","-","●","●","-","●","●","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.",null,"A",null,"-","●","-","-","-","-","M","-","●","G","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","-","HTOL referencing to PrHTOL with technical justification"]
[null,null,"MEMS-PW-05","Change of gate material / dielectrics","P","P","Change of gate material and / or gate dielectric material.",null,"A",null,"-","●","-","K","K","●","M","-","●","#,N","D,J","K","●","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","●","-","K","K","K","-","-","K","K","K","-","-","●","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-06","New / change of backside operation (grinding / metallization) ","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions necessary.\nAlternative see MEMS-PW-09","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","C",null,"-","●","-","-","-","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","M","M","●","-","●","-","-","-","-","H","-","-","H","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-07","New / change of metallization / vias / contacts","P","P","Change in metallization of bondpads, material, layer thickness specifically for chip frontside and internal layers.","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metallization","C",null,"-","●","-","●","●","●","M","-","●","-","-","●","●","-","-","-","-","-","-","-","●","-","-","-","●","-","-","-","●","●","-","●","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","●","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-08","New / change of passivation or die coating (without bare die)","P","P","Change of top layer on die (between mold compound and die). ","e. g. addition of polyimide","C","Change of intrinsic mechanical stress might influence electrical function.","-","●","-","K","K","●","M","-","●","#,N","D,J","K","●","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","●","-","K","K","K","-","-","K","K","K","-","-","●","●","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-09","Change in process technology not covered by any other type of change","--","P","(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(--): e.g. change from wet to dry etching, \ne. g. change from horizontal to vertical oven for oxidation\n(P): e.g. change of layer thickness","A","Please also check changes described under EQUIPMENT.\nPlease check if change is described by specific type of change in this matrix.","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"MEMS-PW-10","Process integrity: tuning within specification","--","P","Variation within process specification\n(--):  If tuning within process specification does not influence the integrity of the final product.\n(P): If remaining risk on product specification is anticipated.","(--): e.g. process control","C","Please check if DATA SHEET is affected. \nPlease check if MEMS-PW-09 is affected.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"MEMS-PW-11","Change of wafer supplier.","--","P","(--): If no remaining risk in supply chain exist\n(P): If the change of wafer supplier can  influence the integrity of the final product.","(--): e.g. change of wafer supplier with same material composition.\ne.g. same material composition and does not influence electrical behavior.\n(P): e.g. new supplier with impact on substrate material and / or electrical behavior. ","C","Not on component, tested on test structure (typical for IC).\nInteraction on component level for discrete components expected.\nIn case of SOI substrate HF properties have to be qualified. \nPlease check if MEMS-PW-01 and MEMS-DS-01 is affected.","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"MEMS-PW-12","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Risk is to be assessed.\n(--): No Risk for Supply chain.\n(P): Risk for Supply chain (influence on product integrity)","(--): e.g. change of cleaning process in wafer production\n(P): e.g. additional sinker implantation after standard implantation (to protect circuit against interference impulses). ","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PW-13","Move all or parts of production to a different wafer fab site.","P","P","Wafer fab transition with additional changes (described above).\nIncludes transfer as well as additional site.","e.g. dual source / fab strategy","A","Check if any other type of process change is applicable due to the transfer","●","●","-","●","●","●","M","-","●","●","J","●","●","-","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","H","-","-","H","-","●","●","●","●","●","●","●","●","●","●","●","●","-","●","●","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-14","Lithography","--","P","Change in process technique for lithographic process and material\n(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(--): e.g. exchange of defect mask\n(P): e.g. change from E-beam process to X-ray process\ne.g. change from contact into projection mode","C","Please also check changes described under EQUIPMENT.","-","●","-","●","-","●","M","-","●","#","-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-15","Oxide / Interlayer Dielectric","--","P","Change in process technique for oxide / interlayer dielectric process\n(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.",null,"A","Please also check changes described under EQUIPMENT.","-","●","-","K","K","●","M","-","●","#,N","D,J","K","●","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","●","-","K","K","K","-","-","K","K","K","-","-","●","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PW-16","MEMS (pressure Sensing Element) specific process","--","P","Any change in MEMS Pressure Sensor Technologies. Impact is to be assessed.\n(--): No impact for Supply chain.\n(P): Potential impact on product integrity","(P) MEMS Pressure Sensor device technologies:\n- Polysilicon surface micro-machines\n- Single crystal silicon Deep Reactive Ion Etching (DRIE)\n- Bulk micro-machined\n- Capping processes (Glas frit; Eutectic bonding; Fusion bonding; Anodic bonding)",null,null,null,"●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","●","-"]
[null,"Headings",null,"BARE DIE"]
[null,null,"MEMS-BD-01","New final wafer thickness","P","P","Change in final wafer thickness. ","Change in final chip/die thickness ","A",null,"-","-","-","-","-","-","-","-","●","●","-","-","_","-","-","-","-","-","-","-","-","-","-","-","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","#PS1 - Pressure HTOL is recommended and might replace #B1 HTOL\nNBTI was removed in deviation from the AEC-Q100 Matrix because there it is a combined type of change (Wafer Dimension/Thickness). NBTI is applicable for wafer dimension change only."]
[null,null,"MEMS-BD-02","Change of top metallization or bond pad stack","P","P","Change in bondpads (incl. stack below), material, pad pitch, surface changes, layer thickness","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metalization","B",null,"-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","#B1 HTOL is recommended; #PS1 Pressure HTOL only if Sensitivity is affected by the change"]
[null,null,"MEMS-BD-03","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions.","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","A",null,"-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","M","M","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","#B1 HTOL is recommended; #PS1 Pressure HTOL only if Sensitivity is affected by the change"]
[null,null,"MEMS-BD-04","Change of wafer setup or number of possible good dies on wafer.","I","P","Needed information for pick & place machine.\n(I): amount of possible good dies on wafer\n(P): influence on wafer setup and wafer mapping","(I): e.g. change from 350 to 240 good dies on wafer\n(P): e.g. information change for pick & place machine.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-BD-05","Change of optical appearance of wafer edge region (like imide coverage or edge exclusion)","I","P","Selection of dies in wafer edge region which have full electrical functionality. \n(I): in case of wafer edge is affected only\n(P): in case of single die is affected","(I): e.g. appearance of wafer edge (rounded instead of square)\n","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-BD-06","Die scribe or separation","I","P","Needed information for sawing and pick & place machine.\n(I): If the change in sawing process does not influence the integrity of the final product.\n(P): in case if product is delivered on unsawn wafer","(I): e.g. if product is delivered as known good die (in tape and reel)\n(P): e.g. information change for pick & place machine.\ne.g. information change for sawing machine.","B","Please check if MEMS-BD-04 is affected.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-BD-07","Die Preparation / Clean","--","P","Change in process technique for die preparation / cleaning\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of cleaning time.\n(P): e.g. change in cleaning procedure after sawing","B","Please check if MEMS-BD-06 is affected.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-BD-08","New / change of passivation or die coating ","P","P","Change of top layer on die.","e.g. Passivation thickness","B",null,"-","-","-","K","K","●","M","-","●","#,N","D,J","K","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,"Headings",null,"WAFER BUMPING"]
[null,null,"MEMS-WB-01","Redistribution Layer",null,null,null,null,null,null,null,"●",null,"●","●","●","M","●","-","-","-","-","-","-","-","-","-","●","●","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","Stress tests column AB /AC / AD are not described in AEC Q103-002 and therefore not worked out in DeQuMa tab MEMS pressure sensor"]
[null,null,"MEMS-WB-02","Under Bump Material",null,null,null,null,null,null,null,"●",null,"●","●","●","M","●","-","-","-","-","-","-","-","-","-","●","●","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","Stress tests column AB /AC / AD are not described in AEC Q103-002 and therefore not worked out in DeQuMa tab MEMS pressure sensor"]
[null,null,"MEMS-WB-03","Bump Material / Metal System (internal)",null,null,null,null,null,null,null,"●",null,"●","●","●","M","●","-","-","-","-","-","-","-","-","-","●","●","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","Stress tests column AB /AC / AD are not described in AEC Q103-002 and therefore not worked out in DeQuMa tab MEMS pressure sensor"]
[null,null,"MEMS-WB-04","Bump Site Transfer",null,null,null,null,null,null,null,"●",null,"●","●","●","M","●","-","-","-","-","-","-","-","-","-","●","●","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","Stress tests column AB /AC / AD are not described in AEC Q103-002 and therefore not worked out in DeQuMa tab MEMS pressure sensor"]
[null,"Headings",null,"PROCESS - ASSEMBLY"]
[null,null,"MEMS-PA-01","New Package","P","P","Change in dimensions of existing package.","e. g. changes in package dimensions (further development).","B",null,"-","●","-","●","●","●","M","●","●","●","-","●","●","●","●","T","●","-","-","-","-","-","-","-","-","●","●","-","●","-","-","●","-","L","H","-","-","H","H","●","●","●","●","●","●","●","●","●","●","●","●","-","-","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PA-02","Change of leadframe base material","P","P","New leadframe material in new composition.","e. g. change from alloy42 to copper\ne. g. change between two different copper alloys","B",null,"-","●","●","-","●","●","M","●","-","-","-","-","●","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","L","H","-","-","H","-","-","●","-","●","●","●","-","-","-","-","-","●","●","-","●","TC maybe referencing to B_PPrTC with technical justification "]
[null,null,"MEMS-PA-03","Change in leadframe dimensions","P","P","Change in leadframe dimensions which has impact to the specified electrical parameter acc. data sheet or specification (e.g. heat sink, pin dimensions, die paddle size, ...)\nNot included: Variation within specification.","e. g. change in lead frame geometry","B","ESD investigations are only necessary if internal ground and power supply connection of leadframe is affected.\nA: If impact on EMC behavior cannot be evaluated / excluded on component level.\n","-","●","-","-","●","●","M","-","-","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","L","H","-","-","-","-","-","●","-","●","●","●","-","-","-","-","-","●","-","-","●","Recommended to check if ESD CDM is applicable; e.g. Changes of leadframe thickness."]
[null,null,"MEMS-PA-04","Change of lead frame finishing material / area (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e. g. change from Ag flash to NiP protection layer\ne. g. change from Ag spot to Au spot\ne. g. increase of silver plating area","C",null,"-","●","●","●","●","●","M","●","-","-","-","-","C","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","L","-","-","-","H","-","-","-","-","●","●","●","-","-","-","-","-","●","-","-","●"]
[null,null,"MEMS-PA-05","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and / or process resulting in a new technology (e.g. pure tin).","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness ","B",null,"-","●","●","●","●","●","M","●","-","-","-","-","C","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","L","-","-","-","H","-","-","-","-","●","●","●","-","-","-","-","-","●","-","-","-"]
[null,null,"MEMS-PA-06","Bump Material / Metal System (internal)","P","P","Stack die or die to substrate (flip chip)","e. g. change to Pb-free material\ne. g. change of copper pillars","C",null,"-","●","●","●","●","●","M","●","●","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","L","-","-","-","-","-","●","●","-","●","●","●","-","-","-","-","-","-","-","-","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PA-07","Die attach material","P","P","Change of die attach material  ","e.g. Change of Material composition (glue or filler material)","C","A: If impact on EMC behavior cannot be evaluated / excluded on component level (if die attach has impact on electrical conductivity).","-","●","●","●","●","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","●","-","L","H","-","-","H","H","●","●","-","●","●","●","●","●","-","-","-","●","-","●","●","Consider if TC or B_PPrTC is applicable. Is die attach influencing the pressure sensor parameter, then B_PPrTC should be considered."]
[null,null,"MEMS-PA-08","Change of wire bonding\n","P","P","Material, diameter, change in bonding diagram and / or change in process resulting in a new technology.","e.g. change from Au to Cu material\ne.g. change from 25µm to 23µm diameter\ne.g. change from single to double bond\ne.g. change from stich bond to stich on ball bond.","C","A: In case of bond diagram change and EMC cannot be evaluated on component level.\n\nPlease also check changes described under \nMEMS-EQ-01.","●","●","●","S","●","●","Q","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","●","-","-","H","-","-","-","-","-","●","-","●","●","●","-","-","●","-","-","●","-","●","●","B_PPrTC maybe referencing to TC with technical justification "]
[null," ","MEMS-PA-09","Substrate / Interposer","P","P","Change of BGA substrate","e.g. changes in routing ","B","A: Impact on EMC behavior cannot be evaluated / excluded on component level.\nA: If impact on electrical function is not excluded on component level.","-","●","●","●","●","●","M","●","●","-","-","●","●","-","-","T","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","L","H","-","-","H","H","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification"]
[null,null,"MEMS-PA-10","Die Overcoat / Underfill","--","P","Supporting layers for complex packages like flip chip and / or change in process resulting in a new technology.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of dispensing speed\n(P): e.g. change of material  (thickness or curing characteristics)","C",null,"-","●","●","●","●","●","M","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","H","●","●","●","●","●","●","●","●","●","●","●","●","-","-","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PA-11","Change of mold compound / encapsulation material","P","P","Change of mold compound / encapsulation material.","e.g. change to green mold compound\ne.g. change of filler particles","C","B: for wave soldered devices ","-","●","●","●","●","●","M","●","●","●","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","L","-","-","-","-","-","●","●","-","-","●","●","-","-","-","-","-","●","-","-","●","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification "]
[null,null,"MEMS-PA-12","Change of hermetic sealing","P","P","Affected areas are material and process of hermetic (e.g. ceramic ) packages, capped die and sealed devices (e.g. pressure sensors) ","e.g. change of sealing material for RoHS","B","A: impact on EMC behavior cannot be evaluated / excluded on component level (if encapsulation / sealing has impact on electrical conductivity).","-","●","●","-","H","H","-","H","-","-","-","-","-","-","H","-","H","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","H","-","H","-","H","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PA-13","Change of product marking","I","P","Change of marking on device and / or change in process resulting in a new technology..\n(I): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(I): e.g. change of appearance (additional marking)\n(P): e.g. change from inked marking to laser marking\ne.g. marking of pin 1","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PA-14","Change in process technology\n(e.g. trim and form, leadframe preparation …)","--","P","(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(P): e.g. change from punched to sawn QFN","B","Please also check changes described under \nMEMS-EQ-01.\nPlease check if change is described by specific type of change in this matrix.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PA-15","Process integrity: tuning within specification","--","P","Variation within process specification\n(--): If tuning within process specification does not influence the integrity of the final product.\n(P): If impact on product specification is anticipated","(--): e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PA-16","Change of direct material supplier","--","P","Change of suppliers for direct materials which are used in assembly process (BOM).\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of wire material supplier.\n(P): e.g. additional leadframe supplier with specific leadframe manufacturing technology","C","Please check if material is changed!","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PA-17","Change of specified assembly process sequence (deletion and/or additional process step)","--","P","(--): no influence in final product integrity or specified sequence\n(P): influence in final product integrity or specified sequence","(--): e.g. additional cleaning step \ne.g. deletion of optical inspection\n(P): e.g. change lead finishing pre trim & form to post trim & form","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PA-18"," Move all or parts of production to a different assembly site.","P","P","Assembly transfer or relocation.\n Includes transfer as well as additional site.","e.g. dual source / plant strategy","C","A or B: impact on other type of changes described under PROCESS  ASSEMBLY and MEMS-EQ-01.\n\nCheck if any other type of process change is applicable due to the transfer","●","●","-","●","●","●","M","-","●","●","-","●","●","●","●","T","●","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","L","H","-","-","H","H","●","●","●","●","●","●","●","●","●","●","●","●","●","●","●","It is recommended to check which of specific pressure related stress tests might be applicable. E.g. If device has been previously qualified prior AEC Q103 release date."]
[null,null,"MEMS-PA-19","Die scribe or separation","--","P","Separation process from single wafer to dies. \n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of kerf width\n(P): e.g. change from sawing to laser cut","C",null,"-","●","-","●","●","●","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","●","-","-","-","TC maybe referencing to B_PPrTC with technical justification "]
[null,null,"MEMS-PA-20","Die Preparation / Clean","--","P","Change in process technique for die preparation / cleaning\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of cleaning time.\n(P): e.g. Change of roughness of pads or die backside if impact on Die Shear or WBS/WBP\n(P): e.g. Different cleaning method (rinsing to spraying)","C",null,"-","●","-","●","●","-","M","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","H","-","-","●","-","-","-","-","-","-","-","-","-","●","-","-","-"]
[null,null,"MEMS-PA-21","Molding / Encapsulation process","--","P","Change in process technique for molding / encapsulation.\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. tuning within process specification\n(P): e.g. Influence on inner cavity structure/roughness","C",null,"-","●","-","●","●","●","M","●","●","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","L","-","-","-","-","-","●","●","-","-","●","●","-","-","-","-","-","●","-","-","-","HTOL and TC maybe referencing to PrHTOL and B_PPrTC with technical justification"]
[null,"Headings",null,"PACKING/SHIPPING"]
[null,null,"MEMS-PS-01","Packing/shipping specification change","P","P","Packing/shipping specification change.",null," *",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PS-02","Dry pack requirements change ","I","P","(I) relaxation of dry pack requirements\n(P): tightening of dry pack requirements ","(I) MSL 3 --> MSL 1\n(P) MSL 1 --> MSL 3","B","Please check, if datasheet changes as well (MEMS-DS-01 or MEMS-DS-02)","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PS-03","Change of carrier (tray, reel)","P","P","(P): Change of carrier (tray, reel)",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-PS-04","Change of labelling","I","P","Change of labelling also on reel.\n(I): Change of material label without impact on barcode/ data matrix code\n(P): Changes of material label information which affects data processing at customer.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of defined nomenclature for data processing","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"EQUIPMENT"]
[null,null,"MEMS-EQ-01","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.","e.g. Dambar / tie bar cutting (mechanical to laser cutting)\ne.g. Change from PVD to galvanic process (pad metallization)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MEMS-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. extension of existing equipment pool\n(P): e.g. extension of dedicated equipment in case basic technology still need to be proven","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"MEMS-EQ-03","Change in final test equipment type leading to a different test concept.","P","P","Change of tester platform with differences in HW or SW that makes a change in test concept necessary (only in case of bare die: final test means wafer test).","(P): e.g. Different method to calculate trim values","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,"Headings",null,"TEST FLOW"]
[null,null,"MEMS-TF-01","Move of all or part of electrical wafer test and/or final test to a different test site.","P","P","Tester transfer or relocation. \nCheck impact on MEMS-AN-01\n Includes transfer as well as additional site.","Dual source strategy","C","Check if any other type of process change is applicable due to the transfer","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,"Headings",null,"Q-GATE"]
[null,null,"MEMS-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. test implemented without customer requirement\n(P): e.g. reduction from three temperature measurements to two temperature measurements\ne.g. change in burn in / run in process.","C",null,"●","-","-","-","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-"]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-"]
[]
[null,null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) "]
[]
[null,null,null,"Reason for exception of tests and/or usage of generic data: "]
[]
[]
[]
[]
[]
[null,null,"--","Not required."]
[null,null,"I","Information Note required."]
[null,null,"P","PCN required."]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," "]
[]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the \nappropriate process change.\nA @ recommended additionally by ZVEI "]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Only for peripheral routing"]
[null,null,"B","For symbol rework, new cure time, temp"]
[null,null,"C","If bond to leadfinger"]
[null,null,"D","Design rule change"]
[null,null,"E","Thickness only"]
[null,null,"F","MEMS element only"]
[null,null,"G","Only from non-100% burned-in parts"]
[null,null,"H","Hermetic only"]
[null,null,"J","EPROM or EEPROM"]
[null,null,"K","Passivation only"]
[null,null,"L","For Pb free devices only"]
[null,null,"M","For devices requiring PTC"]
[null,null,"N","Passivation and gate oxide"]
[null,null,"Q","Wire diameter decrease"]
[null,null,"S","MEMS Pressure Sensors"]
[null,null,"T","For Solder Ball SMD only"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Acoustic Microscopy"]
[null,null,"B","If not laser etched",null,null,null,null,null," "]
[null,null,"C","Only for Leadframe Plating change"]
[null,null,"D","Only for Lead Finish change"]
[null,null,"E","If Applicable"]
[null,null,"F","Finite Element Analysis"]
[null,null,"G","Generic Data available"]
[null,null,"H","Hermetic device only"]
[null,null,"I","Infant Mortality Rate"]
[null,null,"M","Power MOS/IGBT devices only"]
[null,null,"P","CV Plot (MOS only)"]
[null,null,"R","Spreading Resistance Profile"]
[null,null,"S","Steady State Mortality Rate"]
[null,null,"X","X-Ray"]
[null,null,"Z","For backside operation changes"]
[null,null,1,"If bond pads are affected"]
[null,null,2,"Verify #2 (package) post"]
[null,null,3,"Only for changes at the periphery"]
[null,null,4,"Only for oxide etches or etches prior to oxidation"]
[null,null,5,"For source or channel region changes"]
[null,null,6,"For field termination changes"]
[null,null,7,"For passivation changes"]
[null,null,8,"For contact changes"]
[null,null,9,"For epitaxial changes"]
[null,null,0,"Required for Schottky barrier changes."]
[null,null,"#","Glass Transition Temperature"]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]

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[]
["Worked on:\n (Name, Function)",null,null,"Max Mustermann"]
["Signature:"]
["Date:",null,null,null,null,null,null,null,null,null,"Line evaluation\n(can be evaluated by data or audit/on site check)","Device evaluation"]
["PCN number:",null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS on the basis of AEC-Q104 Revision -September 14, 2017",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q10x"]
[null,null,"  ",null,null,null,{"$f":"Guidance!A9","v":"Form provided by ZVEI -  Revision 5.0  -  December 2021"},null,"Evaluation level\n A / B / C","Further applicable conditions",null,"AEC-Q104 Revision September 14, 2017","Check of specification \n(for raw material and sub-component)","Temperature Humidity Bias or biased HAST","Autoclave or Unbiased HAST","Temperature Cycling","Power Temperature Cycling","High Temperature Storage Life","High Temperature Operating Life","Early Life Failure Rate","NVM Endurance, Data Retention, and Operational Life","Wire Bond Shear","Wire Bond Pull","Solderability","Physical Dimensions","Solder Ball Shear","Lead Integrity","X-ray / CSAM","Electronic Discharge\nHuman Body Model ","Electronic Discharge\nCharged Device Model","Latch up","Electrical Distribution","Fault Grading","Characterisation","Electromagnetic Compatibility","Soft Error Rate","Hermetic Package Test","Package Drop","Lid Torque","Die Shear","Internal Water Vapor","Board Level Reliability","Low Temperature Storage Life","Start Up and Temperature Steps","MCM Drop Test","Destructive Physical Analysis","X-ray","Acoustic Microscopy",null,"Whisker test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution","Remarks"]
[null,null,null,"Assessment of impact regarding following aspects\n  - contractual agreements\n  - technical interface of handling/processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Potential impact?",null,"Understanding of semiconductors experts ","Examples to explain","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: Not relevant for qualification matrix",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"X-ray / CSAM",null,null,null,null,"Fault Grading",null,"Electromagnetic Compatibility"]
[null,null,"ID","Type of change","No","Yes",null,null,null,null,null,null,null,"THB","AC","TC","PTC","HTSL","HTOL","ELFR","EDR","WBS","WBP","SD","PD","SBS","LI","XRAY","HBM","CDM","LU","ED","FG","CHAR","EMC","SER","MECH","DROP","LT","DS","IWV","BLR","LTSL","STEP","MCM DROP","DPA","XRAY","AM"]
[null,"Headings",null,"ANY",null,null,null,null,null,null,null,null,null,"A2","A3","A4","A5","A6","B1","B2","B3","C1","C2","C3","C4","C5","C6","C7","E2","E3","E4","E5","E6","E7","E8","E9","G1-4","G5","G6","G7","G8","H1","H2","H3","H4","H5","H6","H7"]
[null," ","MCM-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.",null,"*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null," ","MCM-AN-02","Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below.","P","P","Any change which is not covered in the matrix below, but risk assessment at customer is recommended.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DATA SHEET"]
[null,null,"MCM-DS-01","Change of data sheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update of data sheet because of technical change of the product.","e.g. recommendations for pull-up/pull-down or NC pins, MSL","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MCM-DS-02","Correction of data sheet / errata","I","I","No technical change of product, process or test.\nNew description of behaviour which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Info note contains this type of change!\nAssessment in application required!","e.g. Errata","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MCM-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. No technical change of the product.\n(I): Definition of new parameter which was not documented before.\n(P): Not known as single change. Only in combination with other changes. ","(I): e.g. adding new tested parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DESIGN"]
[null,null,"MCM-DE-01","Firmware modification","I","P","Integrated software by design or memory as defined by supplier.\n(I): Firmware modification or update without effect of functional performance at the customer (bug fix).\n(P): Firmware modification or update with effect of functional or reliability performance at the customer.","(I): e.g. addition of Firmware opportunities\n(P): e.g. bug fix with impact on functional performance","A",null,"-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null," ","MCM-DE-02","Change that adds or subtracts sub-components from the module BOM","P","P",null,"e.g. addition of passive elements in filter circuit","A",null,"-","●","●","@●","●","●","@●","@●","●","●","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","M","@●,D","-","-","@F","-","-","-","-","-","-","-","-","-","-","●"]
[null," ","MCM-DE-03","Substrate change affecting module schematic\n(Changes to the internal dimensions and / or schematics)","P","P","Design change and routing\nChange in substrate, leadframe dimensions which has impact to the specified electrical parameter acc. data sheet or specification (e.g. heat sink, pin dimensions, die paddle size, ...)\nNot included: Variation within specification.",null,"A","if the number of layer will be changed see also PA-09","-","●","●","@●","●","●","@K","-","●","●","-","@●","@●","-","-","-","-","-","●","●","●","●","●","●","●","M","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","●"]
[null,"Headings",null,"PROCESS - ASSEMBLY - MATERIALS"]
[null,null,"MCM-PA-01","Replacement of any sub-component by a Non-AEC qualified sub-component","P","P","Change from an AEC Qualified sub-component to a Non-AEC Qualified sub-component or\nChange from a Non-AEC Qualified sub-component to another Non-AEC Qualified sub-component",null,"A",null,"-","●","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","●","●","●","●","●","●","●","M","@●,D","@●","-","@F","-","-","-","-","-","@●","@●","@●","-","-","●"]
[null,null,"MCM-PA-02","\nReplacement of any sub-component by an AEC qualified sub-component ","P","P","Change from one AEC Qualified sub-component to\nanother AEC Qualified sub-component\nChange from a Non-AEC Qualified sub-component to an AEC Qualified sub-component\ne.g. with impact on electrical robustness (ESD, latch up, …) electrical functionality, test coverage",null,"A","Requires additional evidence that new sub-component is AEC qualified","-","●","●","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","●","●","●","●","●","●","●","M","@●,D","@●","-","@F","-","-","-","-","-","@●","@●","@●","-","-","●"]
[null," ","MCM-PA-03","Replacement of any sub-component by an AEC qualified sub-component \nCritical characteristics of sub-component are not affected","I","P","Critical characteristics are those which have the greatest effect on form, fit, function, yield, and/or reliability. Use of SPC controls and 100% testing are common.",null,"C","Requires additional evidence that new sub-component is AEC qualified","-","●","●","-","-","-","-","-","@●","-","@●","-","-","-","-","-","-","-","@●","@●","@●","@●","@●","●","●","@M","@●,D","@●","-","@F","-","-","-","-","-","@●","@●","@●","-","-","●"]
[null," ","MCM-PA-04","Change within a sub-component that has been requalified\nCritical characteristics of sub-component are affected","P","P","Critical characteristics are those which have the greatest effect on form, fit, function, yield, and/or reliability. Use of SPC controls and 100% testing are common.",null,"A","Requires additional use of the appropriate ZVEI DeQuMa (e.g. active, passive component) for qualification of the changed sub-component","-","●","●","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","●","●","●","●","●","●","●","M","@●,D","-","-","@F","-","-","-","-","-","-","-","-","-","-","●"]
[null,null,"MCM-PA-05","Change within a sub-component that has been requalified\nCritical characteristics of sub-component are not affected","I","P","Critical characteristics are those which have the greatest effect on form, fit, function, yield, and/or reliability. Use of SPC controls and 100% testing are common.",null,"C","Requires additional use of the appropriate ZVEI DeQuMa (e.g. active, passive component) for qualification of the changed sub-component","-","●","●","-","-","-","-","-","@●","-","@●","-","-","-","-","-","-","-","@●","@●","@●","●","@●","@●","●","@M","@●,D","-","-","@F","-","-","-","-","-","-","-","-","-","-","●"]
[null,null,"MCM-PA-07","Change to the processes used in module assembly (e.g., pick & place, die attach, bonding, reflow, encapsulation, singulation, die overcoat, underfill, die preparation, die clean)","-","P","(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(--): e.g. tuning within process specification","C",null,"-","●","-","●","-","●","@K","-","@A","-","-","●","●","-","●","●","-","●","-","-","-","@H","-","@●","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","●"]
[null,null,"MCM-PA-08","Process integrity: tuning within specification","-","P","Variation within process specification\n(--): If tuning within process specification does not influence the integrity of the final product.\n(P): If impact on product specification is anticipated.","(--): e.g. process control","C",null,"-","-","-","-","-","-",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MCM-PA-09","Change to materials used in module assembly (e.g., adhesive, underfill, encapsulate, solder, epoxy, bump material, die attach material, bond wire, die overcoat, substrate, leadframe base material)","P","P","Change of used material  (e.g. bump material, die attach material, soft solder, epoxy, etc.)\nChange of bond wire material, diameter, change in bonding diagram","e.g. Stack die or die to substrate (flip chip)\ne. g. change to Pb-free material\ne. g. change of copper pillars\ne.g. change from Sn into Ni/Pd/Au\ne.g. in number of layers or thickness of the substrate","C","if routing is affected see also DE-03\nB: impact on thermomechanical stress caused by mismatch of mold compound, interconnecting technology and carrier is anticipated\nB: external lead finishing material is affected\n","-","●","●","●","-","●","@K","@●","@E","@E","-","●","●","●","●","●","●","-","-","-","-","●","-","@●","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","●"]
[null,null,"MCM-PA-10","Change of direct material supplier","-","P","Change of suppliers for direct materials which are used in assembly process (BOM).\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of wire material supplier.\n(P): e.g. change to new mold compound supplier\ne.g. additional leadframe supplier with specific leadframe manufacturing technology\ne.g. additional or new substrate supplier","C","Please check if material is changed!","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
[null,null,"MCM-PA-11","Change to assembly location\n(Move all or parts of production to a different assembly site)","P","P","Assembly transfer or relocation\nIncludes transfer as well as additional site","e.g. dual source / fab strategy","C","A or B: impact on other type of changes described under PROCESS  ASSEMBLY and SEM-EQ-01.\n\nIn case of Cu wire product please consider \nAEC-Q006.","●","●","-","●","●","●","@K","-","●","●","-","●","●","●","●","@T","●","-","-","-","-","●","-","@●","-","-","-","-","-","-","-","-","-",null,null,"@●",null,"-",null,"@●","●","Whisker tests have to be done on monitoring basis!\n\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"MCM-PA-12","Change of product marking","I","P","Change of marking on device and / or change in process resulting in a new technology..\n(I): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(I): e.g. change of appearance (additional marking)\n(P): e.g. change from inked marking to laser marking\ne.g. marking of pin 1","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"PACKING/SHIPPING"]
[null,null,"MCM-PS-01","Packing/shipping specification change","P","P","Packing/shipping specification change.",null," *",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MCM-PS-02","Dry pack requirements change ","I","P","(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","(I): MSL 3 → MSL 1\n(P): MSL 1  → MSL 3","B","Please check if data sheet is affected (MCM-DS-01 or MCM-DS-02).","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MCM-PS-03","Change of carrier (tray, reel)","P","P","Change of carrier (tray, reel)",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MCM-PS-04","Change of labelling","I","P","Change of labelling also on reel.\n(I): Change of material label without impact on barcode.\n(P): Changes of material label information which affects data processing at customer.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of defined nomenclature for data processing","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"EQUIPMENT"]
[null,null,"MCM-EQ-01","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique.","Check which other type of change is applicaple due to this equipment change.","A","Check which other type of change is applicaple due to this equipment change.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
[null,null,"MCM-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","-","P","PCN required for dedicated equipment for sensitive component production.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. extension of existing equipment pool\n(P): e.g. extension of dedicated equipment in case basic technology still need to be proven","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"MCM-EQ-03","Change to testing platform\n(Change in final test equipment type leading to a different test concept) ","P","P","Change of tester platform with differences in HW or SW that makes a change in test concept necessary ","e. g. change tester equipment from LTX to Teradyne","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Gage R&R / delta correlation"]
[null,"Headings",null,"TEST FLOW"]
[null,null,"MCM-TF-01","Change to testing location\n(Move of all or part of the final test to a different test site)","P","P","Tester transfer or relocation. \nCheck impact on MCM-AN-01\nIncludes transfer as well as additional site","Dual source strategy","C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Gage R&R / delta correlation"]
[null,"Headings",null,"Q-GATE"]
[null," ","MCM-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","-","P","e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. test implemented without customer requirement\n(P): e.g. reduction from three temperature measurements to two temperature measurements\ne.g. change in burn in / run in process.","C",null,"●","-","-","-","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","●","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Parameter Analysis: Delta correlation\n\n* For \"burn in\" changes ELFR recommended \n\nIn case of introduction of new test flow steps consider assessment of influence on product reliability."]
[]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) "]
[]
[null,null,null,"Reason for exception of tests and/or usage of generic data: "]
[]
[]
[]
[]
[]
[null,null,"--","Not required."]
[null,null,"I","Information Note required."]
[null,null,"P","PCN required."]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," "]
[]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the appropriate process change.\nA @ recommended additionally by ZVEI. "]
[]
[]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","die preparation and/or die clean"]
[null,null,"B","For symbol rework, new cure time, temp "]
[null,null,"C","If bond to leadfinger (requirement in Q100)"]
[null,null,"D","G1 - G3; no G4"]
[null,null,"E","only for bare die and change of mold compound"]
[null,null,"F","bare die sub-component only"]
[null,null,"H","processes for material in direct contact with die surfaces "]
[null,null,"K","For devices requiring PTC (requirement in Q100)"]
[null,null,"M","Applicable for subcomponents with > 1M SRAM or DRAM per AEC-Q100"]
[null,null,"T","Only for Solder Ball SMD (requirement in Q100)"]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Acoustic Microscopy"]
[null,null,"B","If not laser etched",null,null,null,null,null," "]
[null,null,"C","Only for Leadframe Plating change"]
[null,null,"D","Only for Lead Finish change"]
[null,null,"E","If Applicable"]
[null,null,"F","Finite Element Analysis"]
[null,null,"G","Generic Data available"]
[null,null,"H","Hermetic device only"]
[null,null,"I","Infant Mortality Rate"]
[null,null,"M","Power MOS/IGBT devices only"]
[null,null,"P","CV Plot (MOS only)"]
[null,null,"R","Spreading Resistance Profile"]
[null,null,"S","Steady State Mortality Rate"]
[null,null,"X","X-Ray"]
[null,null,"Z","For backside operation changes"]
[null,null,1,"If bond pads are affected"]
[null,null,2,"Verify #2 (package) post"]
[null,null,3,"Only for changes at the periphery"]
[null,null,4,"Only for oxide etches or etches prior to oxidation"]
[null,null,5,"For source or channel region changes"]
[null,null,6,"For field termination changes"]
[null,null,7,"For passivation changes"]
[null,null,8,"For contact changes"]
[null,null,9,"For epitaxial changes"]
[null,null,0,"Required for Schottky barrier changes."]
[null,null,"#","Glass Transition Temperature"]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
[]
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[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-","-","-","-",null,"-",null,"-",null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-"]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-","-","-","-",null,"-",null,"-",null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-"]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-","-","-","-",null,"-",null,"-",null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-"]

{"sheet":"Passive Components","index":7,"n_rows":500,"n_cols":47,"rows_kept":500,"cut":false,"hidden":false,"merged":[[465,2,465,7],[467,2,467,7],[469,2,469,7],[484,2,484,5],[471,2,471,8],[472,2,472,8],[5,30,6,30],[5,31,6,31],[5,35,6,35],[5,36,6,36],[5,32,6,32],[5,33,6,33],[6,4,6,5],[5,13,6,13],[5,14,6,14],[5,11,7,11],[5,12,7,12],[6,6,7,6],[6,7,7,7],[6,8,7,8],[5,9,7,9],[5,10,7,10],[5,6,5,7],[5,16,6,16],[5,17,6,17],[5,27,6,27],[5,22,6,22],[5,23,6,23],[5,24,6,24],[5,25,6,25],[5,26,6,26],[5,18,6,18],[5,19,6,19],[5,46,6,46],[5,28,6,28],[5,37,6,37],[5,29,6,29],[5,15,6,15],[5,20,6,20],[5,21,6,21],[5,34,6,34],[5,44,6,44],[5,45,6,45],[5,38,6,38],[5,39,6,39],[5,40,6,40],[5,41,6,41],[5,42,6,42],[5,43,6,43],[3,11,3,45],[4,44,4,45],[1,0,1,2],[2,0,2,2],[3,0,3,2],[4,0,4,2],[4,13,4,43]]}
[]
["Worked on:\n (Name, Function)",null,null,"Max Mustermann"]
["Signature:"]
["Date:",null,null,null,null,null,null,null,null,null,null,"Device evaluation"]
["PCN number:",null,null,null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q200 Revision D)",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q200"]
[" ",null,null,null,null,null,{"$f":"Guidance!A9","v":"Form provided by ZVEI -  Revision 5.0  -  December 2021"},null,"Evaluation level\n A / B / C","Further applicable conditions","Line evaluation\n(can be evaluated by data or audit/on site check)","AEC-Q200 Revision D","Check of specification \n(for raw material only)","High Temp Exposure (Storage)","Temperature Cycling","Destructive Physical Analysis","Moisture Resistance","Biased Humidity","Operational Life","External Visual","Physical Dimension","Terminal Strength (Leaded)","Resistance to Solvents","Mechanical Shock","Vibration","Resistance to Soldering Heat","Thermal Shock","Electrostatic Discharge (ESD)","Solderability","Electrical Characterization","Flammability","Board Flex","Terminal Strength (SMD)","Beam Load Test","Flame Retardance","Rotation Life","Surge Voltage","Salt Spray","Electrical Transient Conduction","Shear Strength","Fault Current Durability","End-of-Life Mode Verification","Jump Start Endurance","Load Dump Endurance","Whisker Test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution","Remarks"]
[null,null,null,"Assessment of impact regarding following aspects\n  - contractual agreements\n  - technical interface of handling/processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Potential impact?",null,"Understanding of component experts ","Examples to explain","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: Not relevant for qualification matrix"]
["Selection of\n component",null,"ID","Type of change","No","Yes",null,null,null,null,null,null,null,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21,22,23,24,25,27,29,30,31,32,33,34,35]
["NETWORKS & RESISTORS","Headings",null,"NETWORKS & RESISTORS"]
["NETWORKS & RESISTORS","Headings",null,"ANY"]
["NETWORKS & RESISTORS",null,"PAS-RES-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["NETWORKS & RESISTORS","Headings",null,"DATA SHEET"]
["NETWORKS & RESISTORS",null,"PAS-RES-DS-01","Change of data sheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"MATERIAL"]
["NETWORKS & RESISTORS",null,"PAS-RES-MA-01","Change of material composition - Ink/Wire material of Resistor element","P","P","Change of Ink / Wire material","e.g. resistor paste, NiCr, resistor wire, bulk metals  ","C",null,"-","●","●","●","●","-","-","-","●","-","-","W","-","-","-","-","●","F","-","B","-","●","●","-","R","-","-","-","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-MA-02","Change of material composition - Ink/Wire material of Terminal element","P","P","Change of Ink / Wire material","e.g.  AgPd paste, Ag paste,  lead wire , NiCr for side termination","B",null,"-","●","●","●","●","-","-","-","●","-","-","W","-","-","-","-","●","F","-","B","-","●","●","-","R","-","-","-","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-MA-03","Change of material composition - Package/ Mold","P","P","Change of Package","e.g. for chip res.: final coating, epoxy","B","Consider potential change of CTE of material ","-","●","●","●","●","-","●","●","-","●","●","●","●","-","●","-","●","●","-","-","●","●","●","-","R","-","-","-","-","-","-","-","-","-","-","-","Check whether AOI at tier 1 can be affected."]
["NETWORKS & RESISTORS",null,"PAS-RES-MA-04","Change of material composition - Passivation","P","P","Change of Passivation /Inner protection","e.g. change of glass","C","B: in case geometric changes of resisitor design due risk of electro chemical reaction (e.g. corrosion, electro migration)","-","●","●","●","●","-","●","●","●","-","-","-","●","-","-","-","●","-","-","-","●","-","-","-","R","-","-","N","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-MA-05","Change of material composition - Substrate material","P","P","Change of substrate material\nsubstrate material class (AI2O3, etc.) will not be changed, only dopands will be changed",null,"C",null,"-","●","●","-","●","-","●","●","●","-","-","●","-","-","-","●","●","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-MA-06","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","e.g. for 2nd source purpose","C",null,"-","●","●","-","●","-","●","-","-","-","●","●","●","-","-","●","●","●","-","B","●","-","-","-","R","-","-","N","-","-","-","-","-","-","-","@●","Assumption material specification remains unchanged. Otherwise see change of material."]
["NETWORKS & RESISTORS","Headings",null,"DESIGN"]
["NETWORKS & RESISTORS",null,"PAS-RES-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of package",null,"B",null,"-","●","-","●","●","-","●","●","-","●","●","●","●","-","●","●","●","●","●","-","●","●","●","-","R","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-DE-02","Changes of inner construction - Passivation","-","P","Change of passivation/Inner protection","e.g.  change of glass, laquer, epoxy, ...","C","B: in case geometric changes of resisitor design due risk of electro chemical reaction (e.g. corrosion, electro migration)","-","●","-","●","●","-","●","●","●","-","-","-","●","-","-","-","●","-","-","-","●","-","-","-","R","-","-","N","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"PROCESS"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-01","Changes in process technology or manufacturing methods - Ink Fire","-","P","Change of ink fire process","e.g. change of firing profile\ne.g. change from normal atmospher to nitrogen atmospher","C",null,"●","●","-","-","●","-","-","-","●","-","-","R","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-02","Changes in process technology or manufacturing methods - Ink Print","-","P","Change of ink print process",null,"C",null,"●","●","-","●","●","-","-","-","●","-","-","R","-","-","-","-","●","-","-","B","-","R","R","-","R","-","-","-","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-03","Changes in process technology or manufacturing methods - Trim","-","P","Change of trim process","e.g. change from mill trimming to laser trimming","C",null,"●","●","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-04","Changes in process technology or manufacturing methods - Lead Form","-","P","Change of lead form process","e.g. change from bending to punching","B",null,"●","●","-","-","-","-","-","●","-","●","●","●","-","-","-","-","-","-","●","B","-","-","-","-","-","-","-","N","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-05","Changes in process technology or manufacturing methods - Termination Attach","-","P","Change of termination attach process","e.g. chip resistors: electroplating process\ne.g. welding of leads for through put devices.","B",null,"●","●","-","-","-","-","-","●","-","-","-","●","-","●","-","●","-","-","-","B","-","-","-","-","-","-","-","N","-","-","-","-","-","-","-","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-06","Changes in process technology or manufacturing methods - Marking","-","P","Change of marking process","e.g. change from tampon printing to laser marking","B",null,"●","●","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-07","Changes in process technology or manufacturing methods - Molding","-","P","Change of molding process",null,"B",null,"●","●","-","●","●","-","●","●","-","●","●","●","●","-","●","-","●","●","-","-","●","●","●","-","R","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-PR-08","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["NETWORKS & RESISTORS",null,"PAS-RES-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["NETWORKS & RESISTORS",null,"PAS-RES-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"PAS-RES-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["NETWORKS & RESISTORS",null,"PAS-RES-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e.g. new equipment supplier with different process concept","C",null,"●","●","-","-","●","-","●","-","●","-","-","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["NETWORKS & RESISTORS",null,"PAS-RES-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. additional equipment to increase production capacity\ne.g. replacement of same equipment","C",null,"●","●","-","-","●","-","●","-","●","-","-","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment. Performance test according to affected process change."]
["NETWORKS & RESISTORS",null,"PAS-RES-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["NETWORKS & RESISTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["NETWORKS & RESISTORS",null,"PAS-RES-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","●","-","-","●","●","●","-","B","-","●","●","-","R","-","-","N","-","-","-","-","-","-","@●","@●"]
["NETWORKS & RESISTORS",null,"PAS-RES-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["NETWORKS & RESISTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["NETWORKS & RESISTORS",null,"PAS-RES-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["INDUCTORS","Headings",null,"INDUCTORS"]
["INDUCTORS","Headings",null,"ANY"]
["INDUCTORS",null,"PAS-IND-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["INDUCTORS","Headings",null,"DATASHEET"]
["INDUCTORS",null,"PAS-IND-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","\ne.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"MATERIAL"]
["INDUCTORS",null,"PAS-IND-MA-01","Change of material composition - Bobbin Material","P","P","Material without magnetic function (\"Spulenkörper\") typically made by plastic material","e.g. change from Thermoset to Thermoplastic","B","A: in case the thermal or mechanical stability of bobbin is negatively affected","-","●","●","●","●","-","-","●","●","●","@●","-","-","●","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-MA-02","Change of material composition - Core Material","P","P","Change of core material, which is material with magnetic function","e.g. change from NiZn into MnZn","A",null,"-","●","●","@●","●","-","-","-","●","●","-","-","-","●","-","-","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS",null,"PAS-IND-MA-03","Change of material composition - Insulation Material","P","P","Change of insulation material","e.g. wire insulation, insulation tapes, …\ne.g. change from Polyurethane to Polyamide","C","Consider also if PAS-IND-DE-05 is affected\n\nA: in case of HV components (rated voltage >= 100V) (final judgemend by tier 1, if used in HV application)","-","●","●","●","●","-","-","●","●","●","-","-","●","-","-","●","●","A","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-MA-04","Change of material composition - Lead Material","P","P","Change of lead material","e.g. change from tin coverd to non-coverd lead material","B",null,"-","●","-","-","-","-","-","-","●","●","-","●","-","-","●","●","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["INDUCTORS",null,"PAS-IND-MA-05","Change of material composition - Mold Compound","P","P","Change of mold compound material","\ne.g. change to green mold","B",null,"-","●","●","●","●","-","●","●","●","●","-","-","●","●","-","-","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Electrical function affected if mechanical stress distribution changes. AOI, wave soldering and board coating has to be assessed. MSL might change."]
["INDUCTORS",null,"PAS-IND-MA-06","Change of material composition - Solder Material","P","P","Change of solder material at internal connection.","e.g. change of SnAgCu composition","B",null,"-","●","●","-","●","-","-","-","-","●","-","●","-","●","●","@●","●","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["INDUCTORS",null,"PAS-IND-MA-07","Change of material composition - Wire / Foil Material","P","P","Wire for wound inductors.\nFoil for multilayer inductors (inner electrode).","e.g. change of Cu composition","B","A: in case of wire wound inductors, where the wire is not 100% fixed by mold or epoxy within the inductor","-","●","●","@●","-","-","●","●","●","●","-","-","-","-","@●","-","-","●","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS",null,"PAS-IND-MA-08","Change of material composition - Glue","P","P","Foil for multilayer inductors (inner electrode).","e.g. change from glue A into glue B","C",null,"-","●","●","-","@●","-","-","@●","-","@●","-","-","-","-","@●","@●","-","-","@●","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Considere in case of core-core glue the air gap."]
["INDUCTORS",null,"PAS-IND-MA-09","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","e.g. for 2nd source purpose","C",null,"-","●","●","-","●","-","●","@●","-","●","●","●","-","-","-","-","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Assumption material specification remains unchanged. Otherwise see change of material."]
["INDUCTORS",null,"PAS-IND-MA-10","Change of material composition - Potting Material","P","P","Change of potting material","e.g. change from epoxy resin to silicon","C","A: If influence on other connections on PCB or laquer expected.","-","-","●","-","@●","-","-","@●","-","@●","@●","-","-","-","@●","@●","-","-","@●","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS","Headings",null,"DESIGN"]
["INDUCTORS",null,"PAS-IND-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Bobbin","I","P","Material without magnetic function (\"Spulenkörper\") typically made by plastic material","e.g. construction / dimension change of bobbin","B",null,"-","●","-","-","●","-","-","-","-","●","●","-","-","●","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS",null,"PAS-IND-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead/Terminals","I","P","Change of lead/terminals","e.g. Change of lead or terminal design (shape, dimension, …)","A",null,"-","●","-","-","-","-","-","-","-","●","●","●","-","-","●","●","-","●","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","@●","Effect regarding EMC relevant for high frequency only."]
["INDUCTORS",null,"PAS-IND-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure - Mold","I","P","Change of mold","e.g. new mold material with different color","B",null,"-","●","-","-","●","-","●","@●","-","●","●","-","●","●","-","-","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Parameter Analysis only for components where mold material has magnetic function"]
["INDUCTORS",null,"PAS-IND-DE-04","Changes of inner construction - Core Construction","-","P","Change of core construction, which is material with magnetic function","e.g. change from drum core & shield core into pot core & cover plate core","A",null,"-","●","-","-","●","-","-","-","-","●","●","-","-","●","●","-","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS",null,"PAS-IND-DE-05","Changes of inner construction - Insulation System","-","P","Change of insulation system\n\nAn electrical insulation system (EIS) is comprised of a unique combination of materials that have been verified for chemical compatibility when used at certain maximum temperatures. (see www.UL.com)","e.g. wire insulation, insulation tapes, mold, potting, …","C","A: in case of HV components (rated voltage >= 100V) (final judgement by tier 1, if used in HV application)","-","●","-","@●","-","-","-","●","●","●","●","-","●","-","-","●","-","A","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-DE-06","Changes of inner construction - Wire / Foil Construction","-","P","Change of wire / foil dimensions","e.g. change from round cross section to rectangular cross section\ne.g. from single wire to litz wire\n","B",null,"-","●","-","-","●","-","-","-","-","●","●","-","-","-","@●","-","●","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS",null,"PAS-IND-DE-07","Changes of termination, surface finish, shape, color, appearance or dimension structure - Potting Material","I","P","Change of potting dimension","e.g. change of potting (filling) height","C","If data sheet is affected (PAS-IND-DS-01)","-","-","-","-","@●","-","-","-","-","@●","@●","-","-","-","@●","@●","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS","Headings",null,"PROCESS"]
["INDUCTORS",null,"PAS-IND-PR-01","Changes in process technology or manufacturing methods - Insulation Strip","-","P","(Mechanical) removal of insulation.","e.g. change from mechanical removal to laser removal","B",null,"●","●","-","-","@●","-","●","-","-","●","-","-","●","-","@●","●","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Mechanical damage of wire,\nimpact on solderability in case of stripping process is affecting soldering area."]
["INDUCTORS",null,"PAS-IND-PR-02","Changes in process technology or manufacturing methods - Lead Prep. / Plating","-","P","Change of lead prep. / plating","e.g. change from hot dip tinning to electroplating","B",null,"●","●","-","-","●","-","-","-","-","●","-","●","-","-","●","●","●","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","-","Influence regarding reliability of solder joint."]
["INDUCTORS",null,"PAS-IND-PR-03","Changes in process technology or manufacturing methods - Terminal Attach","-","P","Connection of wire terminal and / or\nconnection of termination to core/bobbin.","e.g. change from manual winding to semi-automtic winding (winding of wire on terminal)","C",null,"●","●","-","-","●","-","●","@●","-","●","-","●","-","●","●","A","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","Increase of contact resistance."]
["INDUCTORS",null,"PAS-IND-PR-04","Changes in process technology or manufacturing methods - Marking","-","P","Change of marking process","e.g. change from ink marking to laser marking","B",null,"●","●","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PR-05","Changes in process technology or manufacturing methods - Molding","-","P","Change of molding process","e.g. change from one component molding to two component molding (other technology needed)","B",null,"●","●","-","●","●","-","-","●","●","●","●","-","●","●","-","-","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PR-06","Changes in process technology or manufacturing methods - Soldering Internal Connections","-","P","Change of soldering internal connection","e.g. change from hot tip tinning to resistance welding","C","B: in case solder connection is used as solder connection to PCB.","●","●","-","-","●","-","-","-","-","●","-","●","-","-","●","-","●","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PR-07","Changes in process technology or manufacturing methods - Winding Insulation","-","P","Change of winding - insulation","e.g. change from manual to automatic process","B",null,"●","●","-","@●","-","-","-","●","●","@●","-","-","●","-","-","●","-","A","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PR-08","Changes in process technology or manufacturing methods - Winding Wire","-","P","Change of winding - wire","e.g. change from semi-automatic winding to full automatic winding","C",null,"●","●","-","@●","-","-","●","-","●","●","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["INDUCTORS",null,"PAS-IND-PR-09","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PR-10","Changes in process technology or manufacturing methods - Potting","-","P","Change of potting process","e.g. change from manual potting process to automatic potting process","C",null,"●","-","-","-","@●","-","-","@●","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["INDUCTORS",null,"PAS-IND-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["INDUCTORS",null,"PAS-IND-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"PAS-IND-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["INDUCTORS",null,"PAS-IND-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e.g. introduction of potting process","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["INDUCTORS",null,"PAS-IND-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. duplication of existing winding machine","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["INDUCTORS",null,"PAS-IND-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["INDUCTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["INDUCTORS",null,"PAS-IND-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","-","●","@●","●","@●","-","●","-","-","-","●","●","-","-","B","-","-","●","-","-","-","-","-","-","-","-","-","-","-","@●","@●"]
["INDUCTORS",null,"PAS-IND-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["INDUCTORS",null,"PAS-IND-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.\nPCN required for dedicated final test reductions for sensitive parameters.","e. g. elimination of High-voltage measurement","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of final test flow."]
["INDUCTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["INDUCTORS",null,"PAS-IND-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","●","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["CERAMIC / TANTALUM","Headings",null,"CERAMIC / TANTALUM"]
["CERAMIC / TANTALUM","Headings",null,"ANY"]
["CERAMIC / TANTALUM",null,"PAS-CER-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["CERAMIC / TANTALUM","Headings",null,"DATASHEET"]
["CERAMIC / TANTALUM",null,"PAS-CER-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings",null,"MATERIAL"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-01","Change of material composition - Ceramic Binder","P","P","Binder material (ceramic)",null,"C",null,"-","●","●","-","●","●","-","-","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-02","Change of material composition - Tantalum Binder","P","P","Binder material (tantal)","e.g. change from wax 1 to wax 2","C",null,"-","●","●","-","●","●","-","-","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-03","Change of material composition - Dielectric","P","P","Dielectric change (ceramic only)\nceramic material class (BaTiO3, CaZrO3, etc.) will not be changed, only dopands will be changed","e.g. change from ceramic A into ceramic B","C",null,"-","●","●","●","●","●","-","●","●","-","-","●","●","●","●","-","●","●","-","B","-","C","-","●","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-04","Change of material composition - Electrode Attach","P","P","Electrode attach (only tantal, glue, carbon, Ag)","e.g. change of Ag particle size in conductive adhesive","C",null,"-","●","●","●","●","-","-","-","●","-","-","-","-","-","-","C","●","-","-","B","-","C","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-05","Change of material composition - Electrode Material","P","P","Electrode Material (only ceramic, inner elctrode)","e.g. change from spehric to flake shape (Ni paste)","C",null,"-","●","●","●","●","●","-","●","●","-","-","●","●","-","●","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-06","Change of material composition - Encapsulation","P","P","Encapsulation","e.g. change from epoxy1 into epoxy2","C","Consider effect on usage on coated PBA (printed board assembly)\n\nB: in case component is used in coated PBA (printed board assembly)","-","●","●","-","●","-","●","●","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Check whether AOI at Tier 1 can be affected"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-07","Change of material composition - Lead material / Termination","P","P","Lead material / Termination\nAll changes outside ceramic/tantal body","e.g. change from SnPb to pure Sn\ne.g. change of soft termination material\ne.g. change of any galvanic layer","B",null,"-","●","●","-","●","●","-","-","●","●","-","●","-","-","●","●","-","-","●","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-MA-08","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","\ne.g. for 2nd source purpose","C",null,"-","●","●","●","●","●","●","●","●","-","-","●","●","●","●","●","●","●","●","B","-","●","●","C","-","-","-","-","-","-","-","-","-","-","-","@●","Assumption material specification remains unchanged. Otherwise see change of material."]
["CERAMIC / TANTALUM","Headings",null,"DESIGN"]
["CERAMIC / TANTALUM",null,"PAS-CER-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter","I","P","Change of lead diameter\n(for soldered THT components)","e.g. change from 0.8mm into 0.6mm ","A",null,"-","●","-","-","●","-","●","●","●","●","●","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area","I","P","Change of Termination area","e.g. change in width of termination from 0.1 - 0.3 mm into 0.2 - 0.4 mm","B",null,"-","●","-","●","-","-","●","-","-","●","●","-","-","-","●","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure - Terminal Interface","I","P","Terminal interface","e.g. additional layer in termination","B",null,"-","●","-","●","●","●","●","●","●","-","-","●","-","●","●","●","-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-DE-04","Changes of inner construction - Electrode Thickness","-","P","Electrode thickness  (ceramic only)","e.g. Ni layer change from 2.5µm into 3.5µm","C",null,"-","●","-","●","●","●","-","-","●","-","●","-","-","●","●","-","●","●","-","B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["CERAMIC / TANTALUM",null,"PAS-CER-DE-05","Changes of inner construction - Layer Thickness","-","P","Layer thickness (dielectric thickness)","e.g. Ceramic layer thickness changes from 3µm into 5µm.","C",null,"-","●","-","●","●","●","-","●","●","-","●","●","-","●","-","-","●","●","-","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-DE-06","Changes of inner construction - Number of Layers","-","P","Number of layers (ceramic only). Allways in combination with PAS-CER-DE-05.","see also layer thickness","C",null,"-","●","-","-","C","C","-","C","C","-","C","-","-","C","-","-","C","C","-","B,C","-","@C","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings",null,"PROCESS"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-01","Changes in process technology or manufacturing methods - Dicing","-","P","Change of dicing","e.g. change from cutting to sawing","C",null,"●","●","-","●","●","-","●","●","-","●","●","-","●","●","-","-","-","-","-","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-02","Changes in process technology or manufacturing methods - Electrode apply","-","P","Electrode apply  (dielectric layer process)","e.g. change from wet to dry process","C",null,"●","●","-","C","-","-","-","C","-","-","-","-","-","-","-","C","C","C","-","B,C","-","C","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-03","Changes in process technology or manufacturing methods - Firing","-","P","Change of firing profile","e.g. seperation of decarbonization and firing profile.","C",null,"●","●","-","-","●","●","-","-","●","-","-","-","-","-","-","-","●","●","-","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-04","Changes in process technology or manufacturing methods - Lamination","-","P","Change of lamination / press techinque","e.g. stamp press to isostatic press","C",null,"●","●","-","-","-","●","-","●","-","-","-","-","-","-","-","●","●","-","-","B","-","●","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-05","Changes in process technology or manufacturing methods - Particle Size","-","P","Change of powder particle size. Allways in combination with PAS-CER-MA-03.","e.g. change D50 from 0.5µm into 0.4µm","C",null,"●","●","-","-","●","-","-","●","-","-","-","-","-","-","-","●","-","●","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-06","Changes in process technology or manufacturing methods - Screening/Printing","-","P","Change of screening / printing","e.g. change from screen printing into offset printing","C",null,"●","●","-","-","-","-","-","-","C","-","-","-","-","C","-","-","-","C","-","B,C","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-07","Changes in process technology or manufacturing methods - Termination","-","P","Change for termination preparation like plating or apply of termination base layer.","e.g. change in plating technology (final termination)\ne.g. change from dip in paste to platimg (apply)","B",null,"●","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PR-08","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["CERAMIC / TANTALUM",null,"PAS-CER-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["CERAMIC / TANTALUM",null,"PAS-CER-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"PAS-CER-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["CERAMIC / TANTALUM",null,"PAS-CER-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e.g. change from wet to dry technology.","C",null,"●","●","-","-","●","-","●","●","●","-","●","A","-","-","●","-","-","●","●","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["CERAMIC / TANTALUM",null,"PAS-CER-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. elimination of manual handling processes","C",null,"●","●","-","-","●","-","●","●","●","-","●","A","-","-","●","-","-","●","●","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["CERAMIC / TANTALUM",null,"PAS-CER-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["CERAMIC / TANTALUM","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["CERAMIC / TANTALUM",null,"PAS-CER-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","●","●","●","B","-","●","●","C","-","-","-","-","-","-","-","-","-","-","@●","@●"]
["CERAMIC / TANTALUM",null,"PAS-CER-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["CERAMIC / TANTALUM","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["CERAMIC / TANTALUM",null,"PAS-CER-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["Film capacitors","Headings",null,"FILM CAPACITORS"]
["Film capacitors","Headings",null,"ANY"]
["Film capacitors",null,"PAS-FLM-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["Film capacitors","Headings",null,"DATASHEET"]
["Film capacitors",null,"PAS-FLM-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings",null,"MATERIAL"]
["Film capacitors",null,"PAS-FLM-MA-01","Change of material composition - Sealing Compound","P","P","Typicaly change within epoxy or PU sealing without effect to mechanical properties.\nNote: Change from epoxy sealing into PU sealing (both direction) will lead to generate a new product.","e.g. change of epoxy or PU composition","C","A: in combination with PAS-FLM-DS-01 or if change of sealing compound with effect to mechanical properties. \n\nA:: in case of high voltage components (rated voltage >= 100V)\n(final judgement by tier 1, if used in HV application)","-","●","●","●","●","-","●","●","●","●","●","@●","●","●","●","-","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Consider vibration in application"]
["Film capacitors",null,"PAS-FLM-MA-02","Change of material composition - Package ","P","P","Change material of package","Change material of package,\ne.g. change from PBT to PPS\ne.g. change of glas fiber ratio","B",null,"-","●","●","-","●","-","-","●","●","●","●","●","@●","●","●","-","-","-","●","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Consider AOI and processability"]
["Film capacitors",null,"PAS-FLM-MA-03","Change of material composition - Lead/Termination","P","P","Change of Lead/Termination\nNote: If change of lead frame material leads to an ESR change, than change of data sheet (PAS-FLM-DS-01) has to be respected.","e.g. change of basis material from Cu to Fe\ne.g. change of finishing from SnPb to Sn","B","A: in combination with PAS-FLM-DS-01","-","●","●","-","-","-","●","-","-","-","●","●","-","●","-","●","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","-","Change of base material: Consider ESR, high frequency parameter"]
["Film capacitors",null,"PAS-FLM-MA-04","Change of material composition - Metal Spray (Schoop)","P","P","Change of Metal Spray (Schoop): Use different material for metal spray process for boxed and naked types","e.g. from Zn to Al","C","B: for naked SMD","-","●","●","-","@●","-","@●","-","@●","-","-","@●","-","@●","@●","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Consider ESR.\nSolderability Test for naked SMD components."]
["Film capacitors",null,"PAS-FLM-MA-05","Change of material composition - Film","P","P","Change of film material for boxed and naked types","e.g. change of additives (<1%) of film composition (same raw material)","C","B: for naked SMD","-","●","●","-","@●","-","-","@●","@●","@●","@●","-","-","-","-","@●","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["Film capacitors",null,"PAS-FLM-MA-06","Change of material composition - Metal Foil","P","P","Change of metal foil for inner electrode","e.g. change from Al to Al-Zn alloy","C",null,"-","●","●","-","@●","-","-","@●","@●","@●","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["Film capacitors",null,"PAS-FLM-MA-07","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer which are described above.","e.g. for 2nd source purpose","C","Check if other PAS-FLM-MA is affected","-","●","●","●","●","-","●","-","●","-","-","●","●","-","●","●","●","-","●","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","Assumption material specification remains unchanged. Otherwise see change of material."]
["Film capacitors","Headings",null,"DESIGN"]
["Film capacitors",null,"PAS-FLM-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter / Thickness","I","P","Change of lead diameter thickness\n(for soldered THT components)","e.g. change lead diameter from 0.5 to 0.4 mm\ne.g. change of thickness of terminal ","A",null,"-","●","-","-","@●","-","-","-","-","@●","@●","@●","-","@●","@●","-","-","-","-","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area","I","P","Changes of termination area are changes which are affecting the area for connection of component and PCB","e.g. change of termination layer thickness\ne.g. change in termination dimensions / shape","B",null,"-","●","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["Film capacitors",null,"PAS-FLM-DE-03","Changes of inner construction - Inner Connection","-","P","Change of inner connection","e.g. change from soldered connection to welded connection","C",null,"-","●","-","-","@●","-","-","-","@●","@●","-","@●","-","@●","@●","@●","-","-","-","@●","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance","I","P","Change of appearance.\n(I): Change in appaerance without  impact on product integrity.\n(P): Change in appaerance with  impact on product integrity. \nNote: Marking on device is defined as seperate change (PAS-FLM-PV-02).","e.g. change or adding of color on component","B","Check if MATERIAL is affected.\n","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-DE-05","Changes of inner construction - Film/Foil","-","P","Change of film or foil design","e.g. change to a different foil supplier.","C","A: in combination with PAS-FLM-DS-01","-","●","-","-","●","-","-","@●","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["Film capacitors",null,"PAS-FLM-DE-06","Changes of inner construction - Insulation System","-","P","Change of inner insulation to protect winding element against housing.","e.g. change of potting material\ne.g. change of number of inner insulation layers (depending of insulation material thickness)","C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["Film capacitors",null,"PAS-FLM-DE-07","Changes of termination, surface finish, shape, color, appearance or dimension structure - Package","I","P","Change of packaging","e.g. change of dimension or shape\ne.g. change of surface","B",null,"-","●","-","-","@●","-","@●","-","-","@●","@●","-","@●","@●","@●","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings",null,"PROCESS"]
["Film capacitors",null,"PAS-FLM-PR-01","Changes in process technology or manufacturing methods - Package","-","P","Change of resin filling or hardening process (relevant for boxed types only)","e.g. change in resin filling process (mixing, sequences, potting, …)\ne.g. change in hardening process (temperature, time, …)","C",null,"●","●","-","●","●","-","-","●","●","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-PR-02","Changes in process technology or manufacturing methods - Terminal Attach","-","P","Change Terminal Attach Process to winding element for boxed and nacked types","e.g. spraying and / or galvanic process,\ne.g. welding / soldering","C","B: for naked SMD","●","●","-","-","●","-","●","-","●","-","-","●","●","-","-","-","-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","Consider ESR.\nSolderability Test for naked SMD components."]
["Film capacitors",null,"PAS-FLM-PR-03","Changes in process technology or manufacturing methods - Winding","-","P","Change of winding, flattening or tempering process","e.g. change of tempering temperature","C",null,"●","●","-","●","-","-","-","@●","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-PR-04","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["Film capacitors",null,"PAS-FLM-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["Film capacitors",null,"PAS-FLM-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"PAS-FLM-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["Film capacitors",null,"PAS-FLM-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e.g. implementation of new machines","C",null,"●","●","-","-","●","-","●","@●","●","@●","@●","●","-","-","-","-","●","●","-","B","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Film capacitors",null,"PAS-FLM-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. extension of existing machine capacity","C",null,"●","●","-","-","●","-","●","@●","●","@●","@●","●","-","-","-","-","●","●","-","B","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Film capacitors",null,"PAS-FLM-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["Film capacitors","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["Film capacitors",null,"PAS-FLM-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","@●"]
["Film capacitors",null,"PAS-FLM-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["Film capacitors","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["Film capacitors",null,"PAS-FLM-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne.g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["QUARTZ CRYSTAL / SAW","Headings",null,"QUARTZ CRYSTAL / SAW"]
["QUARTZ CRYSTAL / SAW","Headings",null,"ANY"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"DATASHEET"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"MATERIAL"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-01","Change of material composition - Quartz Blank","P","P","A change of Quartz Blank is a\nvery rare case. Mainly for SAW-Filter ",null,"A",null,"-","●","●","●","●","-","-","-","●","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-02","Change of material composition - Base","P","P","Changing of the material of the base.","e.g. change from ceramic to epoxy","A",null,"-","●","●","-","●","-","@●","●","-","●","●","-","●","●","●","@●","@●","-","-","-","@●","●","●","-","-","-","-","-","-","@●","-","-","-","-","-","-","C0 may be influenced\nTemperature expansion coefficient may change"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-03","Change of material composition - Lead / Termination","P","P","Change of Lead/Termination","e.g. change of plating finish. (eg:Au, AgPd,Sn)","B",null,"-","●","●","-","●","-","-","-","-","●","●","●","●","-","●","●","-","-","●","B","-","●","●","-","-","-","-","@●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-04","Change of material composition - Sealing","P","P","Change of Glass Seal","e.g. change to lead free glass","B",null,"-","●","●","●","●","@●","●","●","●","●","-","●","●","●","●","●","●","-","-","B","-","●","●","-","-","-","-","@●","-","-","-","-","-","-","-","-","X-Ray inspection may be influenced when sealing is containing Pb"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-05","Change of material composition - Can / Cap","P","P","Changing of the material of the can/cap","e.g. change from metal to ceramic material","A",null,"-","●","●","@●","●","-","@●","●","@●","●","●","-","●","●","●","@●","@●","-","-","@B","-","●","-","-","-","-","-","@●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-06","Change of material composition - Blank Support","P","P","Change of Blank Support","e.g. change of glue (Silicone to Epoxy)\ne.g. change metal holders (old types)","C",null,"-","●","●","@●","●","-","@Y","@Y","●","-","-","-","-","●","●","@●","●","-","-","B","-","●","-","-","-","-","-","@Y","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-07","Change of material composition - Overmold","P","P","Change of Overmold","e.g. change to green mold compound\ne.g. change of filler particles","B",null,"-","●","●","●","●","@●","●","@●","@●","●","●","-","●","●","●","●","●","-","-","@B","●","●","●","-","-","-","-","@●","-","-","-","-","-","-","-","-","Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed."]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-08","Change of material composition - Case Sealing","P","P","Change of Case Sealing. Change of material for seam welding\nRelevant for components with ceramic base and metall cap.","e.g. change from solder paste to adhesive glue","C",null,"-","●","●","●","●","-","@Y","●","-","●","-","-","●","●","●","●","●","-","-","B","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Impedance my be influenced."]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-09","Change of material composition - Electrode","P","P","Change of Electrode material on crystal blank.","e.g. change from Au to Ag","C",null,"-","●","●","●","●","-","@Y","@Y","●","-","-","-","@Y","-","●","@●","●","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-10","Change of material composition - Insulator","P","P","Change of Insulator. \nOnly for leaded types\nNot relevant for typical SMD.","e.g. Insulating plate under crystal\ne.g.  Glass sealing for leads","B",null,"-","●","●","●","●","@●","●","-","@●","●","●","-","●","-","●","●","●","-","-","B","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-11","Change of material composition - Marking","P","P","Change of marking material","e.g. change of ink\ne.g. chemical to environmental friendly","B",null,"-","●","●","-","-","-","-","-","-","@●","-","-","@●","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","AOI check necessary!"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-MA-12","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","e.g. for 2nd source purpose","C",null,"-","●","●","-","●","-","●","-","●","●","●","●","●","●","●","-","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","Assumption material specification remains unchanged. Otherwise see change of material."]
["QUARTZ CRYSTAL / SAW","Headings",null,"DESIGN"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Base","I","P","Change of Base design","e.g. due to miniaturization purpose.","B",null,"-","●","-","●","●","-","@●","●","-","●","●","●","@●","●","●","@●","●","-","-","-","@●","●","●","-","-","-","-","-","-","@●","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead / Termination","I","P","Change of Lead/Termination design. Change geometry or terminal pad or lead form","e.g. change lead design to improve reliability.","B",null,"-","●","-","-","●","-","-","-","-","●","●","●","-","●","●","●","●","-","●","B","-","●","●","-","-","-","-","@●","-","-","-","-","-","-","-","-","C0 may be influenced\nReliabiliy of solder joints may be affected"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure - Can / Cap","I","P","Change of Can/Cap design","e.g. due to miniaturization purpose.","A",null,"-","●","-","@●","●","@●","●","●","-","●","●","-","@●","●","●","@●","●","-","-","B","-","●","-","-","-","-","-","@●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure - Package","I","P","Change of Package (Molded). Change the design of the package.\nNot relevant for typical SMD.","e.g. change from welded device to glued device (case sealing)","B",null,"-","●","-","@●","●","@●","●","@●","@●","●","●","●","●","●","●","●","●","-","-","B","●","●","●","-","-","-","-","@●","-","-","-","-","-","-","-","-","Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed."]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DE-05","Changes of termination, surface finish, shape, color, appearance or dimension structure - Insulator","I","P","Change of Insulator design. \nOnly for leaded types (old technology)\nNot relevant for typical SMD.",null,"B",null,"-","●","-","@●","@●","@●","@●","-","@●","●","●","-","●","-","@●","@●","@●","-","-","@B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DE-06","Changes of inner construction - Quartz Blank","-","P","Change of Quartz Blank design","e.g. change dimension of blank, add phase, electrode design, …","C",null,"-","●","-","-","●","-","-","-","@●","-","-","-","-","●","●","-","@●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-DE-07","Changes of inner construction - Blank Support","-","P","Change of Blank Support design","e.g. change design of glue shape\ne.g. change design of  metall supporter","C",null,"-","●","-","@●","●","-","@Y","@Y","●","-","-","-","-","●","●","@●","●","-","-","B","-","●","-","-","-","-","-","@Y","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"PROCESS"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-01","Changes in process technology or manufacturing methods - Quartz Blank","-","P","Change of Quartz Blank process","e.g. change of cutting or lapping technology","C",null,"●","●","-","-","●","-","-","-","●","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-02","Changes in process technology or manufacturing methods - Blank Etching / Cleaning","-","P","Change of Blank Etch/Clean process\nUsing different / new technology","e.g. change from liquid etching to plasma etching","C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","@●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-03","Changes in process technology or manufacturing methods - Electrode Formation","-","P","Change of Electrode Formation process","e.g. change from evaporation to sputtering","C",null,"●","●","-","-","●","-","-","-","●","-","-","-","-","-","●","-","@●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-04","Changes in process technology or manufacturing methods - Trimming","-","P","Change of Auto Trim process (Method of final frequency tuning)","e.g. change from evaporation to ion beam","C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","●","●","-","@●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-05","Changes in process technology or manufacturing methods - Bonding / Annealing","-","P","Change of Blank bonding / annealing process. Change of method how apply conductive material to base or blank",null,"C",null,"●","●","-","●","●","@●","@Y","@Y","●","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","@Y","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-06","Changes in process technology or manufacturing methods - Can / Cap Attaching","-","P","Change of Cap/Can attaching process","e.g. change of the sealing process\ne.g. change  from batch oven to reflow oven","C",null,"●","●","-","●","●","@●","@Y","●","●","●","●","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-07","Changes in process technology or manufacturing methods - Molding","-","P","Change of Overmolding process. Not relevant for typical SMD.","e.g. change of overmold process parameter","C",null,"●","●","-","@●","●","@●","●","@●","@●","●","●","@●","-","●","●","-","●","-","-","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-08","Changes in process technology or manufacturing methods - Marking","-","P","Change of Marking process","e.g. change from inked marking to laser marking\ne.g. marking of pin 1\ne.g. change of appearance (additional marking)","B",null,"●","●","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","AOI check necessary!"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-09","Changes in process technology or manufacturing methods - Aging","-","P","Change of Aging process. Typically no aging done on quartz crystals.","If aging is done: e.g. change of times or temperatures","C",null,"●","●","-","@●","-","-","-","-","-","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PR-10","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material \ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e. g. new equipment supplier with different process concept","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","\ne.g. additional equipment to increase production capacity\ne.g. replacement of same equipment","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["QUARTZ CRYSTAL / SAW","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","●","●","●","●","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","@●"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["QUARTZ CRYSTAL / SAW","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["QUARTZ CRYSTAL / SAW",null,"PAS-QUA-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["Al-Cap","Headings",null,"ALUMIUM ELECTROLYTIC CAPACITORS"]
["Al-Cap","Headings",null,"ANY"]
["Al-Cap",null,"PAS-ALU-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.\nSee processability on board level.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["Al-Cap","Headings",null,"DATASHEET"]
["Al-Cap",null,"PAS-ALU-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings",null,"MATERIAL"]
["Al-Cap",null,"PAS-ALU-MA-01","Change of material composition - Housing","P","P","Change of housing","e.g. change Al alloy for housing","C","Consider effect on surface tension, mechanical robustness or thermal properties\n\nB: only if a cap holder holds the capacitor body by pressing.\n\n","-","●","●","-","●","-","●","-","-","-","●","-","-","●","@●","-","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-MA-02","Change of material composition - Sealing","P","P","Change of sealing","e.g. change of rubber compound\ne.g. change of sealing disc material (axial, Snap in) ","C","B: in case of external surface of sealing is changed.\n\n(Consider gluing, laquering, coating of PCB, nano coating, washing, …)","-","●","●","-","●","-","●","●","●","●","●","-","●","-","@●","@S","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-MA-03","Change of material composition - External Insulation","P","P","Change of external insulation / sleeving","e.g. change from PVC into PET\ne.g. change of color","C","B: Only for glued capacitors.","-","●","●","@●","●","-","●","@●","●","●","●","-","●","-","-","@S","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Biased  Humidity test can be done without applying voltage."]
["Al-Cap",null,"PAS-ALU-MA-04","Change of material composition - Lead / Termination","P","P","Change of lead or outer termination.","e.g. change of lead from iron into copper\ne.g. change of lead finish from tin/lead into tin","B","A: in case of change of lead material \n(consider vibration, valid only when the al caps are not additionally fixed in the application)","-","●","●","-","-","-","-","-","-","-","-","●","-","-","●","●","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["Al-Cap",null,"PAS-ALU-MA-05","Change of material composition - Internal Insulation / Paper","P","P","Change of paper type / internal insulation","e.g. change of paper thickness 50 µm to 40µm","C","A: Only if impedance increase (delta characterization). Check if datasheet is affected (PAS-ALU-DS-01).","-","●","●","-","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●"]
["Al-Cap",null,"PAS-ALU-MA-06","Change of material composition - Electrolyte","P","P","Change of electrolyte","e.g. change in formulation","C","A: Only if impedance increase (delta characterization). Check if datasheet is affected (PAS-ALU-DS-01).","-","●","●","●","●","-","-","-","●","-","-","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●"]
["Al-Cap",null,"PAS-ALU-MA-07","Change of material composition - Tape Material","P","P","Change of closing tape material ","e.g. change of glue or basis material","C",null,"-","●","●","-","@●","-","-","-","@●","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-MA-08","Change of material composition - Base Plate","P","P","Change of base plate material","e.g. change of used plastic material","B",null,"-","●","●","-","@●","-","-","-","-","-","-","-","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-MA-09","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","e.g. for 2nd source purpose","C",null,"-","●","●","●","●","-","●","●","-","-","-","●","●","●","●","●","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected material.\nAssumption material specification remains unchanged. Otherwise see change of material."]
["Al-Cap","Headings",null,"DESIGN"]
["Al-Cap",null,"PAS-ALU-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Wire Diameter","I","P","Change of wire diameter","e.g. change from 0.8 into 0.6 mm wire diameter.","A",null,"-","●","-","-","-","-","-","-","-","-","-","●","-","-","●","-","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination","I","P","Change of termination appearance\nFor welded Al capacitors only. ","e.g. change from matt tin into bright tin.","B",null,"-","●","-","-","-","-","-","-","-","-","-","●","-","-","●","-","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["Al-Cap",null,"PAS-ALU-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance","I","P","Change of appearance\nNote: Marking on device is defined as seperate change (PAS-ALU-PV-02).","e.g. change of color/appearance\ne.g. change of safety vent shape","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure - Rubber Sealing","I","P","Change of rubber sealing stand-off shape (for radial)","e.g. change of profile / design","A",null,"-","●","-","-","-","-","-","-","-","-","@●","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-DE-05","Changes of inner construction - Aluminum Foil","-","P","Change of Al foil width","e.g. change of width","C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","@●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●"]
["Al-Cap",null,"PAS-ALU-DE-06","Changes of inner construction - Seperator","-","P","Change of seperator width","e.g. change of width","C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","@●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-DE-07","Changes of inner construction - Seperator Density","-","P","Change of seperator density","e.g. change of seperator density/resistivity","C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●"]
["Al-Cap",null,"PAS-ALU-DE-08","Changes of inner construction - Inner Connection","-","P","Change of inner connection","e.g. change of shape/dimension","C",null,"-","●","-","-","@●","-","-","-","-","-","-","@●","-","@●","@●","@●","-","-","-","@B","-","@●","@●","-","-","-","@●","-","-","-","-","-","-","-","-","@●","Terminal Strength (11) not for axial components without paddle tabs."]
["Al-Cap",null,"PAS-ALU-DE-09","Changes of inner construction - Closing Tape","-","P","Change of closing tape","e.g. change of dimension","C",null,"-","●","-","@●","-","@●","-","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-DE-10","Changes of inner construction - Foil","-","P","Change of foil type","e.g. change of etching level\ne.g. change of thickness","C",null,"-","●","-","@●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●"]
["Al-Cap","Headings",null,"PROCESS"]
["Al-Cap",null,"PAS-ALU-PR-01","Changes in process technology or manufacturing methods - Terminal Attach","-","P","Change of terminal attach process","e.g. change of stitching / welding layout","C",null,"●","●","-","-","●","-","-","-","-","-","-","●","-","●","@●","●","@-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","Terminal Strength (11) and Vibration (14) not for axial components without paddle tabs."]
["Al-Cap",null,"PAS-ALU-PR-02","Changes in process technology or manufacturing methods - Winding","-","P","Change of winding process","e.g. change of material disposition (order of paper/foil)","C",null,"●","●","-","-","●","-","-","-","●","-","-","-","-","-","●","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["Al-Cap",null,"PAS-ALU-PR-03","Changes in process technology or manufacturing methods - Impregnation","-","P","Change of impregantion","e.g. change of bulk process into individual impregnation","C",null,"●","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●","Surge voltage test for high voltage components only."]
["Al-Cap",null,"PAS-ALU-PR-04","Changes in process technology or manufacturing methods - Assembly","-","P","Change of assembly process","e.g. change of sealing method\ne.g. change of assembly process sequence","C",null,"●","●","-","-","@●","-","-","-","-","-","@●","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R: Depends on process change"]
["Al-Cap",null,"PAS-ALU-PR-05","Changes in process technology or manufacturing methods - Aging / Testing","-","P","Change of aging/testing process","e.g. change of timing, voltage or temperature of process","C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","R: Depends on process change"]
["Al-Cap",null,"PAS-ALU-PR-06","Changes in process technology or manufacturing methods - Trim & Form Leaded","-","P","Change of trim & form process (leaded)","e.g. change of tooling shape or bending procedure","B",null,"●","●","-","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Solderability may be influenced"]
["Al-Cap",null,"PAS-ALU-PR-07","Changes in process technology or manufacturing methods - Trim & Form SMD","-","P","Change of trim & form process (SMD)","e.g. change of tooling shape or bending procedure","B",null,"●","●","-","-","-","-","-","-","-","-","@●","-","-","-","@●","-","-","-","@●","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","Solderability may be influenced"]
["Al-Cap",null,"PAS-ALU-PR-08","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["Al-Cap",null,"PAS-ALU-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["Al-Cap",null,"PAS-ALU-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"PAS-ALU-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["Al-Cap",null,"PAS-ALU-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e. g. new equipment supplier with different process concept","C",null,"●","●","-","-","●","-","-","-","●","-","●","●","-","●","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Al-Cap",null,"PAS-ALU-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. additional equipment to increase production capacity\ne.g. replacement of same equipment","C",null,"●","●","-","-","●","-","-","-","●","-","●","●","-","●","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Al-Cap",null,"PAS-ALU-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["Al-Cap","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["Al-Cap",null,"PAS-ALU-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","@●","●","●","●","●","●","●","●","●","●","●","●","●","●","B","●","●","●","-","-","-","●","-","-","-","-","-","-","-","@●","@●"]
["Al-Cap",null,"PAS-ALU-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["Al-Cap",null,"PAS-ALU-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.\nPCN required for dedicated final test reductions for sensitive parameters.","e.g. elemination of additional impedance control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of final test flow."]
["Al-Cap","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["Al-Cap",null,"PAS-ALU-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["NTC","Headings",null,"NTC"]
["NTC","Headings",null,"ANY"]
["NTC",null,"PAS-NTC-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["NTC","Headings",null,"DATASHEET"]
["NTC",null,"PAS-NTC-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings",null,"MATERIAL"]
["NTC",null,"PAS-NTC-MA-01","Change of material composition - Ceramic Binder","P","P","Change of Binder Material to bind ceramics.",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","@●","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-MA-02","Change of material composition - Ceramic","P","P","Change of ceramic composition\nceramic material class will not be changed, only dopands will be changed","e.g. changes in additives amount","C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","●","@B","●","@S","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Parameter analyse only necessary if an anticipated impact on electrical performance.\nS = SMD device only"]
["NTC",null,"PAS-NTC-MA-03","Change of material composition - Inner Electrode","P","P","Change of inner electrode material (ink material). Valid in case of multilayer structures only.","e.g. change from AgPt material to AgPd material","C",null,"-","●","●","●","●","-","-","●","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-MA-04","Change of material composition - Encapsulation","P","P","Change of encapsulation material.","e.g. change of coating\ne.g. change of additives in an insulation.","B","A: Risk assessment on application level, if interaction with other material expected.\nConsider explicity usage where NTC is not mounted on PCB. ","-","●","●","●","●","-","●","@●","-","-","-","-","-","-","-","@●","●","-","-","@B","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Parameter analyse only necessary if an anticipated impact on electrical performance."]
["NTC",null,"PAS-NTC-MA-05","Change of material composition - Lead material / Termination","P","P","Change of lead or outer termination. Change of lead (finish) material, termination material or attachment material. ","e.g. change from SnPb to pure Sn","B","Risk assessment needed to evaluate compatibility of soldering process.","-","●","●","-","-","-","@●","@●","@●","-","-","@●","-","@●","-","-","-","@●","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-MA-06","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","e.g. for 2nd source purpose","C",null,"-","●","●","-","●","-","●","-","●","-","-","●","●","-","-","●","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","Assumption material specification remains unchanged. Otherwise see change of material."]
["NTC","Headings",null,"DESIGN"]
["NTC",null,"PAS-NTC-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter","I","P","Change of lead diameter\n(for soldered THT components)","e.g. change lead diameter from 0.5 to 0.4 mm","A",null,"-","●","-","-","-","-","@●","-","-","@●","@●","@●","-","-","-","-","-","-","-","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area","I","P","Change of termination area","e.g. change of termination layer thickness\ne.g. change in termination dimensions","B",null,"-","●","-","-","-","-","@●","-","-","@●","@●","-","-","-","-","-","-","-","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●","SMD components only!"]
["NTC",null,"PAS-NTC-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection","I","P","Change of inner connection","e.g. change from soldered connection to welded connection","C",null,"-","●","-","-","-","-","@●","@●","@●","-","-","@●","-","@●","-","-","-","@●","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance","I","P","Change of appearance.\nNote: Marking on device is defined as seperate change (PAS-FLM-PV-02).","e.g. change or adding of color on component\nMainly in combination with other changes!","B",null,"-","●","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-DE-05","Changes of inner construction - Electrode ","-","P","Change of electrode layer thickness or geometry. For multi-layer technology only.","e.g. change of electrode design","C",null,"-","●","-","-","@●","@●","-","-","-","-","@●","-","-","-","-","@●","@●","-","-","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-DE-06","Changes of inner construction - Layer Thickness","-","P","Change of ceramic layer thickness. For multi-layer technology only.","e.g. change from 1.5µm into 1.0µm ","C",null,"-","●","-","-","@●","@●","-","-","-","-","@●","-","-","-","-","@●","@●","-","-","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-DE-07","Changes of inner construction - Number of Layers","-","P","Change of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-NTC-DE-06.","see also layer thickness","C",null,"-","●","-","-","@●","@●","-","-","-","-","@●","-","-","-","-","@●","@●","-","-","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings",null,"PROCESS"]
["NTC",null,"PAS-NTC-PR-01","Changes in process technology or manufacturing methods - Lamination","-","P","Change of lamination / press technique technology","e.g. stamp press to isostatic press","C",null,"●","●","-","-","-","@●","-","@●","-","-","-","-","-","-","-","@●","@●","-","-","@B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-PR-02","Changes in process technology or manufacturing methods - Firing","-","P","Change of firing / sintering profile","e.g. temperature and / or time and / or atmosphere.  e.g. from tunnel to batch kiln.","C",null,"●","●","-","-","@●","@●","-","-","@●","-","@●","-","-","-","-","-","@●","@●","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-PR-03","Changes in process technology or manufacturing methods - Dicing","-","P","Change of dicing / slicing","e.g. change from cutting to sawing","C",null,"●","●","-","@●","@●","-","@●","@●","-","@●","@●","-","@●","@●","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-PR-04","Changes in process technology or manufacturing methods - Termination","-","P","Change for termination preparation like plating or apply of termination base layer.","e.g. change in plating technology (final termination)\ne.g. change from dip in paste to platimg (apply)","B",null,"●","●","-","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-PR-05","Changes in process technology or manufacturing methods - Electrode apply","-","P","Change of electrode apply. For multi layer technology only.","e.g. change of inner electrode lay down method.","C",null,"●","●","-","@●","-","-","-","@●","-","-","-","-","-","-","-","@●","@●","@●","-","@B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["NTC",null,"PAS-NTC-PR-06","Changes in process technology or manufacturing methods - Assembly","-","P","Change in assembly process for leaded or encapsulated devices.","e.g. soldering method for lead attach to element or coating / encapsulation process","B",null,"●","●","-","●","●","-","-","-","-","●","●","-","●","-","●","●","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-PR-07","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["NTC",null,"PAS-NTC-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["NTC",null,"PAS-NTC-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"PAS-NTC-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["NTC",null,"PAS-NTC-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e. g. change from wet to dry technology.","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["NTC",null,"PAS-NTC-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. elimination of manual handling processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["NTC",null,"PAS-NTC-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["NTC","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["NTC",null,"PAS-NTC-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","-","●","-","●","●","●","●","-","●","●","●","●","●","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","@●"]
["NTC",null,"PAS-NTC-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["NTC","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["NTC",null,"PAS-NTC-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of test coverage.\nR (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["PTC","Headings",null,"PTC"]
["PTC","Headings",null,"ANY"]
["PTC",null,"PAS-PTC-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.\nSee processability on board level.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["PTC","Headings",null,"DATASHEET"]
["PTC",null,"PAS-PTC-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings",null,"MATERIAL"]
["PTC",null,"PAS-PTC-MA-01","Change of material composition - Ceramic Binder","P","P","Change of Binder Material to bind ceramics.",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","@●","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-MA-02","Change of material composition - Ceramic","P","P","Change of ceramic composition\nceramic material class will not be changed, only dopands will be changed","e.g. changes in additives amount","C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","●","@B","●","@S","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Parameter analyse only necessary if an anticipated impact on electrical performance.\nS = SMD device only"]
["PTC",null,"PAS-PTC-MA-03","Change of material composition - Polymer","P","P","Change of polymer composition",null,"C",null,"-","-","●","@●","@●","-","@●","@●","@●","-","-","-","@●","-","-","@●","-","-","-","@B","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-MA-04","Change of material composition - Encapsulation","P","P","Change of encapsulation material.","e.g. change of coating\ne.g. change of additives in an insulation.","B","A: Risk assessment on application level, if interaction with other material expected.\nConsider explicity usage where PTC is not mounted on PCB.","-","●","●","●","●","-","●","@●","-","-","-","-","-","-","-","@●","●","-","-","@B","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Parameter analyse only necessary if an anticipated impact on electrical performance."]
["PTC",null,"PAS-PTC-MA-05","Change of material composition - Lead material / Termination","P","P","Change of lead (finish) material, termination material or attachment material. ","e.g. change from SnPb to pure Sn","B","Risk assessment needed to evaluate compatibility of soldering process.","-","●","●","-","-","-","@●","@●","@●","-","-","@●","-","@●","-","-","-","@●","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-MA-06","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","e.g. for 2nd source purpose","C",null,"-","●","●","-","●","-","●","-","●","-","-","●","●","-","-","●","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●","Assumption material specification remains unchanged. Otherwise see change of material."]
["PTC","Headings",null,"DESIGN"]
["PTC",null,"PAS-PTC-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter","I","P","Change of lead diameter\n(for soldered THT components)","e.g. change lead diameter from 0.5 to 0.4 mm","A",null,"-","●","-","-","-","-","@●","-","-","@●","@●","@●","-","-","-","-","-","-","-","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area","I","P","Change of termination area","e.g. change of termination layer thickness\ne.g. change in termination dimensions","B",null,"-","●","-","-","-","-","@●","-","-","@●","@●","-","-","-","-","-","-","-","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●","SMD components only!"]
["PTC",null,"PAS-PTC-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection","I","P","Change of inner connection","e.g. change from soldered connection to welded connection","C",null,"-","●","-","-","-","-","@●","@●","@●","-","-","@●","-","@●","-","-","-","@●","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance","I","P","Change of appearance.\nNote: Marking on device is defined as seperate change (PAS-PTC-PV-02).","e.g. change or adding of color on component\nMainly in combination with other changes!","B",null,"-","●","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-DE-05","Changes of inner construction - Electrode ","-","P","Change of electrode layer thickness or geometry.","e.g. change of electrode design","C",null,"-","●","-","-","@●","@●","-","-","-","-","@●","-","-","-","-","@●","@●","-","-","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-DE-06","Changes of inner construction - Layer Thickness","-","P","Change of ceramic layer thickness. For multi-layer technology only.","e.g. change from 1.5µm into 1.0µm ","C",null,"-","●","-","-","@●","@●","-","-","-","-","@●","-","-","-","-","@●","@●","-","-","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-DE-07","Changes of inner construction - Number of Layers","-","P","Change of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-PTC-DE-06.","see also layer thickness","C",null,"-","●","-","-","@●","@●","-","-","-","-","@●","-","-","-","-","@●","@●","-","-","-","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings",null,"PROCESS"]
["PTC",null,"PAS-PTC-PR-01","Changes in process technology or manufacturing methods - Lamination","-","P","Change of lamination / press technique technology","e.g. stamp press to isostatic press","C",null,"●","●","-","-","-","@●","-","@●","-","-","-","-","-","-","-","@●","@●","-","-","@B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-PR-02","Changes in process technology or manufacturing methods - Firing","-","P","Change of firing / sintering profile","e.g. temperature and / or time and / or atmosphere.  e.g. from tunnel to batch kiln.","C",null,"●","●","-","-","@●","@●","-","-","@●","-","@●","-","-","-","-","-","@●","@●","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-PR-03","Changes in process technology or manufacturing methods - Dicing","-","P","Change of dicing / slicing","e.g. change from cutting to sawing","C",null,"●","●","-","@●","@●","-","@●","@●","-","@●","@●","-","@●","@●","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-PR-04","Changes in process technology or manufacturing methods - Termination","-","P","Change for termination preparation like plating or apply of termination base layer.","e.g. change in plating technology (final termination)\ne.g. change from dip in paste to platimg (apply)","B",null,"●","●","-","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-PR-05","Changes in process technology or manufacturing methods - Electrode apply","-","P","Change of electrode apply. For multi layer technology only.","e.g. change of inner electrode lay down method.","C",null,"●","●","-","@●","-","-","-","@●","-","-","-","-","-","-","-","@●","@●","@●","-","@B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["PTC",null,"PAS-PTC-PR-06","Changes in process technology or manufacturing methods - Assembly","-","P","Change in assembly process for leaded or encapsulated devices.","e.g. soldering method for lead attach to element or coating / encapsulation process","B",null,"●","●","-","●","●","-","-","-","-","●","●","-","●","-","●","●","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-PR-07","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["PTC",null,"PAS-PTC-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["PTC",null,"PAS-PTC-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PAS-PTC-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["PTC",null,"PAS-PTC-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e. g. change from wet to dry technology.","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["PTC",null,"PAS-PTC-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. elimination of manual handling processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["PTC",null,"PAS-PTC-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["PTC","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["PTC",null,"PAS-PTC-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","-","●","-","●","●","●","●","-","●","●","●","●","●","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","@●","@●"]
["PTC",null,"PAS-PTC-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["PTC","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["PTC",null,"PAS-PTC-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of test coverage.\nR (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
["VDR","Headings",null,"VDR"]
["VDR","Headings",null,"ANY"]
["VDR",null,"PAS-VDR-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.","Not relevant for technical evaluation. ","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","P","P",null,"Technical interface means component terminals.\nSee processability on board level.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-"]
["VDR","Headings",null,"DATASHEET"]
["VDR",null,"PAS-VDR-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and / or AC/DC specification","P","P","Change of application relevant information \nNot included: Editorial changes.","e.g. tighten of electrical parameter distribution","A","Risk assessment depending on change for each application.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!!","e.g. data sheet correction because of new information about component behavior","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.\n(I): no influence\n(P): Risk assessment depending on change for each application to provide evidence of additional parametes (stat. evaluation)","e.g. adding new (tested) parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings",null,"MATERIAL"]
["VDR",null,"PAS-VDR-MA-01","Change of material composition - Ceramic Binder","P","P","Change of Binder Material to bind ceramics.",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","@●","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-MA-02","Change of material composition - Ceramic","P","P","Change of ceramic composition\nceramic material class (ZnO, etc.) will not be changed, only dopands will be changed","e.g. changes in additives amount","C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","@●","-","@●","@●","-","@●","@B","@●","@S","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-MA-03","Change of material composition - Electrode","P","P","Change of inner electrode material. Valid in case of multilayer structures only.","e.g. change from AgPt material to AgPd material","C",null,"-","●","●","@●","@●","-","-","@●","@●","-","-","-","-","-","-","-","-","@●","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-MA-04","Change of material composition - Encapsulation","P","P","Change of encapsulation material.","e.g. change of coating\ne.g. change of additives in an insulation.","B","A: Risk assessment on application level, if interaction with other material expected.","-","●","●","@●","@●","-","@●","@●","-","-","-","-","-","-","-","@●","@●","-","-","@B","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-MA-05","Change of material composition - Lead material / Termination","P","P","Change of lead (finish) material, termination material or attachment material. ","e.g. change from SnPb to pure Sn","B","Risk assessment needed to evaluate compatibility of soldering process.","-","●","●","-","-","-","@●","@●","@●","-","-","@●","-","@●","-","-","-","@●","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-MA-06","Change of supplier of material","-","P","Change to a new or additional material supplier at component manufacturer.","e.g. for 2nd source purpose","C",null,"-","●","●","●","●","-","●","-","●","-","-","●","-","-","●","●","-","●","●","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","@●","Assumption material specification remains unchanged. Otherwise see change of material."]
["VDR","Headings",null,"DESIGN"]
["VDR",null,"PAS-VDR-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure - Lead Diameter","I","P","Change of lead diameter\n(for soldered  THT components)","e.g. change lead diameter from 0.8 to 0.6 mm","A",null,"-","●","-","-","-","-","@●","-","-","@●","@●","@●","-","-","-","-","-","-","-","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure - Termination Area","I","P","Change of termination area","e.g. change of termination layer thickness\ne.g. change in termination dimensions","B",null,"-","●","-","-","-","-","@●","-","-","@●","@●","-","-","-","-","-","-","-","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●","SMD components only!"]
["VDR",null,"PAS-VDR-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure - Internal Connection","I","P","Change of inner connection","e.g. change from soldered connection to welded connection","C",null,"-","●","-","-","-","-","@●","@●","@●","-","-","@●","-","@●","-","-","-","@●","@●","@B","-","@●","@●","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure - Appearance","I","P","Change of appearance.\nNote: Marking on device is defined as seperate change (PAS-VDR-PV-02).","e.g. change or adding of color on component\nMainly in combination with other changes!","B",null,"-","●","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-DE-05","Changes of inner construction - Electrode ","-","P","Change of electrode layer thickness or geometry.","e.g. change of electrode design","C",null,"-","●","-","-","@●","@●","●","-","●","-","@●","-","-","-","-","@●","@●","-","-","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-DE-06","Changes of inner construction - Layer Thickness","-","P","Change of ceramic layer thickness. For multi-layer technology only.","e.g. change from 1.5µm into 1.0µm ","C",null,"-","●","-","-","@●","@●","●","-","●","-","@●","-","-","-","-","@●","@●","-","-","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-DE-07","Changes of inner construction - Number of Layers","-","P","Change of number of ceramic or electrode layers. For multi-layer technology only. Allways in combination with PAS-VDR-DE-06.","see also layer thickness","C",null,"-","●","-","-","●","@●","●","-","●","-","@●","-","-","-","●","@●","●","-","-","-","-","@●","@●","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-DE-08","Changes of inner construction - Grain size","-","P","Change of grain size. Grain size is a result of process and / or material change.","e. g. change of grain size.","C",null,"-","●","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-DE-09","Changes of inner construction - Grain boundary size","-","P","Change of grain boundary size. Grain boundary size is a result of process and / or material change.","e.g. change of grain boundary size.","C",null,"-","●","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR","Headings",null,"PROCESS"]
["VDR",null,"PAS-VDR-PR-01","Changes in process technology or manufacturing methods - Lamination","-","P","Change of lamination / press technique method","e.g. stamp press or isostatic press","C",null,"●","●","-","-","-","@●","-","@●","-","-","-","-","-","-","-","@●","@●","-","-","@B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-PR-02","Changes in process technology or manufacturing methods - Firing","-","P","Change of firing / sintering profile","e.g. temperature and / or time and / or atmosphere. e.g. from tunnel to batch kiln.","C",null,"●","●","-","●","●","@●","●","-","●","-","@●","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-PR-03","Changes in process technology or manufacturing methods - Dicing","-","P","Change of dicing ","e.g. change from cutting to sawing","C",null,"●","●","-","@●","●","-","@●","●","-","●","●","-","@●","@●","-","-","●","-","-","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-PR-04","Changes in process technology or manufacturing methods - Termination","-","P","Change for termination preparation like plating or apply of termination base layer.","e.g. change in plating technology (final termination)\ne.g. change from dip in paste to platimg (apply)","B",null,"●","●","-","●","●","-","-","-","●","-","●","●","-","-","@●","●","●","-","●","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-PR-05","Changes in process technology or manufacturing methods - Electrode apply","-","P","Change of electrode apply. For multi layer technology only.","e.g. change of inner electrode lay down method.","C",null,"●","●","-","@●","-","-","-","@●","-","-","-","-","-","-","-","@●","@●","@●","-","@B","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","@●"]
["VDR",null,"PAS-VDR-PR-06","Changes in process technology or manufacturing methods - Assembly","-","P","Change in assembly process for leaded or encapsulated devices.","e.g. soldering method for lead attach to element or coating / encapsulation process","B",null,"●","●","-","@●","@●","-","-","-","-","@●","@●","-","@●","-","@●","@●","-","-","@●","-","@●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-PR-07","Process integrity: tuning within specification","-","P","Variation within process specification.","e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["VDR",null,"PAS-VDR-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","e.g. number of pieces on reel.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-PN-02","Dry pack requirements change","I","P","Change of dry pack requirements.\n(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","e.g. change in dry pack assurance (HIC, MBB)\n(I): MSL 3 --> MSL 1\n(P): MSL 1 --> MSL 3","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","e.g. change by material\ne.g. change by geometry.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["VDR",null,"PAS-VDR-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-PV-02","Change of product marking","I","P","Marking on device.","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"PAS-VDR-PV-03","Change of packing/shipping specification","P","P","Change in packing specification which does not described a change of dimensions or material of the packing.","e.g. change of documentation in packing specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["VDR",null,"PAS-VDR-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.\nNote: Changes affecting the product not covered by the table require also a PCN.","e. g. change from wet to dry technology.","C",null,"●","●","-","-","●","-","●","-","●","-","-","●","-","-","●","-","-","●","-","B","-","-","-","-","-","-","@●","-","●","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["VDR",null,"PAS-VDR-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","PCN required for dedicated equipment for sensitive component production.","e.g. elimination of manual handling processes","C",null,"●","●","-","-","●","-","●","-","●","-","-","●","-","-","●","-","-","●","-","B","-","-","-","-","-","-","@●","-","●","-","-","-","-","-","-","@●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["VDR",null,"PAS-VDR-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.\nPCN required for dedicated equipment for sensitive parameters.","e.g. change of tester platform","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Gage R&R / delta correlation"]
["VDR","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["VDR",null,"PAS-VDR-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.\nIncludes transfer as well as additional site.\nNote: Reorganization inside one plant/site is not affected!","e.g. movement or transfer of manufacturing site or process step(s) to a different location/site.\n\ne.g. dual source / fab strategy ","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","-","●","●","●","●","●","●","B","-","●","●","@●","-","-","-","-","●","-","-","-","-","-","@●","@●"]
["VDR"," ","PAS-VDR-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","e.g. washing / cleaning process\ne.g. change of order of processes","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","Characterisation depends on impact of production flow."]
["VDR","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["VDR",null,"PAS-VDR-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne.g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process."]
[]
[]
[null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) "]
[]
[null,null,"Reason for exception of tests and/or usage of generic data:"]
[]
[]
[]
[]
[]
[null,null,"--","Not required",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," "]
[null,null,"I","Information Note required"]
[null,null,"P","PCN required",null,null,null," "]
[null,null,null," "]
[]
[]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the appropriate process change.\nA \"@\" is recommended additionally by ZVEI"]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Termination equipment only",null,null,null,null,null,null,null," "]
[null,null,"C","Ceramics only"]
[null,null,"B","Comparative data (unchanged vs. changed) required"]
[null,null,"E","Capacitive trimmers only"]
[null,null,"F","Film products only"]
[null,null,"N","Networks only"]
[null,null,"R","Resistors only"]
[null,null,"S","SMD components only"]
[null,null,"W","Wirewound products only"]
[null,null,"Y","Component not hermitically sealed"]
[null,null,"Note 1:","For parts marked with ink only. Laser and stamp marked parts shall be exempt."]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]