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["DeltaQualificationMatrix"]
["Attention!\nIn case of a failure report when activating the macros, you might need to run the Microsoft Fixit https://support.microsoft.com/kb/3025036/en-us."]
["General\nShort product and technology cycles as well as new environmental regulations frequently result in process and material changes of components, printed circuit boards, assembly techniques and circuit layout which have to be evaluated. The ZVEI \"Guideline for Customer Notifications of Product and /or Process Changes (PCN) of Electronic Components specified for Automotive Applications” describes an appropriate methodology for dealing with changed electronic components. The qualification matrices in this guideline are recommendations for how to assess typical changes of electronic components. These recommendations promote an open risk-based discussion between supplier and customer regarding qualifications. \nThe DeltaQualificationMatrices were developed by the Industry Task Force Team \"PCN DeltaQualificationMatrix\" together with component experts from the ZVEI Working Group \"PCN-Methodology\". Actual content represents state-of-the-art technology and does not claim to be comprehensive. Deviation from proposed guideline should be mutually agreed as customer specific requirements have to be considered.\n"]
["DeltaQualificationMatrix Application (completion by component manufacturer)\na) This table has to be used for changes only. The matrices are not applicable for new product, \n     special qualifications (for instance for encapsulation of module) or Information Notes.\nb) If a change is not listed in this table, the qualification plan has to be defined and agreed\n    between customer and supplier.\nc) The matrix for Active Components requires the user to choose between integrated circuits\n    AEC-Q100 and discrete semiconductors AEC-Q101 (cell D4).  \n    For Passive Components AEC-Q200 is used. For Optoelectronic Components the AEC-Q102 is used. \n    For Multi-Chip-Modules the AEC-Q104 is used. For MEMS the AEC-Q103 is used.\nd) All changes as listed in the PCN have to be marked  by a cross (x) in column B and will \n    appear colored. The relevant reliability tests are then shown in \"Tests, which should be\n    considered for the appropriate process change\".   \ne) In \"Tests, which should be considered for the appropriate process change after selection of \n    condition table\" is for modification of the found relevant tests under consideration of the weight \n    of change. \n    Related table “Conditions” has to be assessed per proposed letters with an (x).\nf) In \"Suppliers performed tests\" the component manufacturer documents the planned and \n    performed tests.\ng) In case of deviations from tests, which should be considered this should be notified and\n    commented by the component manufacturer in the area \"Reason for exception of tests\". \n    Test results in form of generic data (G) are allowed when notified and justified."]
["Evaluation Levels are categorized as follows   \n\"C: Component level\": The evaluation of a change at component has to be done by the component manufacturer at the component only. Generic data from other relevant evaluations can be used.\n\n\"B: Board level\": The intended change described in the PCN may influence handling/processability/manufacturability of the component at the customer. Therefore, additional evaluation by the customer may be necessary.\n\n\"A: Application level\": The intended change described in the PCN may influence the properties of the application (e.g. ECU). In addition to the evaluation under C or B the influence of the change in the application is evaluated by suitable investigations by the customer. It has to be considered whether the application / assembly requirements are already sufficiently safeguarded by other qualifications (application-specific risk assessment).\n\n\" *: Not relevant for qualification matrix\": Changes which fulfill neither A,B nor C definitions\n"]
["Infomation Notes \nChanges indicated as “I” shall not be marked in the DeQuMa.  For those changes the Information Note sheet shall be used.  As the DeQuMa is desired for PCN only, a marking of “I”-changes would automatically influence evaluation level and test effort."]
[" Important Notes\n- To use the matrices in the right form the ZVEI working group provides a Tutorial on its homepage \n  (ZVEI-Tutorial )\n- ID number: is a unique identification number for each indicated change defined in the ZVEI PCN \n  DeltaQualificationMatrices. The same ID number is used in the PCN Form sheet to identify the \n  change.\n- Tests identified by the matrix have to be considered and checked if they are necessary to\n  assess the specific change. Test modifications or generic data have to be justified in detail.\n- \"Further applicable conditions\", comments and notes need attention, as they provide important \n  hints and limitations.\n- In order to use all functions in EXCEL, macros have to be allowed."]
[]
["Form provided by ZVEI -  Revision 5.0  -  December 2021"]
[]
[]
[]
["History"]
[]
["Version 0.2:  03.03.11"]
["Version 0.3:  15.04.11, Entwurf seitens Tier1 Continental AG, Hella KGaA Hueck & Co., Robert Bosch GmbH"]
["Version 0.4:  19.07.12, Anpassung des Entwurfs durch Dr. R. Winter (ZVEI), J. Uhlenhut (ELMOS) und Dr. O. Autzen (Robert Bosch GmbH) zum aktuellen Stand der \n                                  Matrix und dem einhergehenden Verständnis der Anwendung."]
["Version 0.5:  01.09.12, Bearbeitung durch Robert Bosch GmbH (AE/QMS-E-Abteilungen)"]
["Version 0.6:  08.10.12, Ergänzung und Nachträge aus ZVEI AK PCN Methodik durch Dr. R. Winter (ZVEI) und Dr. O. Autzen (Robert Bosch)"]
["Version 0.7:  23.10.12, Ergänzung und Nachträge aus ZVEI AK PCN Methodik durch Dr. R. Schmidt (Siemens AG) und Dr. O. Autzen (Robert Bosch)"]
["Version 0.8:  12.11.12, Überarbeitung von Rückmeldungen durch ZVEI Expertenkreis"]
["Version Final: 14.12.12. Korrektur der englischen Beschreibung (Spalte B dieses Blatt)  "]
["Version Final: 15.01.12. Anpassung deuutsche Beschreibung wg. Rechtsverbindlichkeit "]
["Version Final: 16.01.13. Verteilte Version an ZVEI AK jeweils mit und ohne Makros"]

{"sheet":"History","index":1,"n_rows":17,"n_cols":3,"rows_kept":17,"cut":false,"hidden":false,"merged":[[0,1,0,2]]}
[null,"History of DeQuMa "]
[]
[null,"Version","Remarks"]
[null,"2.0","Revised by ZVEI PCN Methodology Workgroup in March 2015"]
[null,"2.1","Released March 2015"]
[null,"2.1.1","Active Components - delete write protection in comments "]
[null,"2.2","Solved problems with some ActiveX configurations"]
[null,"2.2.2","Solved Problems in Active Components"]
[null,"2.2.3","Solved Problems ActiveX, Active Components  SEM-DE-02 (Design changes in routing) error fixed "]
[null,"2.2.4","Minor fixes"]
[null,"3.0","General Revision by ZVEI PCN Methodology Workgroup in June 2016\nChanges are indicated by underlining in the read only version named Changes_DeQuMa_rev3_vs_rev2.xlsx"]
[null,"3.0.4","Expert Release"]
[null,"3.0.5","Fixing of macro bugs"]
[null,"3.1","Final Release (orthographic and punctuation corrections) "]
[null,"4.0","General Revision by ZVEI PCN Methodology Workgroup in July 2019.\nMuliti Chip Modules newly added to DeQuMa \nLED Components now based on the AEC Q102 \nFurther Changes see separate PDF’s Excel-File, where changes are indicated by underlining "]
[null,"4.1","LED worksheet: Content of columns had been swapped due to rearrangement and omission of columns.  "]
[null,"5.0","General Revision by ZVEI PCN Methodology Workgroup in October 2021.\nAdd MEMS pressure sensor"]

{"sheet":"Definition","index":2,"n_rows":18,"n_cols":5,"rows_kept":18,"cut":false,"hidden":true,"merged":[[3,4,5,4],[11,3,14,4],[17,1,17,3]]}
["ZVEI123987","Scope: Die Deltaqualifikationsmatrix betrachtet nur Änderungen, die gem. ZVEI Guideline als PCN mitgeteilt werden müssen."]
[]
[null,"Assessment","Mindset:","Responsible","Criteria"]
[null,"A (application)","Specific ECU","Tier1","Who has the best means (test method, test structures, experiences, and efficency) for validating the change effects?\nSufficient coverage for approval of the change.\n"]
[null,"B (board level)","On test board or generic or family releases","Tier1"]
[null,"C (component)","Semiconductor, passive, and electromechanic component","Tier2"]
[]
[]
[null,null,"recommendation: to be deleted"]
[null,null,"additional / changed /split topic to original ZVEI PCN guideline"]
[]
["Interactions:","I","Wechselwirkung bewerten","Bei I ist die Wechselwirkung mit geeigneten Untersuchungen zu bewerten.\nMit R ist das Risiko einer möglichen Wechselwirkung zu betrachten und ggf. mit geeigneten Untersuchungen zu bewerten."]
["Risk assessment","R","Risikobetrachtung notwendig"]
[]
[]
[]
[]
["Electronic component change qualification","\n● or letter:  Test schould be considered\nG:  Generic data\nR:  Risk assessment",null,null,"Im AEC-Teil sind die Tests markiert, die zur Bewertung zu betrachten sind."]

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["Worked on:\n (Name, Function)",null,null,"Rishi Patel, Reliablity Engineer"]
["Signature:",null,null,"Rishi Patel "]
["Date:",null,null,"2023-12-06"]
["PCN number:",null,null,"23_0254",null,null,null,null,null,null,"Line evaluation\n(can be evaluated by data or audit/on site check)","Device evaluation",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Device evaluation"]
["For integrated circuits or discrete semiconductors select below:",null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q100 Revision H)\nincludes integrated circuits (e.g. ASICs, µ-Controller, memories, voltage regulators, smart power devices, logic devices, analog devices,... )",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q101 Revision E)\nincludes e.g. small signal diodes (bipolar - and Schottky diodes), small signal transistors, MOSFETS, IGBTs, power diodes, …",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q10x"]
[null,null,"  ",null,null,null,{"$f":"Guidance!A9","v":"Form provided by ZVEI -  Revision 5.0  -  December 2021"},null,"Evaluation level\n A / B / C","Further applicable conditions",null,"AEC-Q100 Revision H","Check of specification \n(for raw material only)","Temperature Humidity Bias or biased HAST","Autoclave or Unbiased HAST","Temperature Cycling","Power Temperature Cycling","High Temperature Storage Life","High Temperature Operating Life","Early Life Failure Rate","NVM Endurance, Data Retention, and Operational Life","Wire Bond Shear","Wire Bond Pull","Solderability","Physical Dimensions","Solder Ball Shear","Lead Integrity","Electromigration","Time Depending Dielectric Breakdown","Hot Carrier Injection","Negative Bias Temperature Instability","Stress Migration","Electronic Discharge\nHuman Body Model ","Electronic Discharge\nCharged Device Model","Latch up","Electrical Distribution","Characterisation","Electromagnetic Compatibility","Short Circuit Characterization","Soft Error Rate","Lead free","Hermetic Package Test","Package Drop","Lid Torque","Die Shear","Internal Water Vapor","AEC-Q101 Revision E","Check of specification \n(for raw material only)","Highly Accelerated Stress Test\nHigh Humidity High Temp. Reverse Bias\nHigh Temperature High Humidity Bias","Unbiased Highly Accelerated Stress Test\nAutoclave","Temperature Cycle","Temperature Cycling Hot Test\nTC Delamination Test\nWire Bond Integrity","Intermittent Operational Life\nPower and Temperature Cycle","High Temperature Reverse Bias\nAC blocking voltage\nSteady State Operational","High Temp. Gate Bias","Destruct. Phy. Analysis","Physical Dimensions","Wire Bond Strength","Wire Bond Shear","Die Shear","Terminal Strength","Resistance to Solvents","Resist. to Solder Heat","Thermal Resistance","Solderability / AEC-Q005","Whisker Growth","Constant Acceleration","Vibration Variable Frequency","Mechanical Shock","Hermeticity","Dielectric Integrity","External Visual","Parametric Verification","ESD Characterization","Unclamp.Induct.Switch","Short Circuit Reliability Characterization","Notes / Remarks","Whisker test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution",null,"Remarks"]
[null,null,null,"Assessment of impact regarding following aspects\n  - contractual agreements\n  - technical interface of handling/processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Potential impact?",null,"Understanding of semiconductors experts ","Examples to explain","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: Not relevant for qualification matrix",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Dielectric Integrity",null,null,null,"Unclamp.Induct.Switch",null,null,null,null,"For Cu Wire Products: Consider AEC-Q006"]
[null,null,"ID","Type of change","No","Yes",null,null,null,null,null,null,null,"THB","AC","TC","PTC","HTSL","HTOL","ELFR","EDR","WBS","WBP","SD","PD","SBS","LI","EM","TDDB","HCI","NBTI","SM","HBM","CDM","LU","ED","CHAR","EMC","SC","SER","LF","MECH","DROP","LT","DS","IWV",null,null,"HAST\nH3TRB\nHTHHB","UHAST \nAC","TC","TC Hot\nTC Delam\nWBI","IOL\nPTC","HTRB\nACBV\nSSOP","HTGB","DPA","PD","WBS","BS","DS","TS","RTS","RSH","TR","SD","WG","CA","VVF","MS","HER","DI","EV","PV","ESD","UIS","SCR"]
[null,"Headings",null,"ANY",null,null,null,null,null,null,null,null,null,"A2","A3","A4","A5","A6","B1","B2","B3","C1","C2","C3","C4","C5","C6","D1","D2","D3","D4","D5","E2","E3","E4","E5","E7","E9","E10","E11","E12","G1-4","G5","G6","G7","G8",null,null,"A2/alt \n(9/alt/a)","A3/alt\n(8/alt)","A4\n(7)","A4/a/alt\n(7ab)","A5/alt\n(10/alt)","B1/a/b\n(5/ac)","B2\n(6)","C1\n(12)","C2\n(13)","C3\n(23)","C4\n(24)","C5\n(25)","C6\n(14)","C7\n(15)","C8\n(20)","C9\n(22)","C10\n(21)","C11\n(-)","C12\n(16)","C13\n(17)","C14\n(18)","C15\n(19)","D1\n(27)","E0\n(3)","E2\n(4)","E3/E4\n(11)","E5\n(26)","E6\n(28)"]
[null,null,"SEM-AN-01","Any change with impact on agreed upon technical contractual agreements","P","P","Intended to be used if no other type of change is applicable but the change affects agreed technical contractual agreements.",null,"*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-AN-02","Any change with impact on processability/manufacturability at customer, which is not covered in the matrix below.","P","P","Any change which is not covered in the matrix below, but risk assessment at customer is recommended.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DATA SHEET"]
[null,null,"SEM-DS-01","Change of data sheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update of data sheet because of technical change of the product.","e.g. recommendations for pull-up/pull-down or NC pins, MSL","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-DS-02","Correction of data sheet or issue of errata","I","I","No technical change of product, process or test.\nNew description of behavior which was not specified before or which is different from initial specification.\nPlease indicate clearly, that Infonote contains this type of change!\nAssessment in application required!","e.g. Errata","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. No technical change of the product.\n(I): Definition of new parameter which was not documented before.\n(P): Not known as single change. Only in combination with other changes. ","(I): e.g. adding new tested parameter.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DESIGN"]
[null,null,"SEM-DE-01","Design changes in active elements. 1)","P","P","Any device relevant changes in design / layout of elements with effect on specified electrical behavior.\n1) Not included: \nModification to adjust product parameter within specified process window and design rules.","e.g. change of ESD structure\ne.g. add / remove a transistor in layout ","A","Please check if data sheet is affected (SEM-DS-01).","-","●","-","-","●","●","M","-","●","●","D,J","-","-","-","-","-","-","D","D","D","D","D","●","●","●","●","●","●","●","●","-","-","F","-","-","-","●","-","-","-",3,"-","●","●","●",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","E","M","●","-","-","●","-"]
[null,null,"SEM-DE-02","Design changes in routing . 2)","P","P","Any change of wiring between elements in chip design / layout with effect on specified electrical behavior.\n2) Not included: \nModification to adjust product parameter within specified design rules.","e.g. mask changes in metal fix for corrective action (based on external 8D report)\ne.g. Connecting / disconnecting an already existing transistor through routing","C","A: Impact on EMC behavior cannot be evaluated / excluded on component level.\nA: If impact on electrical function is not excluded on component level.\nPlease check if data sheet is affected (SEM-DS-01).","-","●","-","-","-","A","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","●","●","●","●","●","-","-","-","-","-","-","-","●","-","-","-",3,"-","●","●","●",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","E","M","●","-","-","●","-"]
[null,null,"SEM-DE-03","Die shrink 3)","P","P","Shrink of active area.\n3) Not included: sawing street/kerf/scribe line","Typical shrink of die.","A","Please check if change in process technology (SEM-PW-09) is also affected.","-","●","-","●","●","-","M","-","●","●","D,J","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","●","-","-","-","●","-","●","●","-","●","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","●","E","M","●","F","-","●","●"]
[null,null,"SEM-DE-04","Firmware modification","I","P","Integrated software by design or memory as defined by supplier.\n(I): Firmware modification or update without effect of functional performance at the customer (bug fix).\n(P): Firmware modification or update with effect of functional performance at the customer.","(I): e.g. addition of Firmware opportunities\n(P): e.g. bug fix with impact on functional performance","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"PROCESS - WAFER PRODUCTION"]
[null," ","SEM-PW-01","New / change of wafer substrate material","P","P","New wafer material.","e.g. different wafer material to currently released material (like change from EPI material into non-EPI material)","C",null,"-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","-","9, M","-","R","-","●","●","Qualification effort acc. AEC-Q100: see diffusion/doping"]
[null,null,"SEM-PW-02","New wafer diameter","P","P","Change of wafer diameter resulting in equipment and process changes.",null,"C","Impact on changes in SEM-PW-09 and/or SEM-EQ-01.","●","●","-","-","-","E","M","-","●","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","AEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PW-03","New final wafer thickness","P","P","Change in final wafer thickness. ","e.g. change in final chip/die thickness ","C","A: If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)\nA: If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.","-","●","-","-","-","E","M","-","●","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","●","●","●","●","-","●","-","●","●","-","-","-","X","●","-","-","-","-","-","-","-","-","●","-","-","-","F","-","●","●"]
[null,null,"SEM-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.",null,"A",null,"-","●","-","-","-","-","M","-","●","#","-","-","-","-","-","-","-","-","-","@●","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-",6,6,"-","-","-","5,6,0","●",6,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","M","-","P, R","-","●","-"]
[null,null,"SEM-PW-05","Change of gate material / dielectrics","P","P","Change of gate material (incl. Poly silicon gate electrodes) and / or gate dielectric material or process",null,"A",null,"-","●","-","-","-","●","M","-","●","@N","D,J","-","-","-","-","-","-","-","@●","@●","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","●","-","-","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","E","M","●","P","-","●","-"]
[null,null,"SEM-PW-06","New / change of backside operation (grinding / metallization) ","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions necessary.\nAlternative see SEM-PW-09","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","C","A: If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)\nA: If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.","-","●","-","-","-","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","M","M","●","-","●","-","-","-","-","H","-","-","H","-","●","-","●","Z","●","-","●","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","AEQ-Q100: Applicable to all smart power devices"]
[null,null,"SEM-PW-07","New / change of metallization / vias / contacts","P","P","Change in metallization of bondpads, material, layer thickness specifically for chip frontside and internal layers.","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metallization","C",null,"-","●","-","●","●","●","M","-","●","-","-","●","●","-","-","-","-","●","-","-","-","●","-","-","-","●","●","-","●","-","-","-","-","-","-","-","●","-","●","●","●","●","●",8,"-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","●","E","-","●","-","-","●","●"]
[null,null,"SEM-PW-08","New / change of passivation or die coating (without bare die)","P","P","Change of top layer on die (between mold compound and die). ","e. g. addition of polyimide","C","Change of intrinsic mechanical stress might influence electrical function.","-","●","-","●","●","●","M","-","●","#","D,J","●","●","-","-","-","-","-","-","-","-","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-","●","●","●","-","●","●","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","●","●"]
[null,null,"SEM-PW-09","Change in process technology not covered by any other type of change","--","P","(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(--): e.g. change from wet to dry etching, \ne. g. change from horizontal to vertical oven for oxidation\n(P): e.g. change of layer thickness","A","Please also check changes described under EQUIPMENT.\nPlease check if change is described by specific type of change in this matrix.","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","Qualification effort depends on type of change."]
[null,null,"SEM-PW-10","Process integrity: tuning within process specification","--","P","Variation within process specification\n(--):  If tuning within process specification does not influence the integrity of the final product.\n(P): If remaining risk on product specification is anticipated.","(--): e.g. process control","C","Please check if DATA SHEET is affected. \nPlease check if SEM-PW-09 is affected.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"SEM-PW-11","Change of wafer supplier.","--","P","(--): If no remaining risk in supply chain exist\n(P): If the change of wafer supplier can  influence the integrity of the final product.","(--): e.g. change of wafer supplier with same material composition.\ne.g. same material composition and does not influence electrical behavior.\n(P): e.g. new supplier with impact on substrate material and / or electrical behavior. ","C","Not on component, tested on test structure (typical for IC).\nInteraction on component level for discrete components expected.\nIn case of SOI substrate HF properties have to be qualified. \nPlease check if SEM-PW-01 and SEM-DS-01 is affected.","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","-","9, M","-","R","-","●","-","Qualification for IC & µ-Controller difficult on product level. Characterisation on wafer level only on test structure.\nSupplier should perform a risk assessment if there is a technology dependend risk requiring additional qualification effort.\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 ofQ100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PW-12","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Impact is to be assessed.\n","(--): e.g. change of cleaning process in wafer production\n(P): e.g. additional sinker implantation after standard implantation (to protect circuit against interference impulses). ","C","Please check also changes described under EQUIPMENT.\n\nA: If impact on application cannot be evaluted on component level","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PW-13","Move all or parts of production to a different wafer fab site.","P","P","Wafer fab transition with additional changes (described above).\nIncludes transfer as well as additional site.","e.g. dual source / fab strategy","A","Check if any other type of process change is applicable due to the transfer","●","●","-","●","●","●","M","-","●","●","J","●","●","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","H","-","-","H","-","●","-","●","●","●","●","●","●","●","●","-","●","●","●","-","-","-","●","-","-","-","-","-","-","●","-","●","E","M","-","A,I,P,R,S","-","●","●","AEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PW-14","Lithography","--","P","Change in process technique for lithographic process and material\n(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(--): e.g. exchange of defect mask\n(P): e.g. change from E-beam process to X-ray process\ne.g. change from contact into projection mode","C","Please also check changes described under EQUIPMENT.","-","●","-","●","-","●","M","-","●","#","-","●","●","-","-","-","-","-","-","-","●","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","6, 7","-","-","-","-",4,4,"-","-",1,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","P","-","●","-"]
[null,null,"SEM-PW-15","Oxide / Interlayer Dielectric (excl. gate oxide)","--","P","Change in process technique for oxide (excl. gate oxide) / interlayer dielectric process\n(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.",null,"C","Please also check changes described under EQUIPMENT.","-","●","-","-","-","●","M","-","●","#,N","D,J","-","●","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●","-",6,6,7,"-","●","-","●",6,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","E","-","-","-","-","●","-"]
[null,"Headings",null,"BARE DIE (Wafer process changes not covered in this section shall be handled according to section \"PROCESS - WAFER PRODUCTION\")"]
[null,null,"SEM-BD-01","New final wafer thickness","P","P","Change in final wafer thickness. ","Change in final chip/die thickness ","A",null,"-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","ELFR can only be performed on packaged test vehicles.\nNBTI was removed in deviation from the AEC-Q100 Matrix because there it is a combined type of change (Wafer Dimension/Thickness). NBTI is applicable for wafer dimension change only."]
[null,null,"SEM-BD-02","Change of top metallization or bond pad stack","P","P","Change in bondpads (incl. stack below), material, pad pitch, surface changes, layer thickness","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metalization","B",null,"-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-",8,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","E","-","●","-","-","-","-"]
[null,null,"SEM-BD-03","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions.","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","A",null,"-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","M","M","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-"]
[null,null,"SEM-BD-04","Change of wafer setup or number of possible good dies on wafer.","I","P","Needed information for pick & place machine.\n(I): amount of possible good dies on wafer\n(P): influence on wafer setup and wafer mapping","(I): e.g. change from 350 to 240 good dies on wafer\n(P): e.g. information change for pick & place machine.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-BD-05","Change of optical appearance of wafer edge region (like imide coverage or edge exclusion)","I","P","Selection of dies in wafer edge region which have full electrical functionality. \n(I): in case of wafer edge is affected only\n(P): in case of single die is affected","(I): e.g. appearance of wafer edge (rounded instead of square)\n(P): e.g. polyimide as new coating on die","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
[null,null,"SEM-BD-06","Die scribe or separation","I","P","Needed information for sawing and pick & place machine.\n(I): If the change in sawing process does not influence the integrity of the final product.\n(P): in case if product is delivered on wafer","(I): e.g. if product is delivered as known good die (in tape and reel)\n(P): e.g. information change for pick & place machine.\ne.g. information change for sawing machine.","B","Please check if SEM-BD-04 is affected.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-"]
[null,null,"SEM-BD-07","Die Preparation / Clean","--","P","Change in process technique for die preparation / cleaning\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of cleaning time.\n(P): e.g. change in cleaning procedure after change of sawing equipment.","B","Please check if SEM-BD-06 is affected.","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-"]
[null,null,"SEM-BD-08","New / change of passivation or die coating ","P","P","Change of top layer on die.","e.g. addition of polyimide\ne.g. change of polyimide thickness","B",null,"-","-","-","-","-","-","-","-","●","#,N","D,J","-","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","●","-"]
[null,"Headings",null,"PROCESS - ASSEMBLY"]
[null,null,"SEM-PA-01","Change in critical dimensions of package","P","P","Change in dimensions of existing package.","e. g. changes in package dimensions (further development).","B",null,"-","●","-","●","●","●","M","●","●","●","-","●","●","●","●","T","●","-","-","-","-","-","●","●","-","●","-","-","●","-","L","H","-","-","H","H","●","-","●","●","●","●","●","●","●","●","●","-","-","●","●","B","●","●","●","L","H","H","H","H","●","●","●","●","-","●","-","-","-","-"]
[null,null,"SEM-PA-02","Change of leadframe base material","P","P","New leadframe material in new composition.","e. g. change from alloy42 to copper\ne. g. change between two different copper alloys","B",null,"-","●","●","-","●","●","M","●","-","-","-","-","●","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","L","H","-","-","H","-","●","●","●","●","●","●","●","-","-","-","●",2,"-","●","●","-","●","●","●","L","-","-","-","H","-","●","-","-","-","●","A,F,X","●","-","●"]
[null,null,"SEM-PA-03","Change in leadframe dimensions","P","P","Change in leadframe dimensions which has impact to the specified electrical parameter acc. data sheet or specification (e.g. heat sink, pin dimensions, die paddle size, ...)\nNot included: Variation within specification.","e. g. change in lead frame geometry","B","ESD investigations are only necessary if internal ground and power supply connection of leadframe is affected.\nA: If impact on EMC behavior cannot be evaluated / excluded on component level.\n","-","●","-","-","●","●","M","-","-","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","●","-","L","H","-","-","-","-","●","-","●","-","●","-","●","-","-","-","●","-","-","●","-","-","-","●","-","L","-","-","-","H","-","-","-","-","-","●","-","-","-","●"]
[null,null,"SEM-PA-04","Change of lead frame finishing material / area (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e. g. change from Ag flash to NiP protection layer\ne. g. change from Ag spot to Au spot\ne. g. increase of silver plating area","C",null,"-","●","●","●","●","●","M","●","-","-","-","-","C","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","L","H","-","-","H","-","●","●","C","C","C","-","-","-","-","-","D","C","2,C","-","-","D","-","D","-","L","-","-","-","H","-","D","-","-","C","-","-","-","-","●","For wire bond strengh test: Pre- & Post-process change comparison to evaluate\nprocess change robustness (AEC-Q101)."]
[null,null,"SEM-PA-05","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and / or process resulting in a new technology (e.g. pure tin).","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness \ne.g. change of external bumps of a BGA\ne.g. Change of external pins of a hermetic package","B",null,"-","●","●","●","●","●","M","●","-","-","-","-","C","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","L","H","-","-","H","-","-","●","-","-","-","-","-","-","-","-","●","-","-","-","-","●","-","-","●","L","-","-","-","H","-","●","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-06","Bump Material / Metal System (internal)","P","P","Stack die or die to substrate (flip chip)","e. g. change to Pb-free material\ne. g. change of copper pillars","C","B: If chip-board-package interaction cannot be evaluated by component manufacturer","-","●","●","●","●","●","M","●","●","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●","L","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-07","Die attach material","P","P","Change of die attach material and / or process  resulting in a new technology (e.g. soft solder, epoxy, etc.) ",null,"C","A: If impact on EMC behavior cannot be evaluated / excluded on component level (if die attach has impact on electrical conductivity).","-","●","●","●","●","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","●","-","L","H","-","-","H","H","●","●","●","●","●","-","●","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","H","-","-","●","-","-","●","A,X","-","●","●"]
[null,null,"SEM-PA-08","Change of wire bonding\n","P","P","Material, diameter, change in bonding diagram and / or change in process resulting in a new technology.","e.g. change from Au to Cu material\ne.g. change from 25µm to 23µm diameter\ne.g. change from single to double bond\ne.g. change from stich bond to stich on ball bond.","C","A: In case of bond diagram change and EMC cannot be evaluated on component level.\n\nPlease also check changes described under \nSEM-EQ-01.","●","●","●","●","●","●","Q","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","●","-","-","H","-","-","-","-","●","●","●","-","●","●","●","-","-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","●","-","-","●","-","-","●","●","Parameter Analysis: Strictly required only for Power devices.\nIn general: Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended.\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null," ","SEM-PA-09","Substrate / Interposer","P","P","Change of BGA substrate","e.g. changes in routing ","B","A: Impact on EMC behavior cannot be evaluated / excluded on component level.\nA: If impact on electrical function is not excluded on component level.","-","●","●","●","●","●","M","●","●","-","-","●","●","-","-","T","-","-","-","-","-","-","-","-","-","-","-","@●","-","-","L","H","-","-","H","H","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
[null,null,"SEM-PA-10","Die Overcoat / Underfill","--","P","Supporting layers for complex packages like flip chip and / or change in process resulting in a new technology.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of dispensing speed\n(P): e.g. change of underfill material ","C",null,"-","●","●","●","●","●","M","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","H","-","-","●","●","●","-","●","●","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","H","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-11","Change of mold compound / encapsulation material","P","P","Change of mold compound / encapsulation material.","e.g. change to green mold compound\ne.g. change of filler particles","C","B: impact on thermo-mechanical stress caused by mismatch of mold compound, interconnecting technology and carrier is  anticipated (specific for Power Devices). \nB: for wave soldered devices \nA: in case of high frequency signals (> 3GHz) it should be assessed if possible changes in permeability of mold compound could affect signal behavior (e.g. digital signal processor).","-","●","●","●","●","●","M","●","●","●","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","L","-","-","-","-","-","●","●","●","●","●","●","●","●","●","●","●","-","-","-","-","B","●","●","●","-","-","-","-","H","●","●","●","-","-","-","A,F,#","-","-","●"]
[null,null,"SEM-PA-12","Change of hermetic sealing","P","P","Affected areas are material and process of hermetic (e.g. ceramic ) packages, capped die and sealed devices (e.g. pressure sensors) ","e.g. change of sealing material for RoHS","B","A: impact on EMC behavior cannot be evaluated / excluded on component level (if encapsulation / sealing has impact on electrical conductivity).","-","●","●","-","●","●","-","●","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","-","●","●","●","H","H","H","-","-","-","-","H","-","-","-","-","H","-","H","-","-","-","H","H","H","H","-","H","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-13","Change of product marking","I","P","Change of marking on device and / or change in process resulting in a new technology..\n(I): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(I): e.g. change of appearance (additional marking)\n(P): e.g. change from inked marking to laser marking\ne.g. marking of pin 1","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-14","Change in process technology\n(e.g. trim and form, leadframe preparation …)","--","P","(--): If the change in process technology does not influence the integrity of the final product.\n(P): If the change in process technology can  influence the integrity of the final product.","(P): e.g. change from punched to sawn QFN","B","Please also check changes described under \nSEM-EQ-01.\nPlease check if change is described by specific type of change in this matrix.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-15","Process integrity: tuning within process specification","--","P","Variation within process specification\n(--): If tuning within process specification does not influence the integrity of the final product.\n(P): If impact on product specification is anticipated.","(--): e.g. process control","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-16","Change of direct material supplier","--","P","Change of suppliers for direct materials which are used in assembly process (BOM).\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of wire material supplier.\n(P): e.g. change to new mold compound supplier\ne.g. additional leadframe supplier with specific leadframe manufacturing technology\ne.g. Change of BGA substrate supplier, if impact on board level reliablity cannot be excluded","C","Please check if material is changed!","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
[null,null,"SEM-PA-17","Change of specified assembly process sequence (deletion and/or additional process step)","--","P","(--): no influence in final product integrity or specified sequence\n(P): influence in final product integrity or specified sequence","(--): e.g. additional cleaning step \ne.g. deletion of optical inspection\n(P): e.g. change lead finishing pre trim & form to post trim & form","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","Qualification depends on specific change."]
[null,null,"SEM-PA-18"," Move all or parts of production to a different assembly site.","P","P","Assembly transfer or relocation.\n Includes transfer as well as additional site.","e.g. dual source / fab strategy","C","A or B: impact on other type of changes described under PROCESS  ASSEMBLY and SEM-EQ-01.\n\nCheck if any other type of process change is applicable due to the transfer","●","●","-","●","●","●","M","-","●","●","-","●","●","●","●","T","●","-","-","-","-","-","-","-","-","●","-","-","-","-","L","H","-","-","H","H","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","●","●","-","●","L","-","-","H","H","-","●","●","-","-","-","A,I,S,X,#","●","●","●","Whisker tests have to be done on monitoring basis!\n\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PA-19","Die scribe or separation","--","P","Separation process from single wafer to dies. \n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of kerf width\n(P): e.g. change from sawing to laser cut","C",null,"-","●","-","●","●","●","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-20","Die Preparation / Clean","--","P","Change in process technique for die preparation / cleaning\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. change of cleaning time.","C",null,"-","●","-","●","●","-","M","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","H","-","●","-","●","●","●","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","X","-","-","-"]
[null," ","SEM-PA-21","Molding / Encapsulation process","--","P","Change in process technique for molding / encapsulation.\n(--): If the change in process does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. tuning within process specification","C",null,"-","●","-","●","●","●","M","●","●","-","-","-","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","L","-","-","-","-","-","●","-","●","●","●","●","●","●","●","●","●","-","-","-","-","B","●","-","●","L","-","-","-","H","-","●","-","-","-","-","A,#","-","-","-"]
[null,"Headings",null,"PACKING/SHIPPING"]
[null,null,"SEM-PS-01","Packing/shipping specification change","P","P","Packing/shipping specification change.",null," *",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-02","Dry pack requirements change ","I","P","(I): Relaxation of dry pack requirements\n(P): Tightening of dry pack requirements","(I): MSL 3 → MSL 1\n(P): MSL 1  → MSL 3","B","Please check if data sheet is affected (SEM-DS-01 or SEM-DS-02).","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-03","Change of carrier (tray, reel)","P","P","Change of carrier (tray, reel)",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-04","Change of labelling","I","P","Change of labelling also on reel.\n(I): Change of material label without impact on barcode.\n(P): Changes of material label information which affects data processing at customer.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of defined nomenclature for data processing","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"EQUIPMENT"]
[null,null,"SEM-EQ-01","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique.","Change from single wafer to batch process (e.g. over pad metalization)\ne.g. dambar cutting (mechanical to laser cutting)","A","Check which other type of change is applicaple due to this equipment change.","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. extension of existing equipment pool\n(P): e.g. extension of dedicated equipment in case basic technology still need to be proven","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-EQ-03","Change in final test equipment type leading to a different test concept.","P","P","Change of tester platform with differences in HW or SW that makes a change in test concept necessary (only in case of bare die: final test means wafer test).",null,"C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","Gage R&R / delta correlation"]
[null,"Headings",null,"TEST FLOW"]
[null,"X","SEM-TF-01","Move of all or part of electrical wafer test and/or final test to a different test site.","P","P","Tester transfer or relocation. \nCheck impact on SEM-AN-01\n Includes transfer as well as additional site.","Dual source strategy","C","Check if any other type of process change is applicable due to the transfer","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","Gage R&R / delta correlation"]
[null,"Headings",null,"Q-GATE"]
[null,null,"SEM-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","e.g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.\n(--): If change does not influence the integrity of the final product.\n(P): If impact on product integrity is anticipated.","(--): e.g. test implemented without customer requirement\n(P): e.g. reduction from three temperature measurements to two temperature measurements\ne.g. change in burn in / run in process.","C",null,"●","-","-","-","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-","Parameter Analysis: Delta correlation\n\n* For \"burn in\" changes ELFR recommended \n\nIn case of introduction of new test flow steps consider assessment of influence on product reliability."]
[]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-",null,"-"]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","●","-",null,"-"]
[]
[null,null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) "]
[]
[null,null,null,"Reason for exception of tests and/or usage of generic data: "]
[]
[]
[]
[]
[]
[null,null,"--","Not required."]
[null,null,"I","Information Note required."]
[null,null,"P","PCN required."]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," "]
[]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the \nappropriate process change.\nA @ recommended additionally by ZVEI "]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Only for peripheral routing"]
[null,null,"B","For symbol rework, new cure time, temp"]
[null,null,"C","If bond to leadfinger"]
[null,null,"D","Design rule change"]
[null,null,"E","Thickness only"]
[null,null,"F","MEMS element only"]
[null,null,"H","Hermetic only"]
[null,null,"J","EPROM or EEPROM"]
[null,null,"L","Lead free"]
[null,null,"M","For devices requiring PTC"]
[null,null,"N","Passivation and gate oxide"]
[null,null,"P","Passivation and interlevel dielectric"]
[null,null,"Q","Wire diameter decrease"]
[null,null,"T","Only for Solder Ball SMD"]
[null,null,"#","Only from non-100% burned-in parts"]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Acoustic Microscopy"]
[null,null,"B","If not laser etched",null,null,null,null,null," "]
[null,null,"C","Only for Leadframe Plating change"]
[null,null,"D","Only for Lead Finish change"]
[null,null,"E","If Applicable"]
[null,null,"F","Finite Element Analysis"]
[null,null,"G","Generic Data available"]
[null,null,"H","Hermetic device only"]
[null,null,"I","Infant Mortality Rate"]
[null,null,"L","Lead free"," "]
[null,null,"M","Power MOS/IGBT devices only"]
[null,null,"P","CV Plot (MOS only)"]
[null,null,"R","Spreading Resistance Profile"]
[null,null,"S","Steady State Mortality Rate"]
[null,null,"X","X-Ray"]
[null,null,"Z","For backside operation changes"]
[null,null,1,"If bond pads are affected"]
[null,null,2,"Verify #2 (package) post"]
[null,null,3,"Only for changes at the periphery"]
[null,null,4,"Only for oxide etches or etches prior to oxidation"]
[null,null,5,"For source or channel region changes"]
[null,null,6,"For field termination changes"]
[null,null,7,"For passivation changes"]
[null,null,8,"For contact changes"]
[null,null,9,"For epitaxial changes"]
[null,null,0,"Required for Schottky barrier changes."]
[null,null,"#","Glass Transition Temperature"," "]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[]
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[]
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