{"text_format":"1","workbook":"xlsx","n_sheets":6,"sheets":["Guidance","History","Definition","Active Component","Passive Component","LED Component"],"not_rendered":{"charts":0,"images":1,"macros":1,"external_links":0,"defined_names":14,"comments":1,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900"}

{"sheet":"Guidance","index":0,"n_rows":23,"n_cols":2,"rows_kept":23,"cut":false,"hidden":false,"merged":[[7,1,7,6]]}
["DeltaQualifikationsMatrix","DeltaQualificationMatrix"]
["Achtung!\nFalls Sei eine Fehlermeldung bei der Aktivierung der Inhalte erhalten, müssen Sie ggf. das Microsoft FixIt https://support.microsoft.com/kb/3025036/ ausführen.","Attention!\nIn case of a failure report when activating the macros, you might need to run the Microsoft Fixit https://support.microsoft.com/kb/3025036/en-us."]
["Allgemeines\nKurze Produkt- und Technologiezyklen elektronischer Bauelemente sowie neue Umweltauflagen (Bleiverbot, Flammhemmer, …) führen häufig zu Prozeß- und werkstofftechnischen Änderungen an Bauelementen, Leiterplatten, Verbindungstechnik und Schaltung, welche evaluiert werden müssen. Eine geeignete Methodik zur Handhabung von Änderungen an elektronischen Bauelementen beschreibt die ZVEI  \"Guideline for Customer Notifications of Product and /or Process Changes (PCN) of Electronic Components specified for Automotive Applications\". Ein wesentlicher Teil dieser Guideline sind die hier vorliegenden Matrizen, welche sich als Empfehlungen für die Evaluierung von typischen Änderungen an elektronischen Bauelementen verstehen. Dies sollte Teil des offenen und risikobewussten Dialoges zwischen Lieferant und Kunden sein.\nDiese DeltaQualifikationsMatrizen wurden durch den Industriearbeitskreis \"PCN DeltaQualifikationsMatrix\" und den Bauteilexperten des ZVEI Arbeitskreis \"PCN-Methodik\" erarbeitet. Der Inhalt wurde basierend auf dem aktuellen Stand der Technik erstellt und erhebt keinen Anspruch auf Vollständigkeit. Im Einzelfall ist ggf. ein abweichendes Vorgehen abzustimmen, da kundenspezifische Vereinbarungen zur Qualifikation zu berücksichtigen sind.","General\nShort product and technology cycles as well as new environmental regulations („Pb-free“, flame retardants, ….) frequently result in process and material changes of components, printed circuit boards, assembly techniques and circuit layout which have to be evaluated. The ZVEI \"Guideline for Customer Notifications of Product and /or Process Changes (PCN) of Electronic Components specified for Automotive Applications” describes an appropriate methodology for dealing with changed electronic components. The qualification matrices in this guideline are recommendations for how to assess typical changes of electronic components. These recommendations promote an open risk-based discussion between supplier and customer regarding qualifications. \nThe DeltaQualificationMatrices were developed by the Industry Task Force Team \"PCN DeltaQualificationMatrix\" together with component experts from the ZVEI Working Group \"PCN-Methodology\". Actual contents represents state-of-the-art technology and does not claim to be comprehensive. Deviation from proposed guideline should be mutually agreed as customer specific requirements have to be considered.     \n"]
["Anwendung der DeltaQualifikationsMatrix (auszufüllen durch den Bauelementehersteller)\na) Diese Tabelle ist nur bei Änderungen anzuwenden. Neuqualifikationen und Sonderqualifikation \n    (z.B. Verguß von Modulen) bleiben von diesen Matrizen unberührt.\nb) Ist eine Änderung in dieser Tabelle nicht aufgeführt, so ist der Qualifikationsumfang zwischen \n    Kunde und Lieferant abzustimmen.\nc) Die Matrix der Aktiven Bauelemente ist so aufgebaut, dass zwischen integrierten Halbleitern \n    (AEC-Q100 Rev. H) und diskreten Halbleitern (AEC-Q101 Rev. D5) auszuwählen ist (Zelle D4). Für Passive\n    Bauelemente gilt die AEC-Q200 Rev. D. \nd) Alle Änderungen in der PCN sind in der Spalte B durch ein Kreuz (x) zu markieren und werden\n    dadurch farblich hervorgehoben. Sofern dies geschehen ist, werden im Feld \"Tests, which should \n    be considered for the appropriate process change\" (Zeile 76 für Aktive Bauelemente, Zeile 73 LED\n    components oder in Zeile 472 für Passive Bauelemente) alle in Betracht zu ziehenden \n    Zuverlässigkeitstests angezeigt.\ne) In \"Tests, which should be considered for the appropriate process change after selection of condition \n    table\" (Zeile 78 für Aktive Bauelemente, Zeile 75 für  LED components oder in Zeile 474 für Passive \n    Bauelemente) wird die Anpassung \n    der in Betracht zu ziehenden Tests in Folge der Relevanz bezüglich der Änderung berücksichtigt. \n    Dazu ist die Tabelle \"Conditions\" entsprechend der Auswahl (ABC) mit einem (x) zu bewerten.\nf)  In \"Suppliers performed tests\" (Zeile 80 für Aktive Bauelemente, Zeile 77 LED components oder\n    Zeile 476 für Passive Bauelemente) dokumentiert der Bauelementehersteller die durchgeführten bzw.\n    geplanten Tests.\ng) Falls von der Testempfehlung abgewichen wird, so sollten diese Abweichungen vom Bauelemente-\n    hersteller angezeigt und kommentiert werden. Hierzu ist der Bereich \"Reason for exception of tests\" \n    (Zeile 82ff für Aktive Bauelemente, Zeile 79 LED components oder Zeile 478ff für Passive Bauelemente)\n    zu verwenden.  \n    Werden die in Betracht zu ziehenden Tests durch generische Daten (G) belegt, ist dies ebenfalls \n    hier anzuzeigen und zu begründen.","DeltaQualificationMatrix Application (completion by component manufacturer)\na) This table has to be used for changes only. The matrices are not applicable for new product \n     or special qualifications (for instance for encapsulation of module).\nb) If a change is not listed in this table, the qualification plan has to be defined and agreed\n     between customer and supplier.\nc) The matrix for Active Components requires the user to chose between integrated circuits\n    (AEC-Q100 Rev. H) and discret semiconductors (AEC-Q101 Rev. D) (cell D5).  For Passive                   Components AEC-Q200 Rev. D is used.\nd) All changes as listed in the PCN have to be marked  by a cross (x) in column B and will \n    appear colored. The relevant reliability tests are then shown in \"Tests, which should be\n    considered for the appropriate process change\"  (row 76 for Active Components, row 73 for LED \n    components respectively in row 472 for Passive Components).   \ne) In \"Tests, which should be considered for the appropriate process change after selection of \n    condition table\" (see row 78 for Active Components, row 75 for LED components or row 474 for \n    Passive Components) is for modification of the found relevant tests under consideration of the weight \n    of change. Related table “Conditions” has to be assessed per proposed letters with an (x).\nf) In \"Suppliers performed tests\"  (here row 80 for Active Components, row 77 for LED components\n   or in Row 476 for Passive Components) the component manufacturer documents the planned and \n   performed tests.\ng) In case of deviations from tests, which should be considered this should be notified and\n    commented by the component manufacturer in the area \"Reason for exception of tests\"  (see\n    row 82ff for Active Components, row 79ff for LED components or in Row 478ff for Passive\n    Components). Test results in form of generic data (G) are allowed when notified and justified."]
["Die Einstufung des Untersuchungslevel erfolgt in folgende Kategorien\n\"C: Component level\": Die Evaluierung der Änderung am Bauelement ist durch Untersuchungen\n       ausschließlich am Bauelelement beim Bauelementehersteller durchführbar. Zur Evaluierung \n       der Änderung dürfen Ergebnisse aus bereits durchgeführten Untersuchungen herangezogen \n       werden, wenn diese zu einem ähnlichen Bauelement bereits vorliegen (Generische Daten).\n\"B: Board level\": Die beschriebene Änderung hat möglicherweise Einfluss auf die Verarbeitbarkeit\n      des Bauelementes im Steuergerät. Die Evaluierung der Änderung wird wie unter C beim \n      Bauelementehersteller durchgeführt. Zusätzlich ist durch den Kunden/Steuergerätehersteller die\n      Verarbeitbarkeit zu prüfen. \n\"A: Application level\": Die beschriebene Änderung hat möglicherweise Einfluss auf die Applikation/\n       das Steuergerät. Die Evaluierung der Änderung wird wie unter C oder B durchgeführt. Zusätzlich\n       ist vom Kunden/Steuergerätehersteller der Einfluss der Änderung im Steuergerät durch geeignete\n       Untersuchungen zu bewerten.  Dieses Vorgehen ist mit dem OEM abzustimmen. Hierbei ist zu\n       berücksichtigen, ob die Steuergeräte- / Baugruppenanforderungen durch andere Qualifikationen\n       bereits hinreichend abgesichert sind (applikationsspezifische Risikobetrachtung).\n\" *: will become A/B/C after decision\": Änderung(en) mit dieser Einstufung sind fallabhängig zu\n       klären. Entsprechend der technischen Bewertung wird in A, B oder C eingestuft. \n\" **: Not relevant for qualification matrix\": Änderung(en), die nicht in A, B oder C eingestuft werden\n       können und somit nicht relevant für die DeQuMA sind.","Evaluation Levels are categorized as follows   \n\"C: Component level\": The evaluation of a change at component level by the component\n        manufacturer is sufficient. Generic data from other relevant evaluations can be used.\n\"B: Board level\": The intended change described in the PCN may influence processability / \n        manufacturability of the component at board level. Therefore additional evaluation by \n        customer may be necessary.\n\"A: Application level\": The intended change described in the PCN may influence the \n        properties of the application (e.g. Electronic Control Unit).    \n        In addition to the evaluation under C or B the influence of the change in the application is\n        evaluated by suitable investigations by the customer. The scope of the evaluation has to be\n        aligned with the OEM. It has to be considered whether  the application / assembly \n        requirements are already sufficiently safeguarded by other qualifications (application \n        specific risk assessment).\n\" *: will become A/B/C after decision\": is subject to a case by case evaluation\n\" **: Not relevant for qualification matrix\": Changes which fulfill neither A,B nor C definitions\n"]
["Wichtige Hinweise\n- Die mittels Matrix identifizierten Tests sind in Betracht zu ziehen, d.h. es ist zu prüfen, ob der \n   jeweilige Test für die spezifische Änderung in dieser Form notwendig ist. Abweichungen oder \n   generische Daten sind im Detail zu begründen.\n- Die Kategorien, Bemerkungen und Fußnoten sind unbedingt zu beachten, da sie wichtige Hinweise\n  und Einschränkungen enthalten.\n- Zur Nutzung aller Funktionen muss in Excel die Anwendung von Makros freigegeben sein.\n- Für Q4/2013 wird die die DeQuMa - opto-elektronische Bauelemente durch den in Bearbeitung\n  befindlichen Standard PRESCO(AP)033 ergänzt."," Important Notes\n- Tests identified by the matrix have to be considered and checked if they are necessary to\n  assess the specific change. Test modifications or generic data have to be justified in detail.\n- Categories, comments and notes need attention, as they provide important hints and limitations.\n- In order to use all functions in EXCEL, macros have to be allowed.\n- In Q4/2013 the DeQuMa for opto-electronic components will be extended by the evolving \n  standard PRESCO(AP)033."]
[]
["Form provided by ZVEI  ‒  Revision 2.2.4  ̶  06/2015"]
[]
[]
[]
["History"]
[null," "]
["Version 0.2:  03.03.11"]
["Version 0.3:  15.04.11, Entwurf seitens Tier1 Continental AG, Hella KGaA Hueck & Co., Robert Bosch GmbH"]
["Version 0.4:  19.07.12, Anpassung des Entwurfs durch Dr. R. Winter (ZVEI), J. Uhlenhut (ELMOS) und Dr. O. Autzen (Robert Bosch GmbH) zum aktuellen Stand der \n                                  Matrix und dem einhergehenden Verständnis der Anwendung."]
["Version 0.5:  01.09.12, Bearbeitung durch Robert Bosch GmbH (AE/QMS-E-Abteilungen)"]
["Version 0.6:  08.10.12, Ergänzung und Nachträge aus ZVEI AK PCN Methodik durch Dr. R. Winter (ZVEI) und Dr. O. Autzen (Robert Bosch)"]
["Version 0.7:  23.10.12, Ergänzung und Nachträge aus ZVEI AK PCN Methodik durch Dr. R. Schmidt (Siemens AG) und Dr. O. Autzen (Robert Bosch)"]
["Version 0.8:  12.11.12, Überarbeitung von Rückmeldungen durch ZVEI Expertenkreis"]
["Version Final: 14.12.12. Korrektur der englischen Beschreibung (Spalte B dieses Blatt)  "]
["Version Final: 15.01.12. Anpassung deuutsche Beschreibung wg. Rechtsverbindlichkeit "]
["Version Final: 16.01.13. Verteilte Version an ZVEI AK jeweils mit und ohne Makros"]

{"sheet":"History","index":1,"n_rows":10,"n_cols":2,"rows_kept":10,"cut":false,"hidden":false,"merged":[[0,0,0,1]]}
["History of DQM"]
[]
["Version","Remarks"]
["2.0","Revised by ZVEI PCN Methodology Workgroup in March 2015"]
["2.1","Released March 2015"]
["2.1.1","Active Components - delete write protection in comments "]
["2.2","Solved problems with some ActiveX configurations"]
["2.2.2","Solved Problems in Active Components"]
["2.2.3","Solved Problems ActiveX, Active Components  SEM-DE-02 (Design changes in routing) error fixed "]
["2.2.4","Minor fixes"]

{"sheet":"Definition","index":2,"n_rows":18,"n_cols":5,"rows_kept":18,"cut":false,"hidden":true,"merged":[[3,4,5,4],[11,3,14,4],[17,1,17,3]]}
["ZVEI123987","Scope: Die Deltaqualifikationsmatrix betrachtet nur Änderungen, die gem. ZVEI Guideline als PCN mitgeteilt werden müssen."]
[]
[null,"Assessment","Mindset:","Responsible","Criteria"]
[null,"A (application)","Specific ECU","Tier1","Who has the best means (test method, test structures, experiences, and efficency) for validating the change effects?\nSufficient coverage for approval of the change.\n"]
[null,"B (board level)","On test board or generic or family releases","Tier1"]
[null,"C (component)","Semiconductor, passive, and electromechanic component","Tier2"]
[]
[]
[null,null,"recommendation: to be deleted"]
[null,null,"additional / changed /split topic to original ZVEI PCN guideline"]
[]
["Interactions:","I","Wechselwirkung bewerten","Bei I ist die Wechselwirkung mit geeigneten Untersuchungen zu bewerten.\nMit R ist das Risiko einer möglichen Wechselwirkung zu betrachten und ggf. mit geeigneten Untersuchungen zu bewerten."]
["Risk assessment","R","Risikobetrachtung notwendig"]
[]
[]
[]
[]
["Electronic component change qualification","\n● or letter:  Test schould be considered\nG:  Generic data\nR:  Risk assessment",null,null,"Im AEC-Teil sind die Tests markiert, die zur Bewertung zu betrachten sind."]

{"sheet":"Active Component","index":3,"n_rows":223,"n_cols":78,"rows_kept":223,"cut":false,"hidden":false,"merged":[[2,0,2,2],[1,0,1,2],[3,0,3,2],[0,0,0,2],[1,6,1,7],[5,11,8,11],[5,12,8,12],[6,8,7,8],[6,4,6,5],[5,9,7,9],[6,6,7,6],[6,7,7,7],[3,11,3,45],[5,41,6,41],[5,32,6,32],[5,37,6,37],[5,30,6,30],[5,28,6,28],[5,38,6,38],[5,29,6,29],[5,31,6,31],[5,42,6,42],[5,24,6,24],[5,25,6,25],[3,10,8,10],[5,43,6,43],[5,54,6,54],[77,3,77,7],[5,77,8,77],[5,65,6,65],[5,66,6,66],[5,67,6,67],[5,61,6,61],[5,60,6,60],[5,73,6,73],[5,74,6,74],[5,75,6,75],[5,76,6,76],[7,75,8,75],[7,76,8,76],[5,68,6,68],[5,63,6,63],[5,62,6,62],[5,72,6,72],[5,70,6,70],[5,71,6,71],[3,46,3,74],[75,3,75,5],[167,2,167,3],[164,2,164,3],[165,2,165,3],[166,2,166,3],[93,2,94,5],[119,2,120,5],[151,2,151,3],[152,2,152,3],[153,2,153,3],[154,2,154,3],[155,2,155,3],[156,2,156,3],[157,2,157,3],[162,2,162,3],[163,2,163,3],[5,20,6,20],[5,23,6,23],[4,11,4,45],[4,46,4,74],[5,18,6,18],[5,19,6,19],[5,21,6,21],[5,69,6,69],[5,27,6,27],[5,26,6,26],[5,13,6,13],[5,14,6,14],[5,15,6,15],[5,16,6,16],[5,17,6,17],[5,33,6,33],[5,22,6,22],[5,57,6,57],[5,47,8,47],[5,48,6,48],[5,44,6,44],[5,45,6,45],[5,64,6,64],[4,75,4,76],[3,75,3,76],[168,2,168,3],[5,50,6,50],[5,51,6,51],[5,59,6,59],[5,53,6,53],[5,52,6,52],[158,2,158,3],[159,2,159,3],[160,2,160,3],[161,2,161,3],[5,40,6,40],[5,49,6,49],[5,55,6,55],[5,56,6,56],[5,46,8,46],[5,58,6,58],[5,39,6,39],[5,36,6,36],[5,34,6,34],[5,35,6,35],[4,0,4,2],[79,3,79,5]]}
["Worked on:\n (Name, Function)"]
["Date:",null,null,"2019-06-18",null,null,{"$f":"Guidance!A8","v":"Form provided by ZVEI  ‒  Revision 2.2.4  ̶  06/2015"}]
["PCN number:",null,null,"19_0135"]
["Signature:",null,null,null,null,null,null,null,null,null,"Line evaluation\n(can be evaluated by data or audit/on site check)",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Device evaluation"]
["For integrated circuits or discrete semiconductors select below:",null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q100 Revision H)\r\nincludes integrated circuits (e.g. ASICs, µ-Controler, memories, voltage regulators, smart power devices, logic devices, analog devices,... )",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of AEC-Q101 Revision D)\r\nincludes e.g. small signal diodes (bipolar - and Schottky diodes), small signal transistors, MOSFETS, IGBTs, power diodes, …",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q10x"]
[null,null,"  ",null,null,null,null,null,"Evaluation level\n A / B / C","Further applicable conditions",null,"AEC-Q100 Revision H","Check of specification \n(for raw material only)","Temperature Humidity Bias or biased HAST","Autoclave or Unbiased HAST","Temperature Cycling","Power Temperature Cycling","High Temperature Storage Life","High Temperature Operating Life","Early Life Failure Rate","NVM Endurance, Data Retention, and Operational Life","Wire Bond Shear","Wire Bond Pull","Solderability","Physical Dimensions","Solder Ball Shear","Lead Integrity","Electromigration","Time Depending Dielectric Breakdown","Hot Carrier Injection","Negative Bias Temperature Instability","Stress Migration","Electronic Discharge\nHuman Body Model / Machine Model","Electronic Discharge\nCharged Device Model","Latch up","Electrical Distribution","Characterisation","Electromagnetic Compatibility","Short Circuit Characterization","Soft Error Rate","Lead free","Hermetic Package Test","Package Drop","Lid Torque","Die Shear","Internal Water Vapor","AEC-Q101 Revision D","Check of specification \n(for raw material only)","External Visual","Parametric Verification","High Temp. Rev. Bias","High Temp. Gate Bias","Temperature Cycle","Autoclave","H3TRB","High. Accel. Stress Test","Intermittent Oper. Life","ESD Characterization","Destruct. Phy. Analysis","Physical Dimensions","Terminal Strength","Resistance to Solvents","Constant Acceleration","Vibration Variable Frequency","Mechanical Shock","Hermeticity","Resist. to Solder Heat","Solderability","Thermal Resistance","Wire Bond Strength","Wire Bond Shear","Die Shear","Unclamp.Induct.Switch","Dielectric Integrity","Notes / Remarks","Whisker test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution","Remarks"]
[null,null,null,"Assessment of impact on Supply Chain regarding following aspects\n  - contractual agreements\n  - technical interface of processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Remaining\nrisks on\nSupply\nChain?",null,"Understanding of semiconductors experts ","Examples to explain","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: will become A/B/C after decision\n  ** : Not relevant for qualification matrix",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Unclamp.Induct.Switch","Dielectric Integrity"]
[null,null,"ID","Type of change","No","Yes",null,null,null,null,null,null,null,"THB","AC","TC","PTC","HTSL","HTOL","ELFR","EDR","WBS","WBP","SD","PD","SBS","LI","EM","TDDB","HCI","NBTI","SM","HBM/MM","CDM","LU","ED","CHAR","EMC","SC","SER","LF","MECH","DROP","LT","DS","IWV",null,null,"EV","PV","HTRB","HTGB","TC","AC","H3TRB","HAST","IOL","ESD","DPA","PD","TS","RTS","CA","VVF","MS","HER","RSH","SD","TR","WBS","BS","DS","UIS","DI"]
[null,"Headings",null,"ANY",null,null,null,null,null,null,null,null,null,"A2","A3","A4","A5","A6","B1","B2","B3","C1","C2","C3","C4","C5","C6","D1","D2","D3","D4","D5","E2","E3","E4","E5","E7","E9","E10","E11","E12","G1-4","G5","G6","G7","G8",null,null,3,4,5,6,7,8,"9alt",9,10,11,12,13,14,15,16,17,18,19,20,21,22,23,24,25,26,27]
[null,null,"SEM-AN-01","Any change with impact on agreed upon contractual agreements","P","P","Not relevant for technical evaluation. ",null,"**",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-AN-02","Any change with impact on processability/manufacturabiliy at customer, which is not covered in the matrix below.","I","P","Potential impact on processability/manufacturing process at customers.",null,"B",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DATA SHEET"]
[null,null,"SEM-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update of datesheet because of technical change of the product.","e.g. recomendations for pull-up/pull-down or NC pins, MSL","A",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-DS-02","Correction of data sheet / errata","I","P","No technical change of the product, only correction in description (wording, drawing, …).\n(I): In case of editorial changes. \n(P): In case of impact on product integrity.","e.g. datasheet correction because of new information about component behavior.","A",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. No technical change of the product.","e.g. adding new tested parameter.","A",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DESIGN"]
[null,null,"SEM-DE-01","Design changes in active elements. 1)","P","P","Any device relevant changes in design / layout of elements.\n1) Not included: Design optimization = modification to adapt to the specified process window. ","e. g. change of ESD structure\ne. g. mask changes in active die area","A",null,"-",null,null,"-","●","●","M","-","●","●","D,J","-","-","-","-","-","-","D","D","D","D","D","●","●","●","●","●","●","V","W","-","-","F","-","-","-",null,null,"-","●","●","●",3,"-","-","-","●","E",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","-","●"]
[null,"X","SEM-DE-02","Design changes in routing . 2)","P","P","Any change in chip design / layout\n2) Not included: design optimization = modification to adapt to the specified process window. ","e. g. change of wiring between elements in one chip which has influence on the specified parameters / function \ne. g. mask changes in metal fix","C","A = Impact on EMC behavior cannot be evaluated / excluded on component level.\nA = If impact on electrical funtion is not excluded on component level.","-",null,null,"-","-","A","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","●","●","●","S","●","●","-","-","-","-","-","-",null,null,"-","●","●","●",3,"-","-","-","●","E",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","-","●"]
[null,null,"SEM-DE-03","Die shrink 3)","P","P","Shrink of active area.\n3) Not included: sawing street/kerf/scribe line","Typical shrink of die.","A",null,null,null,null,"●","●","-","M","-","●","●","D,J","-","-","-","-","-","-","●","●","●","●","●","●","●","●","●","●","●","V","W","-","-","-","-","-","-",null,null,"-","●","●","-","●","-","-","-","●","E","●","-","-","-","-","-","-","-","●","-","●","-","-","●","M","-","F","-","●"]
[null,null,"SEM-DE-04","Firmeware modification","I","P","(I): e.g. Firmware is programed in the memory without effect of electical performance at the customer (bug fix).\n(P): e.g. Firmeware update requires hardware update and new mask set.","Any change with impact on internal software intergated by design or memory.","A",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","●","-","●","-","-","-","●","E","●","-","-","-","-","-","-","-","●","-","●","-","-","●","M","-","F","-","●"]
[null,"Headings",null,"PROCESS - WAFER PRODUCTION"]
[null,null,"SEM-PW-01","New / change of wafer substrate material","P","P","New wafer material.","e.g. different wafer material to currently released material (like change from EPI material into non-EPI material)","C",null,"-",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-",null,"●","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","M,9","-","R","-","●","Qualification effort acc. AEC-Q100: see diffusion/doping"]
[null,null,"SEM-PW-02","New wafer diameter","P","P","Change of wafer diameter resulting in equipment and process changes.",null,"C","A = impact on changes in SEM-PW-09 and/or SEM-EQ-01.","●",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","AEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PW-03","New final wafer thickness","P","P","Change in final wafer thickness. ","e.g. change in final chip/die thickness ","C","A = If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)\nA = If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.","-",null,null,"-","-","E","M","-","E","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","●","-","●","-","-","-","●","-","●","-","-","-","-","-","-","-","X","-","●","●","●","-","-","-","F","-","●"]
[null,null,"SEM-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.",null,"A",null,"-",null,null,"-","-",null,"M","-","●","G","-","-","-","-","-","-","-","-","-","-","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-",null,null,"-","●","5,6,0","●","-",6,6,6,"-","●",6,"-","-","-","-","-","-","-","-","-","-","-","-","-","M","-","P,R","-","-"]
[null,null,"SEM-PW-05","Change of gate material / dielectrics","P","P","Change of gate material and / or gate dielectric material.",null,"A",null,"-",null,null,"-","-","●","M","-","●","-","D,J","-","-","-","-","-","-","-","-","-","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-",null,null,"-","●","●","●","●","-","-","-","-","E","●","-","-","-","-","-","-","-","-","-","-","-","-","-","M","●","P","-","-"]
[null,null,"SEM-PW-06","New / change of metallization (specifically chip backside)","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions necessary.","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","C","A = If thermal conductivity is affected (like MOSFET; IGBT, BGA package, stacked dies, …)\nA = If impact on EMC or ESD behavior cannot be evaluated / excluded on component level.","-",null,null,"-","-","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","M","M","●","-","●","-","-","-","-","H","-","-","H","-",null,null,"-","●","-","-","●","-","●","●","●","-","-","-","-","-","-","-","-","-","●","-","●","-","-","●","-","-","-","-","●"]
[null,null,"SEM-PW-07","New / change of metallization (specifically chip frontside)","P","P","Change in metallization of bondpads, material, layer thickness","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metallization","C",null,"-",null,null,"●","●","●","M","-","●","-","-","●","●","-","-","-","-","●","-","-","-","●","-","-","-","●","●","-","V","-","-","-","-","-","-","-",null,null,"-","●",8,"-","●","●","●","●","●","E","●","-","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","●"]
[null,null,"SEM-PW-08","New / change of passivation or die coating (without bare die)","P","P","Change of top layer on die (between mold compound and die). ","e. g. additon of polyimide","C","Change of intrinsic mechanical stress might influence electrical function.","-",null,null,"K","K","●","M","-","●","G,N","D,J","K","●","-","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-",null,null,"-","●","●","●","●","●","●","●","●","●","●","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","●"]
[null,null,"SEM-PW-09","Change in process technology (e. g. process changes like lithography, etch, oxide deposition, diffusion, die back surface preparation/backgrind, ...)","--","P","(--): If the change in process technology does not influence the integrety of the final product.\n(P): If the change in process technology can  influence the integrety of the final product.","E. g. change from wet to dry etching, \nchange from horizontal to vertical oven for oxidation, \nchange from contact litho into stepper litho, …","A","Please also check changes described under EQUIPMENT.","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Qualification effort depends on type of change."]
[null,null,"SEM-PW-10","Process integrity: tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-"]
[null,null,"SEM-PW-11","Change of wafer supplier.","--","P","(--): If no remaining risk in supply chain exist (e.g. same material composition and electrical behavior).\n(P): New supplier, for new wafer substrate material composition.","e.g. change of wafer supplier.","C","Not on component, tested on test structure (typical for IC).\nInteraction on component level for discrete components expected.\nIn case of SOI substrate HF properties have to be qualified.  ","-",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-",null,"●","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","M,9","-","R","-","●","Qualification for IC & µ-Controller difficult on product level. Characterisation on wafer level only on test structure.\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 ofQ100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PW-12","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Risk is to be assessed.","e. g. change of cleaning process in wafer production","C",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PW-13","Move of all or part of wafer fab to a different location/site/subcontractor","P","P","Wafer fab transition with additional changes (described above).",null,"A",null,"●",null,null,"●","●","●","M","-","●","●","J","●","●","-","-","-","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","H","-","-","H",null,null,null,"-","●","●","●","●","●","●","●","●","E","●","-","-","-","-","-","-","-","-","-","●","●","●","●","M","●","A,I,P,R,S","-","-","AEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,"Headings",null,"BARE DIE"]
[null,null,"SEM-BD-01","New final wafer thickness","P","P","Change in final wafer thickness. ","Change in final chip/die thickness ","A",null,"-",null,null,"-","-","E","M","-","E","●","-","E","E","-","-","-","-","-","-","-","●","-","E","E","E","●","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","●","-","●","-","-","-","●","-","●","-","-","-","-","-","-","-","X","-","●","●","●","-","-","-","F","-","●"]
[null,null,"SEM-BD-02","New / change of frontside metallization","P","P","Change in bondpads, material, pad pitch, surface changes, layer thickness","e. g. change from AlSiCu to AlCu\ne. g. change in over pad metalization","B",null,"-",null,null,"●","●","●","M","-","●","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","●","●","-","V","-","-","-","-","-","-","-",null,null,"-","●",8,"-","●","●","●","●","●","E","●","-","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","-"]
[null,null,"SEM-BD-03","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe). Change in process, material, or dimensions.","e. g. change from Cr/NiV/Au to Cr/NiV/Ag ","A",null,"-",null,null,"-","-","●","M","-","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","●","●","-","V","-","-","-","-","-","●","-",null,null,"-","●","-","-","●","-","●","●","●","-","-","-","-","-","-","-","-","-","●","-","●","-","-","●","-","-","-","-","●"]
[null,null,"SEM-BD-04","Change of wafer setup or number of possible good dies on wafer.","I","P","Needed information for pick & place machine.","e. g. information change for pick & place machine.","B",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-BD-05","Change of optical appearance of wafer edge region (like imide coverage or edge exclusion)","I","P","Selection of dies in wafer edge region which have full electrical functionality. ",null,"B",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
[null,null,"SEM-BD-06","Die scribe or separation","I","P","Needed information for sawing and pick & place machine.","e. g. information change for pick & place machine.\ne. g. information change for sawing machine.","B",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"PROCESS - ASSEMBLY"]
[null,null,"SEM-PA-01","Change in critical dimensions of package","P","P","Change in dimensions of existing package.","e. g. changes in package dimensions (further development).","B",null,"-",null,null,"●","●","●","M","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"●","●","●","●","●","●","●","●","●","●","●","●","B","H","H","H","H","H","●","●","●","-","-","●","-","●","F","-","-"]
[null,null,"SEM-PA-02","Change of leadframe base material","P","P","New leadframe material in new composition.","e. g. change from alloy42 to copper\ne. g. change between two different copper alloys","B",null,"-",null,"●","-","●","●","M","●","-","-","-","-","●","●","●","-","U","-","-","-","-","-","-","-","-","-","-","-","V","-","L","H","-","-","H","-",null,"●","●","-","-","-","●","●","●","●","●","-","-","●","●","-","-","-","-","H","●","●","●",2,"-","●","-","-","A,F,X","●","-"]
[null,null,"SEM-PA-03","Change in leadframe dimensions","P","P","Change in leadframe dimensions which has impact to the specified electrical parameter acc. data sheet or specification (e.g. heat sink, pin dimensions, die paddle size, ...)\nNot included: Variation within specification.","e. g. change in lead frame geometry","B","ESD investigations are only necessary if internal ground and power supply connection of leadframe is affected.\nA = If impact on EMC behavior cannot be evaluated / excluded on component level.\n","-",null,null,"-","●","●","M","-","-","-","-","-","-","●","●","-","U","-","-","-","-","-","-","-","-","-","-","-","V","-","L","H","-","-","-","-",null,null,"-","-","-","-","●","-","●","●","●","-","-","●","-","-","-","-","-","H","-","-","●","-","-","●","-","-","-","-","●"]
[null,null,"SEM-PA-04","Change of lead frame finishing material / area (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e. g. change from Ag flash to NiP protection layer\ne. g. change from Ag spot to Au spot\ne. g. increase of silver plating area","C",null,"-",null,null,"●","●","●","M","●","-","-","-","-","C","●","-","-","U","-","-","-","-","-","-","-","-","-","-","-","-","-","L","H","-","-","H","-",null,null,"-","-","-","-","●","●","●","●","-","-","-","-","-","-","-","-","-","H","-","-","●","-","●","-","●","-","-","-","-","For wire bond strengh test preconditioning needed (AEC-Q101)."]
[null,null,"SEM-PA-05","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and process technique for final pin termination (e.g. pure tin).","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness ","B",null,"-",null,null,"●","●","●","M","●","-","-","-","-","C","●","-","-","U","-","-","-","-","-","-","-","-","-","-","-","-","-","L","H","-","-","H","-",null,null,"●","-","-","-","-","-","-","-","-","-","-","●","-","●","-","-","-","H","-","●","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-06","Bump Material / Metall System (internal)","P","P","Stack die or die to substrate (flip chip)","e. g. change to Pb-free material\ne. g. change of copper pillars","C",null,"-",null,null,"●","●","●","M","●","●","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","W","L","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-07","Die attach material","P","P","Change of die attach material (e.g. soft solder, epoxy, etc)",null,"C","A = If impact on EMC behavior cannot be evaluated / excluded on component level (if die attach has impact on electrical conductivity).","-",null,null,"●","●","●","M","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","V","-","L","H","-","-","H","H",null,null,"-","●","-","-","●","●","●","●","●","-","-","-","-","-","-","-","-","H","●","-","●","-","-","●","-","-","A,X","-","●"]
[null,null,"SEM-PA-08","Change of wire bonding\n","P","P","Material, diameter, change in process technique and / or bonding diagram","e. g. change from Au to Cu material\ne. g. change from 25µm to 23µm diameter\ne. g. change from single to double bond","C",null,"●",null,null,"●","●","●","Q","●","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","V","-","-","H","-","-","-","-",null,null,"-","●","-","-","●","-","●","●","●","-","●","-","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","●","Parameter Analysis: Strictly required only for Power devices.\nIn general: Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended.\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,null,"SEM-PA-09","Change of BGA substrate","P","P","Change of BGA substrate",null,"B","A = Impact on EMC behavior cannot be evaluated / excluded on component level.\nA = If impact on electrical funtion is not excluded on component level.","-",null,"●",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-10","Die Overcoat / Underfill","--","P","Supporting layers for complex packages like flip chip.",null,"C",null,"-",null,null,"●","●","●","M","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","W","-","-","-","-","-","H",null,null,"-","-","●","●","●","●","●","●","●","-","●","-","-","-","-","-","-","H","-","-","-","●","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-11","Change of mold compound","P","P","Change of mold compound.","e.g. change to green mold compound\ne. g. change of filler particles","B","A = impact of thermo mechanical stress caused by mismatch of mold compound, interconnecting technology and carrier is evident. ","-",null,null,"●","●","●","M","●","●","●","-","-","-","●","●","-","U","-","-","-","-","-","-","-","-","-","-","-","-","W","L","-","-","-","-","-",null,null,"●","●","●","●","●","●","●","●","●","-","●","●","-","B","-","-","-","H","●","●","●","-","-","-","-","●","A,F,G","-","●"]
[null,null,"SEM-PA-12","Change of encapsulation/sealing material","--","P","Metal cap and ceramic package","e.g. of metal cap composition","B","A = impact on EMC behavior cannot be evaluated / excluded on component level (if encapsulation / sealing has impact on electrical conductivity).","-",null,null,"-","●","●","-","●","-","-","-","-","-","-","●","-","U","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","-","●",null,null,"●","-","-","-","●","●","●","●","-","-","●","-","●","-","●","●","●","●","●","-","-","-","-","-","-","-","-","-","●"]
[null,null,"SEM-PA-13","Change of product marking","I","P","Marking on device.","e. g. change from inked marking to laser marking\ne. g. marking of pin 1\ne. g. change of appearance (additional marking)","B",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-14","Change in process technology \n(e.g., die attach, bonding, moulding, plating, trim and form, lead frame preperation,  …)","--","P","(--): If the change in process technology does not influence the integrety of the final product.\n(P): If the change in process technology can  influence the integrety of the final product.",null,"A","Please also check changes described under EQUIPMENT (SEM-EQ-01).","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-15","Process integrity: tuning within specification","--","P","Variation within process specification","e.g. process control","C",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PA-16","Change of direct material supplier","--","P","Change of suppliers e.g. for lead frames, wire material, die attach …","Change of suppliers e.g. for lead frames, wire material,  …","C",null,"-",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
[null,null,"SEM-PA-17","Change of specified assembly process sequence (deletion and/or additional process step)","--","P","E.g. lead finishing post trim & form changed to preplated lead frame.","e. g. additional cleaning step (plasma etching) or deletion of optical inspection","C",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Qualification depends on specific change."]
[null,null,"SEM-PA-18","Move of all or part of assembly to a different location/site/subcontractor.","P","P","Assembly transfer or relocation","Dual source strategy","C","A or B = impact on other type of changes described under PROCESS  ASSEMBLY and EQUIPMENT (SEM-EQ-01).","●",null,null,"●","●","●","M","-","●","●","-","●","●","●","●","T","U","-","-","-","-","-","-","-","-","●","-","-","-","-","L","H","-","-","H","H",null,null,"●","●","●","●","●","●","●","●","●","-","●","●","●","●","-","-","H","H","●","●","-","●","●","●","-","-","A,G,I,S,X","-","●","Whisker tests have to be done on monitoring basis!\n\nAEC-Q100: \"For broad changes that involve multiple attributes (e.g., site, materials, processes), refer to section A1.3 of this appendix and section 2.3 of Q100, which allows for the selection of worst-case test vehicles to cover all the possible permutations.\""]
[null,"Headings",null,"PACKING/SHIPPING"]
[null,null,"SEM-PS-01","Packing/shipping specification change","P","P","Packing/shipping specification change.",null," **",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-02","Dry pack requirements change ","P","P","Change of dry pack requirements (e.g. change of MSL)",null," **",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-03","Change of carrier (tray, reel)","P","P","Change of carrier (tray, reel)",null,"B",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"SEM-PS-04","Change of labelling","I","P","Change of labelling also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","B",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"EQUIPMENT"]
[null,null,"SEM-EQ-01","Production from a new equipment/tool which uses a different basic technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change in process technique which is not already covered above.","Change from single wafer to batch process (e.g. over pad metalisation)\ne.g. dambar cutting (mechanical to laser cutting)","A",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Affected process change is to check."]
[null,null,"SEM-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.\n\n","e. g. change from single site to multi site handler.","C",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
[null,null,"SEM-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of tester platform (e.g. new test program, new tester interface, …).","e. g. change tester equipment from LTX to Teradyne","C",null,"-",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Gage R&R / delta correlation"]
[null,"Headings",null,"TEST FLOW"]
[null,null,"SEM-TF-01","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor","P","P","Tester transfer or relocation. \nCheck impact on SEM-AN-01","Dual source strategy","C",null,"●",null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Gage R&R / delta correlation"]
[null,"Headings",null,"Q-GATE"]
[null,null,"SEM-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","E. g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.","E. g. test flow block, reduction from three temperature measurements to two temperature measurements, change in burn in / run in process.","C",null,"●",null,null,"-","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-",null,null,"-","●","-","-","-","-","-","-","*","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Parameter Analysis: Delta correlation\n\n* For \"burn in\" changes ELFR recommended "]
[]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,"C",null,"-","-","-","-","-","A","M","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","●","●","●","S","●","●","-","-","-","-","-","-","-","-","-","●","●","●",3,"-","-","-","●","E",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","-","●"]
[]
[null,null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","●","●","●","●","-","●","●","-","-","-","-","-","-","-","-","-","●","●","●",3,"-","-","-","●","E",3,"-","-","-","-","-","-","-","-","-","-","-","-","-","M","-","-","-","●"]
[]
[null,null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) ",null,null,null,null,null,null,null,null,null,null,"●","●",null,"●","●","●",null,null,null,null,null,null,null,null,null,null,null,null,"●","●","●","●","●",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[]
[null,null,null,"Reason for exception of tests:"]
[null,null,null,"Not related to Peripheral Routing.",null,null,null,null,null,null,null,null,null,null,null,"•"]
[null,null,null,"This product is not a high power device.",null,null,null,null,null,null,null,null,null,null,null,null,"•"]
[]
[]
[]
[null,null,"--","Not required."]
[null,null,"I","Information Note required."]
[null,null,"P","PCN required."]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," "]
[]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the appropriate process change."]
[]
[null,null,null,"CONDITIONS"]
[null,null,"A","Only for peripheral routing","X"]
[null,null,"B","For symbol rework, new cure time, temp","X"]
[null,null,"C","If bond to leadfinger","X"]
[null,null,"D","Design rule change","X"]
[null,null,"E","Thickness only","X"]
[null,null,"F","MEMS element only","X"]
[null,null,"G","Only from non-100% burned-in parts","X"]
[null,null,"H","Hermetic only","X"]
[null,null,"J","EPROM or EEPROM","X"]
[null,null,"K","Passivation only","X"]
[null,null,"L","Lead free","X"]
[null,null,"M","For devices requiring PTC","X"]
[null,null,"N","Passivation and gate oxide","X"]
[null,null,"P","Passivation and interlevel dielectric","X"]
[null,null,"Q","Wire diameter decrease","X"]
[null,null,"S","Required for plastic SMD only","X"]
[null,null,"T","Only for Solder Ball SMD","X"]
[null,null,"U","Only for through-hole devices","X"]
[null,null,"V","Only for smart power devices","X"]
[null,null,"W","For devices with memory sizes ≥ 1Mbit SRAM or DRAM","X"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the appropriate process change."]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Acoustic Microscopy"]
[null,null,"B","If not laser etched",null,null,null,null,null," "]
[null,null,"E","If Applicable"]
[null,null,"F","Finite Element Analysis"]
[null,null,"G","Glass Transition Temperature"]
[null,null,"H","Hermetic device only"]
[null,null,"I","Infant Mortality Rate"]
[null,null,"M","Power MOS/IGBT devices only"]
[null,null,"P","CV Plot (MOS only)"]
[null,null,"R","Spreading Resistance Profile"]
[null,null,"S","Steady State Mortality Rate"]
[null,null,"X","X-Ray"]
[null,null,1,"If bond pads are affected"]
[null,null,2,"Verify #2 (package) post"]
[null,null,3,"Only for changes at the periphery"]
[null,null,4,"Only for oxide etches or etches prior to oxidation"]
[null,null,5,"For source or channel region changes"]
[null,null,6,"For field termination changes"]
[null,null,7,"For passivation changes"]
[null,null,8,"For contact changes"]
[null,null,9,"For epitaxial changes"]
[null,null,0,"Required for Schottky barrier changes."]
[null,null,"*","For \"burn in\" changes IOL or ELFR recommended"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
[]
[]
[]
[]
[null,null,"Comments"]
[]
[]
[]
[]
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[]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]

{"sheet":"Passive Component","index":4,"n_rows":506,"n_cols":48,"rows_kept":506,"cut":false,"hidden":false,"merged":[[3,12,3,46],[4,45,4,46],[1,0,1,2],[2,0,2,2],[3,0,3,2],[4,0,4,2],[1,6,1,7],[4,14,4,44],[5,47,6,47],[5,29,6,29],[5,38,6,38],[5,30,6,30],[5,16,6,16],[5,21,6,21],[5,22,6,22],[5,35,6,35],[5,45,6,45],[5,46,6,46],[5,39,6,39],[5,40,6,40],[5,41,6,41],[5,42,6,42],[5,43,6,43],[5,44,6,44],[5,17,6,17],[5,18,6,18],[5,28,6,28],[5,23,6,23],[5,24,6,24],[5,25,6,25],[5,26,6,26],[5,27,6,27],[5,19,6,19],[5,20,6,20],[5,8,7,8],[6,4,6,5],[5,14,6,14],[5,15,6,15],[5,12,7,12],[5,13,7,13],[6,6,7,6],[6,7,7,7],[6,9,7,9],[5,10,7,10],[5,11,7,11],[5,31,6,31],[5,32,6,32],[5,36,6,36],[5,37,6,37],[5,33,6,33],[5,34,6,34],[471,2,471,8],[473,2,473,8],[475,2,475,8],[477,2,480,8],[490,2,490,5]]}
[]
["Worked on:\n (Name, Function)",null,null,"Max Mustermann",null,null,{"$f":"Guidance!A8","v":"Form provided by ZVEI  ‒  Revision 2.2.4  ̶  06/2015"}]
["Date:"]
["PCN number:",null,null,null,null,null," ",null,null,null,null,null,"Device evaluation"]
["Signature:",null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q200 Revision D",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"additional to AEC-Q200"]
[" ",null,null,null,null,null,null,null,"Remarks / Comments","Evaluation level\n A / B / C","Further applicable conditions","Line evaluation\n(can be evaluated by data or audit/on site check)","AEC-Q200 Revision D","Check of specification \n(for raw material only)","High Temp Exposure (Storage)","Temperature Cycling","Destructive Physical Analysis","Moisture Resistance","Biased Humidity","Operational Life","External Visual","Physical Dimension","Terminal Strength (Leaded)","Resistance to Solvents","Mechanical Shock","Vibration","Resistance to Soldering Heat","Thermal Shock","Electrostatic Discharge (ESD)","Solderability","Electrical Characterization","Flammability","Board Flex","Terminal Strength (SMD)","Beam Load Test","Flame Retardance","Rotation Life","Surge Voltage","Salt Spray","Electrical Transient Conduction","Shear Strength","Fault Current Durability","End-of-Life Mode Verification","Jump Start Endurance","Load Dump Endurance","Whisker Test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution","Remarks"]
[null,null,null,"Assessment of impact on Supply Chain regarding following aspects\n  - contractual agreements\n  - technical interface of processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Remaining\nrisks on\nSupply\nChain?",null,"Description of change","Understanding of component experts ",null,"  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: will become A/B/C after decision\n  ** : Not relevant for qualification matrix"]
["Selection of\n component",null,null,"Type of change","No","Yes",null,null,null,null,null,null,null,null,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20,21,22,23,24,25,27,29,30,31,32,33,34,35]
["NETWORKS & RESISTORS","Headings",null,"NETWORKS & RESISTORS"]
["NETWORKS & RESISTORS",null,null,"ANY"]
["NETWORKS & RESISTORS",null,"RES-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["NETWORKS & RESISTORS",null,null,"DATASHEET"]
["NETWORKS & RESISTORS",null,"RES-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot encluded: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"MATERIAL"]
["NETWORKS & RESISTORS",null,"RES-MA-01","Change of material composition","P","P","Change of Ink / Wire material","Resistor element:\ne.g. resistor paste, NiCr, resistor wire ",null,"C",null,"-","●","●","●","●","-","-","-","●","-","-","W","-","-","-","-","●","F","-","-","-","●","●","-","R","-","-","-","-","-","-","-","-","-","-","●"]
["NETWORKS & RESISTORS",null,"RES-MA-02","Change of material composition","P","P","Change of Ink / Wire material","Terminal element:\ne.g.  AgPd paste, Ag paste,  lead wire , NiCr for side termination",null,"B",null,"-","●","●","●","●","-","-","-","●","-","-","W","-","-","-","-","●","F","-","-","-","●","●","-","R","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-MA-03","Change of material composition","P","P","Change of Package","e.g. for chip res.: final coating, epoxy\n","Check whether AOI at tier 1 can be affected","B",null,"-","●","●","●","●","-","●","●","-","●","●","●","●","-","●","-","●","●","-","-","●","●","●","-","R","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-MA-04","Change of material composition","P","P","Change of Passivation","Inner protection, e.g. glass",null,"C",null,"-","●","●","●","●","-","●","●","●","-","-","-","●","-","-","-","●","-","-","-","●","-","-","-","R","-","-","N","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-MA-05","Change of material composition","P","P","Change of substrate material",null,null,"C",null,"-","●","●","-","●","-","●","●","●","-","-","●","-","-","-","●","●","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-MA-06","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","●","●","-","●","-","●","-","-","-","●","●","●","-","-","●","●","●","-","-","●","-","-","-","R","-","-","N","-","-","-","-","-","-","-","●"]
["NETWORKS & RESISTORS",null,null,"DESIGN"]
["NETWORKS & RESISTORS",null,"RES-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of package",null," (appearance)","B",null,"-","●","-","●","●","-","●","●","-","●","●","●","●","-","●","●","●","●","●","-","●","●","●","-","R","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-DE-02","Changes of inner construction","-","P","Change of passivation","Inner protection, e.g. glass",null,"C",null,"-","●","-","●","●","-","●","●","●","-","-","-","●","-","-","-","●","-","-","-","●","-","-","-","R","-","-","N","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-DE-03","Changes of inner construction","-","P","Change of Res / Cap tolerance","Resistance or capacitance",null,"B",null,"-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NETWORKS & RESISTORS",null,"RES-DE-04","Changes of inner construction","-","P","Change of Res / Cap value","Resistance or capacitance",null,"B",null,"-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","●","●","●","-","-","-","-","-","-","R","-","-","-","-","-","-","-","-","-","-","●"]
["NETWORKS & RESISTORS","Headings",null,"PROCESS"]
["NETWORKS & RESISTORS",null,"RES-PR-01","Changes in process technology or manufacturing methods","-","P","Change of ink fire","All firing processes",null,"C",null,"●","●","-","-","●","-","-","-","●","-","-","R","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NETWORKS & RESISTORS",null,"RES-PR-02","Changes in process technology or manufacturing methods","-","P","Change of ink print","All printing processes",null,"C",null,"●","●","-","●","●","-","-","-","●","-","-","R","-","-","-","-","●","-","-","-","-","R","R","-","R","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PR-03","Changes in process technology or manufacturing methods","-","P","Change of laser trim",null,null,"C",null,"●","●","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PR-04","Changes in process technology or manufacturing methods","-","P","Change of lead form",null,null,"B",null,"●","●","-","-","-","-","-","●","-","●","●","●","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","N","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PR-05","Changes in process technology or manufacturing methods","-","P","Change of termination attach","Chip R: galvanic process\nothers: eg. welding of leads",null,"B",null,"●","●","-","-","-","-","-","●","-","-","-","●","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","N","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PR-06","Changes in process technology or manufacturing methods","-","P","Change of marking",null,null,"B",null,"●","●","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PR-07","Changes in process technology or manufacturing methods","-","P","Change of molding",null,null,"B",null,"●","●","-","●","●","-","●","●","-","●","●","●","●","-","●","-","●","●","-","-","●","●","●","-","R","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PR-08","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["NETWORKS & RESISTORS",null,"RES-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["NETWORKS & RESISTORS",null,"RES-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS",null,"RES-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NETWORKS & RESISTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["NETWORKS & RESISTORS",null,"RES-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","●","-","-","●","-","●","-","●","-","-","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["NETWORKS & RESISTORS",null,"RES-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","●","-","-","●","-","●","-","●","-","-","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NETWORKS & RESISTORS",null,"RES-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NETWORKS & RESISTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["NETWORKS & RESISTORS",null,"RES-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","●","-","-","●","●","●","-","B","-","●","●","-","R","-","-","N","-","-","-","-","-","-","●","●"]
["NETWORKS & RESISTORS",null,"RES-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["NETWORKS & RESISTORS",null,"RES-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["NETWORKS & RESISTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["NETWORKS & RESISTORS",null,"RES-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"INDUCTORS"]
["INDUCTORS","Headings",null,"ANY"]
["INDUCTORS",null,"IND-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["INDUCTORS","Headings",null,"DATASHEET"]
["INDUCTORS",null,"IND-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot encluded: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. specification of additional parameter","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"MATERIAL"]
["INDUCTORS",null,"IND-MA-01","Change of material composition","P","P","Change of bobbin material","Material without magnetic function (\"Spulenkörper\") typically made by plastic material",null,"B",null,"-","●","●","●","●","-","-","●","●","●","●","-","-","●","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-MA-02","Change of material composition","P","P","Change of core material","Material with magnetic function",null,"A",null,"-","●","●","●","●","-","-","-","●","●","-","-","-","●","-","-","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS",null,"IND-MA-03","Change of material composition","P","P","Change of insulation material","E.g. wire insulation, insulation tapes, ...",null,"C",null,"-","●","●","●","●","-","-","●","●","●","-","-","●","-","-","●","●","A","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-MA-04","Change of material composition","P","P","Change of lead material","Terminals",null,"B",null,"-","●"," ","-","-","-","-","-","●","●","-","●","-","-","●","●","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["INDUCTORS",null,"IND-MA-05","Change of material composition","P","P","Change of mold material","Change of mold compound (e.g. change to green mold)","Electrical function affected if mechanical stress distribution changes. AOI, wave soldering and board coating has to be assessed. MSL might change.","B",null,"-","●","●","●","●","-","●","●","●","●","-","-","●","●","-","-","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS",null,"IND-MA-06","Change of material composition","P","P","Change of solder material","Internal connection",null,"B",null,"-","●","●","-","●","-","-","-","-","●","-","●","-","●","●","●","●","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["INDUCTORS",null,"IND-MA-07","Change of material composition","P","P","Change of wire/foil material","Wire for wounded inductors.\nFoil for multilayer inductors (inner electrode).",null,"B",null,"-","●","●","●","-","-","●","●","●","●","-","-","-","-","-","-","-","A","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS",null,"IND-MA-08","Change of material composition","P","P","Change of glue material","Glue material for e.g. connection of core-core, core-bobbin","Considere in case of core-core glue the air gap","C",null,"-","●","●","-","●","-","-","●","-","●","-","-","-","-","●","●","-","-","●","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS",null,"IND-MA-09","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","●","●","-","●","-","●","●","-","●","●","●","-","-","-","-","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS","Headings",null,"DESIGN"]
["INDUCTORS",null,"IND-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of bobbin","Material without magnetic function (\"Spulenkörper\") typically made by plastic material",null,"B",null,"-","●","-","-","●","-","-","-","-","●","●","-","-","●","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS",null,"IND-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of lead","Terminals","Effect regarding EMC relevant for high frequency only.","A",null,"-","●","-","-","-","-","-","-","-","●","●","●","-","-","●","●","-","●","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","●"]
["INDUCTORS",null,"IND-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of mold",null,null,"B",null,"-","●","-","-","●","-","●","●","-","●","●"," ","●","●","-","-","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Parameter Analysis only for components where mold material has magnetic function"]
["INDUCTORS",null,"IND-DE-04","Changes of inner construction","-","P","Change of core","Material with magnetic function",null,"A",null,"-","●","-","-","●","-","-","-","-","●","●","-","-","●","●","-","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS",null,"IND-DE-05","Changes of inner construction","-","P","Change of insulation system","E.g. wire insulation, insulation tapes, ...",null,"C",null,"-","●","-","●","-","-","-","●","●","●","●","-","●","-","-","●","-","A","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-DE-06","Changes of inner construction","-","P","Change of wire / foil","Wire for wounded inductors.\nFoil for multilayer inductors (inner electrode).",null,"B",null,"-","●","-","-","●","-","-","-","-","●","●","-","-","-","●","-","●","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS","Headings",null,"PROCESS"]
["INDUCTORS",null,"IND-PR-01","Changes in process technology or manufacturing methods","-","P","Change of insulation strip","(Mechanical) removal of insulation.","Mechanical damage of wire,\nimpact on solderability in case of stripping process is affecting soldering area","B",null,"●","●","-","-","-","-","●","-","-","●","-","-","●","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PR-02","Changes in process technology or manufacturing methods","-","P","Change of lead prep. / plating",null,"Influence regarding reliability of solder joint.","B",null,"●","●","-","-","●","-","-","-","-","●","-","●","-","-","●","●","●","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["INDUCTORS",null,"IND-PR-03","Changes in process technology or manufacturing methods","-","P","Change of terminal attach","Connection of wire terminal.\nConnection of termination to core/bobbin.","Increase of contact resistance.","C",null,"●","●","-","-","●","-","●","●","-","●","-","●","-","●","●","A","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["INDUCTORS",null,"IND-PR-04","Changes in process technology or manufacturing methods","-","P","Change of marking",null,null,"B",null,"●","●","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PR-05","Changes in process technology or manufacturing methods","-","P","Change of molding","See also affected change on specific material / process.",null,"B",null,"●","●","-","●","●","-","-","●","●","●","●","-","●","●","-","-","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PR-06","Changes in process technology or manufacturing methods","-","P","Change of soldering","Internal connection",null,"B",null,"●","●","-","-","●","-","-","-","-","●","-","●","-","-","●","-","●","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PR-07","Changes in process technology or manufacturing methods","-","P","Change of winding - insulation",null,null,"B",null,"●","●","-","●","-","-","-","●","●","●","-","-","●","-","-","●","-","A","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PR-08","Changes in process technology or manufacturing methods","-","P","Change of winding - wire",null,null,"C",null,"●","●","-","●","-","-","●","-","●","●","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS",null,"IND-PR-09","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["INDUCTORS",null,"IND-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["INDUCTORS",null,"IND-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS",null,"IND-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["INDUCTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["INDUCTORS",null,"IND-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["INDUCTORS",null,"IND-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["INDUCTORS",null,"IND-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["INDUCTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["INDUCTORS",null,"IND-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","-","●","●","●","-","-","●","-","-","-","●","●","-","-","B","-","-","●","-","-","-","-","-","-","-","-","-","-","-","●","●"]
["INDUCTORS",null,"IND-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["INDUCTORS",null,"IND-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["INDUCTORS","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["INDUCTORS",null,"IND-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","●","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings","Headings","CERAMIC / TANTALUM"]
["CERAMIC / TANTALUM","Headings","Headings","ANY"]
["CERAMIC / TANTALUM",null,"CER-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["CERAMIC / TANTALUM","Headings","Headings","DATASHEET"]
["CERAMIC / TANTALUM",null,"CER-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot included: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings","Headings","MATERIAL"]
["CERAMIC / TANTALUM",null,"CER-MA-01","Change of material composition","P","P","Change of binder material","Binder material (ceramic)",null,"C",null,"-","●","●","-","●","●","-","-","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-MA-02","Change of material composition","P","P","Change of binder material","Binder material (tantal)",null,"C",null,"-","●","●","-","●","●","-","-","-","-","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-MA-03","Change of material composition","P","P","Change of dielectric","Dielectric change (ceramic only)",null,"C",null,"-","●","●","●","●","●","-","●","●","-","-","●","●","●","●","-","●","●","-","B","-","C","-","●","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-MA-04","Change of material composition","P","P","Change of electrode attach","Electrode attach (only tantal, glue, carbon, Ag)",null,"C",null,"-","●","●","●","●","-","-","-","●","-","-","-","-","-","-","C","●","-","-","B","-","C","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-MA-05","Change of material composition","P","P","Change of electrode material","Electrode Material (only ceramic, inner elctrode)",null,"C",null,"-","●","●","●","●","●","-","●","●","-","-","●","●","-","●","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-MA-06","Change of material composition","P","P","Change of encapsulation","Encapsulation","Check whether AOI at Tier 1 can be affected","C",null,"-","●","●","-","●","-","●","●","-","●","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-MA-07","Change of material composition","P","P","Change of lead material","Lead material / Termination",null,"C",null,"-","●","●","-","●","●","-","-","●","●","-","●","-","-","●","●","-","-","●","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-MA-08","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","●","●","●","●","●","●","●","●","-","-","●","●","●","●","●","●","●","●","B","-","●","●","C","-","-","-","-","-","-","-","-","-","-","-","●"]
["CERAMIC / TANTALUM","Headings","Headings","DESIGN"]
["CERAMIC / TANTALUM",null,"CER-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of lead diameter","Lead diameter",null,"B",null,"-","●","-","-","●","-","●","●","●","●","●","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of termination area","Termination area",null,"B",null,"-","●","-","●","-","-","●","-","-","●","●","-","-","-","●","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of terminal interface","Terminal interface",null,"B",null,"-","●","-","●","●","●","●","●","●","-","-","●","-","●","●","●","-","-","-","B",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-DE-04","Changes of inner construction","-","P","Change of electrode thickness","Electrode thickness  (ceramic only)",null,"C",null,"-","●","-","●","●","●","-",null,"●","-","●","-","-","●","●","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-DE-05","Changes of inner construction","-","P","Change of layer thickness","Layer thickness (dielectric thickness)",null,"C",null,"-","●","-","●","●","●","-","●","●","-","●","●","-","●","-","-","●","●","-","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-DE-06","Changes of inner construction","-","P","Change of number of layers","Number of layers (ceramic only)",null,"C",null,"-","●","-","-","C","C","-","C","C","-","C","-","-","C","-","-","C","C","-","B,C","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings","Headings","PROCESS"]
["CERAMIC / TANTALUM",null,"CER-PR-01","Changes in process technology or manufacturing methods","-","P","Change of dicing","Dicing (e.g. change from cutting to sawing)",null,"C",null,"●","●","-","●","●","-","●","●","-","●","●","-","●","●","-","-","-","-","-","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PR-02","Changes in process technology or manufacturing methods","-","P","Change of electrode apply","Electrode apply  (dielectric layer process)","Depends on wet or dry process.","C",null,"●","●","-","C","-","-","-","C","-","-","-","-","-","-","-","C","C","C","-","B,C","-","C","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PR-03","Changes in process technology or manufacturing methods","-","P","Change of firing profile","Firing profile",null,"C",null,"●","●","-","-","●","●","-","-","●","-","-","-","-","-","-","-","●","●","-","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PR-04","Changes in process technology or manufacturing methods","-","P","Change of lamination / press techinque","Lamination / Press techinque",null,"C",null,"●","●","-","-","-","●","-","●","-","-","-","-","-","-","-","●","●",null,"-","B","-","●","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PR-05","Changes in process technology or manufacturing methods","-","P","Change of powder particle size","Powder particle size",null,"C",null,"●","●","-","-","●",null,"-","●","-","-","-","-","-","-","-","●","-","●","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PR-06","Changes in process technology or manufacturing methods","-","P","Change of screening / printing","Screening / Printing (ceramic only)",null,"C",null,"●","●","-","-","-","-","-","-","C","-","-","-","-","C","-","-","-","C","-","B,C","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PR-07","Changes in process technology or manufacturing methods","-","P","Change of termination process","Termination process",null,"B",null,"●","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PR-08","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings","Headings","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["CERAMIC / TANTALUM",null,"CER-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings","Headings","PACKING / SHIPPING  -  VISUAL INSPECTION"]
["CERAMIC / TANTALUM",null,"CER-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM",null,"CER-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["CERAMIC / TANTALUM","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["CERAMIC / TANTALUM",null,"CER-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","●","-","-","●","-","●","●","●","-","●","A","-","-","●","-","-","●","●","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["CERAMIC / TANTALUM",null,"CER-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","●","-","-","●","-","●","●","●","-","●","A","-","-","●","-","-","●","●","B","-","-","-","C","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["CERAMIC / TANTALUM",null,"CER-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["CERAMIC / TANTALUM","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["CERAMIC / TANTALUM",null,"CER-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","●","●","●","B",null,"●","●","C","-","-","-","-","-","-","-","-","-","-","●","●"]
["CERAMIC / TANTALUM",null,"CER-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["CERAMIC / TANTALUM",null,"CER-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["CERAMIC / TANTALUM","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["CERAMIC / TANTALUM",null,"CER-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings","Headings","Film capacitors"]
["Film capacitors","Headings","Headings","Any"]
["Film capacitors",null,"FLM-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["Film capacitors","Headings","Headings","DATASHEET"]
["Film capacitors",null,"FLM-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot included: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings","Headings","MATERIAL"]
["Film capacitors",null,"FLM-MA-01","Change of material composition","P","P","Change of Epoxy ","Change of sealing compound\ne.g. epoxy, PU, …","Consider vibration in application","C",null,"-","●","●","●","●","-","●","●","●","●","●","●","●","●","●","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-MA-02","Change of material composition","P","P","Change of Housing","Change material of package,\ne.g. change from PBT to PPS\ne.g. change of glas fiber ratio","Consider AOI and processability","B",null,"-","●","●","-","●","-","-","●","●","●","●","●","●","●","●","-","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-MA-03","Change of material composition","P","P","Change of Lead/Termination","e.g. change of basis material from Cu to Fe\ne.g. change of finishing from SnPb to Sn","Change of base material: Consider ESR, high frequency parameter","B",null,"-","●","●","-","-","-","●","-","-","-","●","●","-","●","-","●","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["Film capacitors",null,"FLM-MA-04","Change of material composition","P","P","Change of Metall Spray (Schoop)","Use different material for metall spray process\ne.g. from Zn to Al","Consider ESR\nEvaluation level C: for boxed types\nEvaluation level B: for naked SMD\n(Check of processability)  ","B",null,"-","●","●","-","●","-","●","-","●","-","-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Solderability Test for naked SMD components."]
["Film capacitors",null,"FLM-MA-05","Change of material composition","P","P","Change of Film material","e.g  Change of foil material  due to discontinuation of current foil material","Evaluation level C: for boxed types\nEvaluation level B: for naked SMD\n(Check of processability)  ","B",null,"-","●","●","-","●","-","-","●","●","●","●","-","-","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Film capacitors",null,"FLM-MA-06","Change of material composition","P","P","Change of film metallization or metal foil","Metallization material for inner electrode\ne.g. change from Al to Al-Zn alloy",null,"C",null,"-","●","●","-","●","-","-","●","●","●","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Film capacitors",null,"FLM-MA-07","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","●","●","●","●","-","●","-","●","-","-","●","●","-","●","●","●","-","●","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Film capacitors","Headings","Headings","DESIGN"]
["Film capacitors",null,"FLM-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of lead diameter \n/ terminal thickness","e.g. change lead diameter from 0.5 to 0.4 mm\ne.g. change of thickness of terminal ",null,"B",null,"-","●","-","-","●","-","-","-","-","●","●","●","-","●","●","-","-","-","-","●","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of termination area","Changes which are affecting the area for connection of component and PCB\ne.g. change of termination layer thickness\ne.g. change in termination dimensions / shape",null,"B",null,"-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["Film capacitors",null,"FLM-DE-03","Changes of inner construction","-","P","Change of inner connection","e.g. change from soldered connection to welded connection",null,"C",null,"-","●","-","-","●","-","-","-","●","●","-","●","-","●","●","●","-","-","-","●","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of appearance","e.g. change or adding of colour on component\nAllways in combination with other changes!","Not included changes in marking of the component.","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-DE-05","Changes of inner construction","-","P","Change of Foil Design","e.g. change of foil dimensions\ne.g. change of thickness of metallisation\ne.g. change of pattern / structure of metalisation\ne.g. change of cutting edge",null,"C",null,"-","●","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Film capacitors",null,"FLM-DE-06","Changes of inner construction","-","P","Change of insulation","Change of outer insulation of winding element \ne.g. resin dimension / quantity\ne.g. encapsulation dimension / number of layer",null,"C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Film capacitors",null,"FLM-DE-07","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of Housing","e.g. change of dimension or shape\ne.g. change of surface",null,"B",null,"-","●","-","-","●","-","●","-","-","●","●","-","●","●","●","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings","Headings","PROCESS"]
["Film capacitors",null,"FLM-PR-01","Changes in process technology or manufacturing methods","-","P","Change of Resin (Epoxy) Fill ","Change of resin filling or hardening process (relevant for boxed types)",null,"C",null,"●","●","-","●","●","-","-","●","●","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-PR-02","Changes in process technology or manufacturing methods","-","P","Change Terminal Attach Process","Attach of terminal to winding element \ne.g. spraying and/or galvanic process,\ne.g.  welding / soldering","Consider ESR\nEvaluation level C: for boxed types\nEvaluation level B: for naked SMD\n(Check of processability)  ","B",null,"●","●","-","-","●","-","●","-","●","-","-","●","●","-","-","-","-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-PR-03","Changes in process technology or manufacturing methods","-","P","Change of winding process","Change of winding, flattening or tempering process",null,"C",null,"●","●","-","●","-","-","-","●","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-PR-04","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings","Headings","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["Film capacitors",null,"FLM-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings","Headings","PACKING / SHIPPING  -  VISUAL INSPECTION"]
["Film capacitors",null,"FLM-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors",null,"FLM-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Film capacitors","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["Film capacitors",null,"FLM-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","●","-","-","●","-","●","●","●","●","●","●","-","-","-","-","●","●","-","B","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Film capacitors",null,"FLM-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","●","-","-","●","-","●","●","●","●","●","●","-","-","-","-","●","●","-","B","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Film capacitors",null,"FLM-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Film capacitors","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["Film capacitors",null,"FLM-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","●","●"]
["Film capacitors",null,"FLM-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["Film capacitors",null,"FLM-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["Film capacitors","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["Film capacitors",null,"FLM-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"QUARTZ CRYSTAL / SAW"]
["QUARTZ CRYSTAL / SAW","Headings",null,"ANY"]
["QUARTZ CRYSTAL / SAW",null,"QUA-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.",null,"B",null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"DATASHEET"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \n(e.g. recomendations for load capacitors)\nNot included: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"MATERIAL"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-01","Change of material composition","P","P","Change of Quartz Blank","Only For SAW-Filter \nVery rare case of changing quartz blank material.",null,"A",null,"-","●","●","●","●","-","-","-","●","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-02","Change of material composition","P","P","Change of Base","Changing of the material of the base","C0 may be influenced\nTemperature expansion coefficient may change","A",null,"-","●","●","-","●","-","●","●","-","●","●","-","●","●","●","●","●","-","-","-","●","●","●","-","-","-","-","-","-","●","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-03","Change of material composition","P","P","Change of Lead/Termination","e.g. Change of plating finish. (eg:Au, AgPd,Sn)",null,"B",null,"-","●","●","-","●","-","-","-","-","●","●","●","●","-","●","●","-","-","●","B","-","●","●","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-04","Change of material composition","P","P","Change of Glass Seal","Change of sealing  glass e.g. to lead free glass\n","X-Ray inspection may be influenced when sealing is containing Pb","B",null,"-","●","●","●","●","●","●","●","●","●","-","●","●","●","●","●","●","-","-","B","-","●","●","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-05","Change of material composition","P","P","Change of Can/Cap","Changing of the material of the can/cap e.g. from metal to ceramic material",null,"A",null,"-","●","●","●","●","-","●","●","●","●","●","-","●","●","●","●","●","-","-","B","-","●","-","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-06","Change of material composition","P","P","Change of Blank Support","e.g. Change of glue (Silicone to Epoxy)\ne.g. Change metal holders (old types)",null,"C",null,"-","●","●","●","●","-","Y","Y","●","-","-","-","-","●","●","●","●","-","-","B","-","●","-","-","-","-","-","Y","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-07","Change of material composition","P","P","Change of Overmold","e.g. change to green mold compound\ne. g. change of filler particles","Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed.","B",null,"-","●","●","●","●","●","●","●","●","●","●","-","●","●","●","●","●","-","-","B","●","●","●","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-08","Change of material composition","P","P","Change of Case Sealing","Change of material for seam welding\nRelevant for components with ceramic base and metall cap.","Impedance my be influenced","C\n-",null,"-","●","●","●","●","-","Y","●","-","●","-","-","●","●","●","●","●","-","-","B","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-09","Change of material composition","P","P","Change of Electrode","Change of Electrode material. (eg:Au, Ag) on crystal blank",null,"C",null,"-","●","●","●","●","-","Y","Y","●","-","-","-","Y","-","●","●","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-10","Change of material composition","P","P","Change of Insulator","Only for leaded types\nNot relevant for typical SMD.\nE.g. Insulating plate under crystal\ne.g.  Glass sealing for leads",null,"B",null,"-","●","●","●","●","●","●","-","●","●","●","-","●","-","●","●","●","-","-","B","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-11","Change of material composition","P","P","Change of marking material","e.g. change of ink\ne.g. chemical to environmental friendly","AOI check necessary!","B",null,"-","+","●","-","-","-","-","-","-","●","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-MA-12","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"DESIGN"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of Base design","Change of Base design, e.g. due to miniaturization purpose.","A, B, C: Depends on  change","*",null,"-","●","-","●","●","-","●","●","-","●","●","●","●","●","●","●","●","-","-","-","●","●","●","-","-","-","-","-","-","●","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of Lead/Termination design","Change geometry or terminal pad or lead form","C0 may be influenced\nReliabiliy of solder joints may be affected","B",null,"-","●","-","-","●","-","-","-","-","●","●","●","-","●","●","●","-","-","●","B","-","●","●","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of Can/Cap design","Change of Can / Cap design, e.g. due to miniaturization purpose.",null,"A",null,"-","●","-","●","●","●","●","●","-","●","●","-","●","●","●","●","●","-","-","B","-","●","-","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of Package (Molded)","Change the design of the package\nNot relevant for typical SMD.","Electrical function affected in case of mechanical stress distribution change. AOI, wave soldering and board coating has to be assessed. MSL might be changed.","B",null,"-","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","●","-","-","B","●","●","●","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DE-05","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of Insulator design","Only for leaded types\nNot relevant for typical SMD.",null,"B",null,"-","●","-","●","●","●","●","-","●","●","●","-","●","-","●","●","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DE-06","Changes of inner construction","-","P","Change of Quartz Blank design","e.g. change dimension of blank, add phase, electrode design, …",null,"C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-DE-07","Changes of inner construction","-","P","Change of Blank Support design","Change design of glue shape\nchange design of  metall supporter",null,"C",null,"-","●","-","●","●","-","Y","Y","●","-","-","-","-","●","●","●","●","-","-","B","-","●","-","-","-","-","-","Y","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"PROCESS"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-01","Changes in process technology or manufacturing methods","-","P","Change of Quartz Blank process","eg. change of cutting or lapping technology",null,"C",null,"●","●","-","-","●","-","-","-","●","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-02","Changes in process technology or manufacturing methods","-","P","Change of Blank Etch/Clean process","Using different / new technology\ne.g. change from liquid etching to plasma etching",null,"C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","-","●","-","●","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-03","Changes in process technology or manufacturing methods","-","P","Change of Electrode Formation process","e.g. change from evaporation to sputtering",null,"C",null,"●","●","-","-","●","-","-","-","●","-","-","-","-","-","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-04","Changes in process technology or manufacturing methods","-","P","Change of Auto Trim process","Method of final frequency tuning\ne.g. change from evaporation to ion beam",null,"C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-05","Changes in process technology or manufacturing methods","-","P","Change of Blank bonding / annealing process","Change of method how apply conductive material to base or blank",null,"C",null,"●","●","-","●","●","●","Y","Y","●","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","Y","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-06","Changes in process technology or manufacturing methods","-","P","Change of Cap/Can attaching process","Change of the sealing method\ne.g. change  from batch oven to reflow oven",null,"C",null,"●","●","-","●","●","●","Y","●","●","●","●","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-07","Changes in process technology or manufacturing methods","-","P","Change of Overmolding process","Not relevant for typical SMD.\nChange of overmold process parameter",null,"C",null,"●","●","-","●","●","●","●","●","●","●","●","●","-","●","●","-","●","-","-","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-08","Changes in process technology or manufacturing methods","-","P","Change of Marking process","e. g. change from inked marking to laser marking\ne. g. marking of pin 1\ne. g. change of appearance (additional marking)","AOI check necessary!","B",null,"●","●","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-09","Changes in process technology or manufacturing methods","-","P","Change of Aging process","Typically no aging done on quartz crystals\nIf aging is done: e.g. change of times or temperatures",null,"C",null,"●","●","-","●","-","-","-","-","-","-","-","-","-","●","●","-","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PR-10","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"PACKING / SHIPPING  -  VISUAL INSPECTION"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["QUARTZ CRYSTAL / SAW","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  EQUIPMEMENT"]
["QUARTZ CRYSTAL / SAW",null,"QUA-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["QUARTZ CRYSTAL / SAW",null,"QUA-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["QUARTZ CRYSTAL / SAW",null,"QUA-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["QUARTZ CRYSTAL / SAW","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","●","●","●","●","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","●","●"]
["QUARTZ CRYSTAL / SAW",null,"QUA-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["QUARTZ CRYSTAL / SAW",null,"QUA-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["QUARTZ CRYSTAL / SAW","Headings",null,"LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["QUARTZ CRYSTAL / SAW",null,"QUA-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings","Headings","Aluminium Electrolytic Capacitor"]
["Al-Cap","Headings","Headings","Any"]
["Al-Cap",null,"ALU-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.\nSee processability on board level.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["Al-Cap","Headings","Headings","DATASHEET"]
["Al-Cap",null,"ALU-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot included: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings","Headings","MATERIAL"]
["Al-Cap",null,"ALU-MA-01","Change of material composition","P","P","Change of housing","e.g. change Al alloy for housing","B: only if a cap holder holds the capacitor body by pressing. Otherwise C evaluation.","B",null,"-","●","●","-","●","-","●","-","-","-","●","-","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-MA-02","Change of material composition","P","P","Change of sealing","e.g. change of rubber compound\ne.g. change of sealing disc material (axial, Snap in) ",null,"C","B: in case of external surface of sealing is changed.\nEvaluation only, if capacitor is glued","-","●","●","-","●","-","●","●","●","●","●","-","●","-","●","S","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-MA-03","Change of material composition","P","P","Change of external insulation / sleeving","e.g. change from PVC into PET\ne.g. change of colour","B: Only for glued capacitors. Otherwise C evaluation","B",null,"-","●","●","●","●","-","●","●","●","●","●","-","●","-","-","S","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Biased  Humidity test can be done without applying voltage."]
["Al-Cap",null,"ALU-MA-04","Change of material composition","P","P","Change of lead or outer termination.","e.g. change of leadframe from iron into copper\ne.g. change of leadframe finish from tin/lead into tin",null,"B",null,"-","●","●","-","-","-","-","-","-","-","-","●","-","-","●","●","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["Al-Cap",null,"ALU-MA-05","Change of material composition","P","P","Change of paper type / internal insulation","Change of paper type / internal insulation",null,"C","A = Only if impedance increase (delta characterization)","-","●","●","-","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●"]
["Al-Cap",null,"ALU-MA-06","Change of material composition","P","P","Change of electrolyte","Change of electrolyte",null,"C","A = Only if impedance increase (delta characterization)","-","●","●","●","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●"]
["Al-Cap",null,"ALU-MA-07","Change of material composition","P","P","Change of closing tape material","Change of material (glue or basis material)",null,"C",null,"-","●","●","-","●","-","-","-","●","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-MA-08","Change of material composition","P","P","Change of base plate material","e.g. change of used plastic material",null,"B",null,null,"●","●","-","●","-","-","-","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-MA-09","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. \nOtherwise see change of material.","C",null,"-","●","●","●","●","-","●","●","-","-","-","●","●","●","●","●","-","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected material."]
["Al-Cap","Headings","Headings","DESIGN"]
["Al-Cap",null,"ALU-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of wire diameter","e.g. change from 0.8 into 0.6 mm wire diameter.",null,"B",null,"-","●","-","-","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of termination appearance","e.g. change from matt tin into bright tin.","For welded Al capacitors only. ","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["Al-Cap",null,"ALU-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of appearance","e.g. change of colour/appearance\ne.g. change of marking shape\ne.g. change of safety vent shape","See also material change/visual inspection.","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of rubber sealing stand-off shape (for radial)","e.g. change of profile / design",null,"A",null,"-","●","-","-","-","-","-","-","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-DE-05","Changes of inner construction","-","P","Change of Al foil width","e.g. change of width",null,"C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●"]
["Al-Cap",null,"ALU-DE-06","Changes of inner construction","-","P","Change of seperator width","e.g. change of width",null,"C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-DE-07","Changes of inner construction","-","P","Change of seperator density","e.g. change of seperator density/resistivity",null,"C",null,"-","●","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●"]
["Al-Cap",null,"ALU-DE-08","Changes of inner construction","-","P","Change of inner connection","e.g. change of shape/dimension",null,"C",null,"-","●","-","-","●","-","-","-","-","-","-","●","-","●","●","●","-","-","-","B","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","Terminal Strength (11) not for axial components without paddle tabs."]
["Al-Cap",null,"ALU-DE-09","Changes of inner construction","-","P","Change of closing tape","e.g. change of dimension",null,"C",null,"-","●","-","●","-","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-",null,"-"]
["Al-Cap",null,"ALU-DE-10","Changes of inner construction","-","P","Change of foil type","e.g. change of etching level\ne.g. change of thickness",null,"C",null,"-","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●"]
["Al-Cap","Headings","Headings","PROCESS"]
["Al-Cap",null,"ALU-PR-01","Changes in process technology or manufacturing methods","-","P","Change of terminal attach process","e.g. change of stitching / welding layout",null,"C",null,"●","●","-","-","●","-","-","-","-","-","-","●","-","●","●","●","-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","Terminal Strength (11) and Vibration (14) not for axial components without paddle tabs."]
["Al-Cap",null,"ALU-PR-02","Changes in process technology or manufacturing methods","-","P","Change of winding process","e.g. change of material disposition",null,"B",null,"●","●","-","-","●","-","-","-","●","-","-","-","-","-","●",null,"-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Al-Cap",null,"ALU-PR-03","Changes in process technology or manufacturing methods","-","P","Change of impregantion","e.g. change of bulk process into individual impregnation",null,"C",null,"●","●","-","●","●","-","-","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","Surge voltage test for high voltage components only."]
["Al-Cap",null,"ALU-PR-04","Changes in process technology or manufacturing methods","-","P","Change of assembly process","e.g. change of sealing method\ne.g. change of assembly process sequence","R: Depends on process change","C",null,"●","●","-","-","●","-","-","-","-","-","●","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-PR-05","Changes in process technology or manufacturing methods","-","P","Change of aging/testing process","e.g. change of timing, voltage or temperature of process","R: Depends on process change","C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Al-Cap",null,"ALU-PR-06","Changes in process technology or manufacturing methods","-","P","Change of trim & form process (leaded)","e.g. change of tooling shape or bending procedure","Solderability may be influenced","B",null,"●","●","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-PR-07","Changes in process technology or manufacturing methods","-","P","Change of trim & form process (SMD)","e.g. change of tooling shape or bending procedure","Solderability may be influenced","B",null,"●","●","-","-","-","-","-","-","-","-","●","-","-","-","●","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-PR-08","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings","Headings","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["Al-Cap",null,"ALU-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings","Headings","PACKING / SHIPPING  -  VISUAL INSPECTION"]
["Al-Cap",null,"ALU-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap",null,"ALU-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["Al-Cap","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["Al-Cap",null,"ALU-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","●","-","-","●","-","-","-","●","-","●","●","-","●","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Al-Cap",null,"ALU-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","●","-","-","●","-","-","-","●","-","●","●","-","●","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["Al-Cap",null,"ALU-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["Al-Cap","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["Al-Cap",null,"ALU-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","●","●","●","●","●","●","●","●","●","●","●","-","●","●","B","●","●","●","-","-","-","●","-","-","-","-","-","-","-","●","●"]
["Al-Cap",null,"ALU-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["Al-Cap",null,"ALU-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["Al-Cap","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["Al-Cap",null,"ALU-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings","Headings","NTC"]
["NTC","Headings","Headings","Any"]
["NTC",null,"NTC-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["NTC","Headings","Headings","DATASHEET"]
["NTC",null,"NTC-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot included: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings","Headings","MATERIAL"]
["NTC",null,"NTC-MA-01","Change of material composition","P","P","Change of Binder Material to bind ceramics.","Binder Material",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-MA-02","Change of material composition","P","P","Change of ceramic composition","Change of ceramic composition",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","●","B","●","S","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Parameter analyse only necessary if an anticipated impact on electrical performance.\nS = SMD device only"]
["NTC",null,"NTC-MA-03","Change of material composition","P","P","Change of inner electrode material (ink material).","Change of electrode composition.","Valid in case of multilayer structures only.","C",null,"-","●","●","●","●","-","-","●","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-MA-04","Change of material composition","P","P","Change of encapsulation material.","E.g. change of coating\ne.g. change of additives in an insulation.","A: Risk assessment on application level, if interaction with other material expected.","B",null,"-","●","●","●","●","-","●","-","-","-","-","-","-","-","-","●","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Parameter analyse only necessary if an anticipated impact on electrical performance."]
["NTC",null,"NTC-MA-05","Change of material composition","P","P","Change of lead or outer termination.","Change of lead (finish) material, termination material or attachment material. ","B: Risk assessment needed to evaluate compatibility of soldering process.","B",null,"-","●","●","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-MA-06","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","●","●","-","●","-","●","-","●","-","-","●","●","-","-","●","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC","Headings","Headings","DESIGN"]
["NTC",null,"NTC-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of lead diameter","e.g. change lead diameter from 0.5 to 0.4 mm",null,"B",null,"-","●","-","-","-","-","●","-","-","●","●","●","-","-","-","-","-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of termination area","e.g. change of termination layer thickness\ne.g. change in termination dimensions","SMD components only!","B",null,"-","●","-","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of inner connection","e.g. change from soldered connection to welded connection",null,"C",null,"-","●","-","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of appearance","e.g. change or adding of colour on component\nAllways in combination with other changes!","Not included changes in marking of the component.","B",null,"-","●","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-DE-05","Changes of inner construction","-","P","Change of electrode layer thickness or geometry.","Change of electrode design","For multi-layer technology only.","C",null,"-","●","-","-","●","●","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-DE-06","Changes of inner construction","-","P","Change of ceramic layer thickness","Change of ceramic layer thickness.","For multi-layer technology only.","C",null,"-","●","-","-","●","●","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-DE-07","Changes of inner construction","-","P","Change of number of ceramic or electrode layers.","Change of built up of layers in the device.","For multi-layer technology only.","C",null,"-","●","-","-","●","●","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings","Headings","PROCESS"]
["NTC",null,"NTC-PR-01","Changes in process technology or manufacturing methods","-","P","Change of lamination / press technique technology","Change from press techniques e.g. stamp press to isostatic press",null,"C",null,"●","●","-","-","-","●","-","●","-","-","-","-","-","-","-","●","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-PR-02","Changes in process technology or manufacturing methods","-","P","Change of firing / sintering profile","Change of firing / sintering profile e.g. temperature and/or timeand/or atmosphere. Change of firing method e.g. from tunnel to batch kiln.",null,"C",null,"●","●","-","-","●","●","-","-","●","-","●","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-PR-03","Changes in process technology or manufacturing methods","-","P","Change of dicing / slicing","Change of separation method e.g. change from cutting to sawing",null,"C",null,"●","●","-","●","●","-","●","●","-","●","●","-","●","●","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-PR-04","Changes in process technology or manufacturing methods","-","P","Change in termination process","Change for termination preparation like plating or apply of termination base layer.",null,"B",null,"●","●","-","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-PR-05","Changes in process technology or manufacturing methods","-","P","Change of electrode apply.","Change of inner electrode lay down method.","For multi layer only.","C",null,"●","●","-","●","-","-","-","●","-","-","-","-","-","-","-","●","●","●","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC",null,"NTC-PR-06","Changes in process technology or manufacturing methods","-","P","Change in assembly process for leaded or encapsulated devices.","Change in assembly process e.g. soldering method for lead attach to element or coating / encapsulation process",null,"B",null,"●","●","-","●","●","-","-","-","-","●","●","-","●","-","●","●","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-PR-07","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings","Headings","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["NTC",null,"NTC-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings","Headings","PACKING / SHIPPING  -  VISUAL INSPECTION"]
["NTC",null,"NTC-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC",null,"NTC-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["NTC","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["NTC",null,"NTC-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["NTC",null,"NTC-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["NTC",null,"NTC-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["NTC","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["NTC",null,"NTC-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site.","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","-","●","-","●","●","●","●","-","●","●","●","●","●","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","●","●"]
["NTC",null,"NTC-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["NTC",null,"NTC-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["NTC","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["NTC",null,"NTC-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of test coverage."]
["PTC","Headings","Headings","PTC"]
["PTC","Headings","Headings","Any"]
["PTC",null,"PTC-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.\nSee processability on board level.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["PTC","Headings","Headings","DATASHEET"]
["PTC",null,"PTC-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot included: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings","Headings","MATERIAL"]
["PTC",null,"PTC-MA-01","Change of material composition","P","P","Change of Binder Material to bind ceramics.","Binder Material",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-MA-02","Change of material composition","P","P","Change of ceramic composition","Change of ceramic composition",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","●","B","●","S","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Parameter analyse only necessary if an anticipated impact on electrical performance.\nS = SMD device only"]
["PTC",null,"PTC-MA-03","Change of material composition","P","P","Change of polymer composition","Change of polymer composition",null,"C",null,"-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-MA-04","Change of material composition","P","P","Change of encapsulation material.","E.g. change of coating\ne.g. change of additives in an insulation.","A: Risk assessment on application level, if interaction with other material expected.","B",null,"-","●","●","●","●","-","●","-","-","-","-","-","-","-","-","●","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Parameter analyse only necessary if an anticipated impact on electrical performance."]
["PTC",null,"PTC-MA-05","Change of material composition","P","P","Change of lead or outer termination.","Change of lead (finish) material, termination material or attachment material. ","B: Risk assessment needed to evaluate compatibility of soldering process.","B",null,"-","●","●","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-MA-06","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","●","●","-","●","-","●","-","●","-","-","●","●","-","-","●","●","-","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC","Headings","Headings","DESIGN"]
["PTC",null,"PTC-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of lead diameter","e.g. change lead diameter from 0.5 to 0.4 mm",null,"B",null,"-","●","-","-","-","-","●","-","-","●","●","●","-","-","-","-","-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of termination area","e.g. change of termination layer thickness\ne.g. change in termination dimensions","SMD components only!","B",null,"-","●","-","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of inner connection","e.g. change from soldered connection to welded connection",null,"C",null,"-","●","-","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of appearance","e.g. change or adding of colour on component\nAllways in combination with other changes!","Not included changes in marking of the component.","B",null,"-","●","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-DE-05","Changes of inner construction","-","P","Change of electrode layer thickness or geometry.","Change of electrode design",null,"C",null,"-","●","-","-","●","●","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-DE-06","Changes of inner construction","-","P","Change of ceramic layer thickness","Change of ceramic layer thickness.","For multi-layer technology only.","C",null,"-","●","-","-","●","●","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-DE-07","Changes of inner construction","-","P","Change of number of ceramic or electrode layers.","Change of built up of layers in the device.","For multi-layer technology only.","C",null,"-","●","-","-","●","●","-","-","-","-","●","-","-","-","-","●","●","-","-","-","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings","Headings","PROCESS"]
["PTC",null,"PTC-PR-01","Changes in process technology or manufacturing methods","-","P","Change of lamination / press technique technology","Change from press techniques e.g. stamp press to isostatic press",null,"C",null,"●","●","-","-","-","●","-","●","-","-","-","-","-","-","-","●","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-PR-02","Changes in process technology or manufacturing methods","-","P","Change of firing / sintering profile","Change of firing / sintering profile e.g. temperature and/or timeand/or atmosphere. Change of firing method e.g. from tunnel to batch kiln.",null,"C",null,"●","●","-","-","●","●","-","-","●","-","●","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-PR-03","Changes in process technology or manufacturing methods","-","P","Change of dicing / slicing","Change of separation method e.g. change from cutting to sawing",null,"C",null,"●","●","-","●","●","-","●","●","-","●","●","-","●","●","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-PR-04","Changes in process technology or manufacturing methods","-","P","Change in termination process","Change for termination preparation like plating or apply of termination base layer.",null,"B",null,"●","●","-","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-PR-05","Changes in process technology or manufacturing methods","-","P","Change of electrode apply.","Change of inner electrode lay down method.","For multi layer only.","C",null,"●","●","-","●","-","-","-","●","-","-","-","-","-","-","-","●","●","●","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC",null,"PTC-PR-06","Changes in process technology or manufacturing methods","-","P","Change in assembly process for leaded or encapsulated devices.","Change in assembly process e.g. soldering method for lead attach to element or coating / encapsulation process",null,"B",null,"●","●","-","●","●","-","-","-","-","●","●","-","●","-","●","●","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-PR-07","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings","Headings","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["PTC",null,"PTC-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings","Headings","PACKING / SHIPPING  -  VISUAL INSPECTION"]
["PTC",null,"PTC-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC",null,"PTC-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["PTC","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["PTC",null,"PTC-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["PTC",null,"PTC-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["PTC",null,"PTC-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["PTC","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["PTC",null,"PTC-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","-","●","-","●","●","●","●","-","●","●","●","●","●","●","B","●","●","●","-","-","-","-","-","-","-","-","-","-","-","●","●"]
["PTC",null,"PTC-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["PTC",null,"PTC-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["PTC","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["PTC",null,"PTC-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of test coverage."]
["VDR","Headings","Headings","VDR"]
["VDR","Headings","Headings","Any"]
["VDR",null,"VDR-AN-01","Any change with impact on special customer characteristics/contractual agreements","P","P",null,"Not relevant for technical evaluation. ",null,"**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-AN-02","Any change with impact on technical interface or \nprocessability/manufacturabiliy of customer","P","P",null,"Technical interface means component terminals.\nSee processability on board level.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","-"]
["VDR","Headings","Headings","DATASHEET"]
["VDR",null,"VDR-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or AC/DC specification","P","P","Update / change  of datesheet","Change of application relevant information \nNot included: Editorial changes.","Risk assessment depending on change for each application.","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-DS-02","Correction of data sheet","I","P","Correction of data sheet","only correction in description (wording, drawing, Spec values, …) due of new information about component behavior.\nNo technical change of the product\nI: Editorial corrections only.","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-DS-03","Specification of additional parameters","I","P","Description of a new not previously covered parameter. \nNo technical change of the product.","e.g. adding new (tested) parameter.","I - no influence\nP - Risk assessment depending on change for each application\nTo provide evidence of additional\n parametes (stat. evaluation)","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings","Headings","MATERIAL"]
["VDR",null,"VDR-MA-01","Change of material composition","P","P","Change of Binder Material to bind ceramics.","Binder Material",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-MA-02","Change of material composition","P","P","Change of ceramic composition","Change of ceramic composition",null,"C",null,"-","●","●","-","-","-","-","-","-","-","-","-","-","●","-","●","●","-","●","B","●","S","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-MA-03","Change of material composition","P","P","Change of inner electrode material.","Valid in case of multilayer structures only.",null,"C",null,"-","●","●","●","●","-","-","●","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-MA-04","Change of material composition","P","P","Change of encapsulation material.","E.g. change of coating\ne.g. change of additives in an insulation.","A: Risk assessment on application level, if interaction with other material expected.","B",null,"-","●","●","●","●","-","●","-","-","-","-","-","-","-","-","●","●","-","-","B","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-MA-05","Change of material composition","P","P","Change of lead or outer termination.","Change of lead (finish) material, termination material or attachment material. ","B: Risk assessment needed to evaluate compatibility of soldering process.","B",null,"-","●","●","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-MA-06","Change of supplier of material","-","P","Change of material supplier.","Change to a new or additional material supplier at component manufacturer.\ne.g. for 2nd source purpose","Assumption material specification remains unchanged. Otherwise see change of material.","C",null,"-","●","●","●","●","-","●","-","●","-","-","●","-","-","●","●","-","●","●","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR","Headings","Headings","DESIGN"]
["VDR",null,"VDR-DE-01","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of lead diameter","e.g. change lead diameter from 0.8 to 0.6 mm",null,"B",null,"-","●","-","-","-","-","●","-","-","●","●","●","-","-","-","-","-","-","-","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-DE-02","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of termination area","e.g. change of termination layer thickness\ne.g. change in termination dimensions","SMD components only!","B",null,"-","●","-","-","-","-","●","-","-","●","●","-","-","-","-","-","-","-","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-DE-03","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of inner connection","e.g. change from soldered connection to welded connection",null,"C",null,"-","●","-","-","-","-","●","●","●","-","-","●","-","●","-","-","-","●","●","B","-","●","●","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-DE-04","Changes of termination, surface finish, shape, color, appearance or dimension structure","I","P","Change of appearance","e.g. change or adding of colour on component\nAllways in combination with other changes!","Not included changes in marking of the component.","B",null,"-","●","-","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-DE-05","Changes of inner construction","-","P","Change of electrode layer thickness or geometry.","Change of electrode design","For multi-layer technology only.","C",null,"-","●","-","-","●","●","●","-","●","-","●","-","-","-","-","●","●","-","-","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR",null,"VDR-DE-06","Changes of inner construction","-","P","Change of ceramic layer thickness","Change of ceramic layer thickness.","For multi-layer technology only.","C",null,"-","●","-","-","●","●","●","-","●","-","●","-","-","-","-","●","●","-","-","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR",null,"VDR-DE-07","Changes of inner construction","-","P","Change of number of ceramic or electrode layers.","Change of built up of layers in the device.","For multi-layer technology only.","C",null,"-","●","-","-","●","●","●","-","●","-","●","-","-","-","●","●","●","-","-","-","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","-"]
["VDR",null,"VDR-DE-08","Changes of inner construction","-","P","Change of grain size","Change of grain size.","Grain size is a result of process and/or material change.","C",null,"-","●","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR",null,"VDR-DE-09","Changes of inner construction","-","P","Change of grain boundary size","Change of grain boundary size.","Grain boundary size is a result of process and/or material change.","C",null,"-","●","-","-","-","-","●","-","●","-","-","-","-","-","-","-","-","●","-","B","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR","Headings","Headings","PROCESS"]
["VDR",null,"VDR-PR-01","Changes in process technology or manufacturing methods","-","P","Change of lamination / press technique method","Change of lamination / press technique e.g. pressures or temperature",null,"C",null,"●","●","-","-","-","●","-","●","-","-","-","-","-","-","-","●","●","-","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-PR-02","Changes in process technology or manufacturing methods","-","P","Change of firing / sintering profile","Change of firing / sintering profile e.g. temperature and/or timeand/or atmosphere. Change of firing method e.g. from tunnel to batch kiln.",null,"C",null,"●","●","-","●","●","●","●","-","●","-","●","-","-","-","-","-","●","●","-","B","-","-","-","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR",null,"VDR-PR-03","Changes in process technology or manufacturing methods","-","P","Change of dicing ","Change of separation method e.g. change from cutting to sawing",null,"C",null,"●","●","-","●","●","-","●","●","-","●","●","-","●","●","-","-","●","-","-","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR",null,"VDR-PR-04","Changes in process technology or manufacturing methods","-","P","Change in termination process","Change for termination preparation like plating or apply of termination base layer.",null,"B",null,"●","●","-","●","●","-","-","-","●","-","●","●","-","-","●","●","●","-","-","B","-","●","●","-","-","-","-","-","●","-","-","-","-","-","-","●"]
["VDR",null,"VDR-PR-05","Changes in process technology or manufacturing methods","-","P","Change of electrode apply.","Change of inner electrode lay down method.","For multi layer only.","C",null,"●","●","-","●","-","-","-","●","-","-","-","-","-","-","-","●","●","●","-","B","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR",null,"VDR-PR-06","Changes in process technology or manufacturing methods","-","P","Change in assembly process for leaded or encapsulated devices.","Change in assembly process e.g. soldering method for lead attach to element or coating / encapsulation process",null,"B",null,"●","●","-","●","●","-","-","-","-","●","●","-","●","-","●","●","-","-","●","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-PR-07","Process integrity: tuning within specification","-","P","Change within process specification","Variation within process specification.","Depends on process tuning","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings","Headings","PACKING / SHIPPING  -  NEW MATERIAL, CRITICAL DIMENSIONS"]
["VDR",null,"VDR-PN-01","Packing / shipping specification change (loosening of tolerances)","P","P","Change of packing specification.","Change in packing specification\ne.g. number of pieces on reel.\ne.g. change of dimensions or material","Will be approved by logistic and / or purchase.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-PN-02","Dry pack requirements change","P","P","Change of MSL\nChange of dry pack method.","e.g. change of MSL\ne.g. change in dry pack assurance (HIC, MBB)","Only for moisture sensitiv devices.\nInfluence for production process at tier 1  to  be evaluated (e.g. solderability, popcorn)","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-PN-03","Change of carrier (tray, reel)","P","P","Change of carrier","Change of carrier e.g. by material or geometry.",null,"B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings","Headings","PACKING / SHIPPING  -  VISUAL INSPECTION"]
["VDR",null,"VDR-PV-01","Change of labelling","I","P","Change of labelling, also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-PV-02","Change of product marking","I","P","Change of marking on component","e.g. change of content of marking\ne.g. change of method of marking\ne.g. change of appearance of marking","AOI check necessary!","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR",null,"VDR-PV-03","Change of packing/shipping specification","P","P","Change of documentation in packing specification","Change in packing specification which does not described a change of dimensions or material of the packing.","Will be approved by logistic and / or purchase.","**",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
["VDR","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  EQUIPEMEMENT"]
["VDR",null,"VDR-EQ-01","Production from a new equipment/tool which uses a different technology or which due to its unique form or function can be expected to influence the integrity of the final product","P","P","Change to a new equipment/tool with new technology.","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.",null,"C",null,"●","●","-","-","●","-","●","-","●","-","-","●","-","-","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["VDR",null,"VDR-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool)","-","P","Change to a new equipment/tool with same technology.","PCN required for dedicated equipment for sensitive component production.",null,"C",null,"●","●","-","-","●","-","●","-","●","-","-","●","-","-","●","-","-","●","-","B","-","-","-","-","-","-","●","-","-","-","-","-","-","-","-","●","Test effort depends on final risk assessment.\nPerformance test according to affected process change."]
["VDR",null,"VDR-EQ-03","Change in final test equipment type that uses a different technology","P","P","Change of final test equipment which use different technology.","e.g. change of tester platform\nPCN required for dedicated equipment for sensitive parameters.","Gage R&R / delta correlation","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","B","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
["VDR","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  PROCESS FLOW"]
["VDR",null,"VDR-PF-01","Manufacturing site transfer or movement of a part of production process to a different location/site","P","P","Change of manufacturing site","Movement or transfer of manufacturing site or process step(s) to a different location/site.","Note: Reorganization inside one plant/site is not affected!","B",null,"●","●","-","●","●","-","●","●","●","●","●","●","-","●","●","●","●","●","●","B","-","●","●","●","-","-","-","-","-","-","-","-","-","-","●","●"]
["VDR",null,"VDR-PF-02","Elimination or addition of a manufacturing process step","-","P","Change of manufacturing process sequence.","Change of a manufacturing process\ne.g. washing / cleaning process\ne.g. change of order of processes","To provide details regarding effects of change","C",null,"●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of production flow."]
["VDR",null,"VDR-PF-03","Elimination of final electrical measurement / test flow block","I","P","Reduction of final testing.","PCN required for dedicated final test reductions for sensitive parameters.","To provide details, that eleminated test is not necessary","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Characterisation depends on impact of final test flow."]
["VDR","Headings","Headings","LOGISTICS / CAPACITY / TESTING  -  Q-GATE"]
["VDR",null,"VDR-QG-01","Change of test coverage used by the supplier to ensure data sheet compliance (e.g., elimination/addition of electrical measurement/test flow block, relaxation/enhancement of monitoring procedure or sampling)","-","P","Change of test coverage.","e.g. change from 100% to sample inspection\ne. g. test flow block, reduction from three to two temperature measurements\ne.g. change in burn in/run in process.","R (electr. funct.): test coverage.\nR (reliability) only for change in burn in process.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[]
[null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) "]
[]
[null,null,"Reason for exception of tests:"]
[]
[]
[]
[]
[]
[null,null,"--","Not required",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," "]
[null,null,"I","Information Note required"]
[null,null,"P","PCN required",null,null,null," "]
[null,null,null," "]
[]
[]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the appropriate process change."]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Termination equipment only",null,null,null,null,null,null,null,null," "]
[null,null,"C","Ceramics only"]
[null,null,"B","Comparative data (unchanged vs. changed) required"]
[null,null,"E","Capacitive trimmers only"]
[null,null,"F","Film products only"]
[null,null,"N","Networks only"]
[null,null,"R","Resistors only"]
[null,null,"S","SMD components only"]
[null,null,"W","Wirewound products only"]
[null,null,"Y","Component not hermitically sealed"]
[null,null,"Note 1:","For parts marked with ink only. Laser and stamp marked parts shall be exempt."]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]

{"sheet":"LED Component","index":5,"n_rows":223,"n_cols":49,"rows_kept":223,"cut":false,"hidden":false,"merged":[[1,0,1,2],[2,0,2,2],[3,0,3,2],[4,0,4,2],[5,16,6,16],[6,9,7,9],[5,13,8,13],[5,14,6,14],[5,15,6,15],[7,14,8,14],[3,6,3,7],[3,11,8,11],[3,12,3,34],[4,14,4,34],[5,20,6,20],[5,17,6,17],[5,18,6,18],[5,12,8,12],[7,22,8,22],[7,21,8,21],[5,21,6,21],[5,22,6,22],[7,18,8,18],[7,19,8,19],[7,20,8,20],[5,19,6,19],[5,33,6,33],[5,23,6,23],[5,24,6,24],[5,25,6,25],[7,24,8,24],[7,25,8,25],[7,26,8,26],[7,27,8,27],[7,28,8,28],[5,31,6,31],[5,32,6,32],[7,23,8,23],[5,26,6,26],[5,27,6,27],[5,28,6,28],[7,29,8,29],[7,35,8,35],[7,34,8,34],[7,30,8,30],[7,31,8,31],[7,32,8,32],[7,33,8,33],[88,2,89,5],[72,2,72,3],[74,2,74,7],[78,2,81,7],[5,38,8,38],[7,36,8,36],[5,36,6,36],[5,37,8,37],[6,4,6,5],[7,15,8,15],[7,16,8,16],[7,17,8,17],[5,35,6,35],[5,34,6,34],[5,29,6,29],[5,30,6,30]]}
[]
["Worked on:\n (Name, Function)",null,null,"Max Mustermann"]
["Date:",null,null,null,null,null,"Basis: IEC 60810"]
["PCN number:",null,null,null,null,null,{"$f":"Guidance!A8","v":"Form provided by ZVEI  ‒  Revision 2.2.4  ̶  06/2015"},null,null,null,null,"Line evaluation\n(can be evaluated by data or audit/on site check)","Device evaluation"]
["Signature:",null,null,null,null,null,null,null,null,null,null,null,null,null,"MATERIAL PERFORMANCE TEST RESULTS (on the basis of IEC 60810)"]
[null,null,null,null,null,null,null,null,null,null,null,null,"IEC 60810","Check of specification \n(for raw material only)","High Temperature Operating Life (HTOL)","Temperature Cycling","Wet High temperatur Operating Life","Power Temperature Cycling","ESD Characterization- Human Body Model","ESD Characterization- Machine Model","Physical Dimensions","Vibration Variable Frequency","Mechanical Shock","Resist. to Solder Heat","Solderability","Thermal Shock","Hydrogen Sulphide","Pulse Life Test","Dew Test","Flow Mixed Gas Corosion","Thermal Resistance","Wire Bond Strength","Wire Bond Shear","Die Shear","Notes / Remarks","Whisker test\n(IEC 60068-T2-82, JEDEC JESD201)","Parameter-Analysis: \nComparison of current with changed device\ncharacterization, electrical distribution","Remarks","Communication flow\nZ = acceptance\nO = without Information"]
[null,null,null,"Assessment of impact on Supply Chain regarding following aspects\n  - contractual agreements\n  - technical interface of processability/manufacturability of customer\n  - form, fit, function, quality performance, reliability","Remaining\nrisks on\nSupply\nChain?",null,"Understanding of semiconductors experts ","Examples to explain","Remarks / Comments","  A: Application level\n  B: Boardlevel\n  C: Component level\n   *: will become A/B/C after decision\n  ** : Not relevant for qualification matrix","Further applicable conditions"]
[null,null,null,"Type of change","No","Yes",null,null,null,null,null,null,null,null,"HROL","TC","WHTOL","PTC","ESD-HBM","ESD-MM","PD","VVF","MS","RSH","SD","TMSK","H2S","PLT","DEW","GMGC","TR","WBS","BS","DS"]
[null,"Headings",null,"ANY"]
[null,null,"LED-AN-01","Any change with impact on agreed upon contractual agreements","P","P","Not relevant for technical evaluation. ",null,null,"**",null,"-","-","-","-","-","-","-","-",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"LED-AN-02","Any change with impact on processability/manufacturabiliy of customer which is not covered below","P","P","See processability on board level\ntechnical interface means component terminals",null,"A or B: Depends on change.\ne.g. A: Introduction of 5V or 50V zener diode\ne.g. B: change of MSL level","*",null,"-","-","-","-","T","-","-","-","-","-","-","-","S,T","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"DATA SHEET"]
[null,null,"LED-DS-01","Change of datasheet parameters/electrical specification (min./max./typ. values) and/or Pulse/DC specification ","P","P","Change of application relevant information (e.g. MSL, maximum pulse current)\nNot included: Editorial changes."," ","1) Not included: Editorial changes","A",null,"-","-","-","E","E","E","-","E","E","-","-","-","S","-","-","-","E","-","-","E","-","-","-","-","-","E"]
[null,null,"LED-DS-02","Correction of data sheet ","I","P","Data sheet (editorial changes)\nhas to check if application affected","e.g. change of ESD level","I - no influence\nP - Risk assessment depending on change for each application","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"LED-DS-03","Specification of additional parameters","I","P","Specification of additional parameters","e.g. definition of rise time","B applicable if only processability on board level is affected","A",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●","Formalism since this is not a product change, ony addtional information\nClassification: C"]
[null,"Headings",null,"DESIGN"]
[null,null,"LED-DE-01","Design changes in active area.","P","P","Any device relevant changes in design / layout of epitaxial layers\nNot included: design optimization","e.g. change from double-hetero to quanten wells","A or C: Depends on change.\ne.g. A: change from Double hetero to Quanten wells --> spectrum is affectd\ne.g. C: thickness of Quanten wells","*",null,"-","●","-","●","-","●","●","●","●","-","-","-","-","-","-","-","●","H","-","-","-","-","-","-","-","●"]
[null,null,"LED-DE-02","Design changes in routing/layout for chip.","P","P","Any change in chip design / layout.\nNot included: design optimization","e. g. change in layout of current spreader; thickness of current spreader\n","A or C depends on change\ne.g. A: change in layout of current spreader --> radiation pattern changes\ne.g. C: reduction of bond pad size","*",null,"-","●","-","●","●","●","●","-","-","-","-","-","●","-","B,D,M","M","●","M","M","-","B","B","D,M","-","-","●","TR might be considered for complex die bond technologies"]
[null,null,"LED-DE-03","Die shrink ","P","P","Shrink of active area.\nNot included: sawing street/kerf/scribe line","Typical shrink of die.","Not included: sawing street/kerf/scribe line","A",null,"-","●","-","●","●","●","●","●","●","-","-","-","●","-","-","-","●","-","-","●","B","B","●","-","-","●"]
[null,null,"LED-DE-04","LED package","P","P","any change in form or dimensions","e.g. change of dimensions; change in leadframe/carrier dimensions","A, B, C: Depends on change.\ne.g. A:change of x, y, or z dimension of the package\ne.g. B: change of the contact area dimensions\ne.g. C: change inner design of the leadfeame not affecting the e/o performance & reliability of the device","*",null,"-","●","-","●","●","●","●","L","L","●","V,L","V,L","●","T","L","D","L","D","D","L","B","B","D","-","-","●"]
[null,"Headings",null,"PROCESS - WAFER PRODUCTION"]
[null,null,"LED-PW-01","New / change of wafer substrate or carrier material","P","P","New wafer substrate material.","e.g. different wafer material to currently released material (change from Sapphire to Silicon)","Applicable if data sheet parameters are  not affected and in case delta characterization does not show a risk;otherwise data sheet needs to be updated in addition","C",null,"-","●","●","●","P","P","●","P","P","-","-","-","●","-","P","P","●","P","P","●","-","-","●","-","-","●"]
[null,null,"LED-PW-02","Wafer diameter","P","P","change of wafer diameter resulting in equipment and process changes","e.g. 4\" to 6\"","In case other type of changes are affected i.e equipment/process technology - they need to be identified in addition","C",null,"●","●","●","●","-","●","-","P","P","-","-","-","●","-","-","-","●","-","-","●","-","-","-","-",null,"●"]
[null,null,"LED-PW-03","New final wafer thickness","P","P","Change in final wafer thickness","e.g. change in final chip/die thickness ","Applicable if data sheet paramers and distributions are  not affected and in case delta characterization does not show a risk;otherwise data sheet needs to be updated in addition","C",null,"-","●","-","●","●","P","●","P","P","-","-","-","-","-","-","-","●","-","-","●","B","B","●","-","-","●"]
[null,null,"LED-PW-04","Change of electrically active doping/implantation element","P","P","Change in electrically active doping / implantation element resulting in a new technology.","e.g. change from Be to C as dopant",null,"C",null,"-","●","C","●","-","C","C","●","●","-","-","-","-","-","-","-","●","-","-","●","-","-","-","-","-","●"]
[null,null,"LED-PW-05","Change of stacking","P","P","change in layer sequence or thickness","e.g. change of isolation layer thickness between n- and p-material ","customer application needs to be checked due to potential sytem voltage differences","A",null,"-","-","-","●","F","●","●","●","●","-","-","-","-","-","-","-","●","F","-","-","-","-","-","-","-","●"]
[null,null,"LED-PW-06","Change in die coating or passivaton","P","P","Change in material, thickness, and process for coating and passivation","e.g. change from SiO2 to SiN3",null,"C",null,"-","●","P","●","●","●","P","P","P","-","-","-","-","-","-","P","-","P","P","-","P","P","-","-","-","●"]
[null,null,"LED-PW-07","New / change of metallization (specifically chip frontside)","P","P","Change in metallization of bondpads, material, layer thickness","e.g. change in bond pad metallization thickness","R (package): If impact on bond pad.; verify customer assembly parameter","C",null,"-","●","M","●","●","●","●","M,B","M,B","-","-","-","-","-","B","M","●","M","M","-","●","●","-","-","-","●"]
[null,null,"LED-PW-08","New / change of metallization (specifically chip backside)","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions necessary.","e.g. change from Au to Au/Ge","Application needs to be checked due to potential sytem voltage differences","C",null,"-","●","M","●","●","●","●","D,M","D,M","-","-","-","●","-","D,M","D,M","●","D,M","D,M","D,M","-","-","●","-","-","●"]
[null,null,"LED-PW-09","Change in process technique (e. g. significant process changes like lithography, etch, oxide deposition, die back surface preparation/backgrind, ...)","--","P","Change from wet to dry etching, change from horizontal to vertical oven for oxidation, change from contact litho into stepper litho, …","e.g. change from wet etch to dry etch","B or C: Depends on change and potential impact at final product.\nIn case of new equipment see also \"Production from a new equipment/tool…\"\ne.g. B: change from CVD dep to sputter dep for backside/frontside metallization\ne.g. C: change from contact litho to stepper litho","*",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-PW-10","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control",null,"C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","_"]
[null,null,"LED-PW-11","Change of material supplier without impact on agreed specifications","--","P","Change of wafer supplier. Change of supplier for chemicals needed for wafer production.","e.g. change of wafer supplier.","Interaction on component level expected.","C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-PW-12","Change of specified wafer process sequence (deletion and/or additional process step)","--","P","Any change which is not covered by another type of change. Risk is to be assessed.","e.g. additional cleaning process in wafer production","PPAP has to be updated","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-PW-13","New wafer production location or tranfer of wafer production to a different location/site/subcontractor ","P","P","New wafer propduction location or transfer of wafer production with possible additional changes.",null,null,"C",null,"●","●","-","●","●","●","-","●","●","-","-","-","●","-","-","-","●","-","-","J","●","●","●","-","-","●"]
[null,"Headings",null,"BARE DIE DELIVERIES"]
[null,null,"LED-BD-01","New / change of front side metallization","P","P","Change in bondpads, material, pad pitch, surface changes, layer thickness","e.g. change from Au to Au alloy\ne. g. change in over pad metalization","R(reliability): Verify Bond parameter","B",null,"-","-","M","●","●","●","●","M,B","M,B","-","-","-","-","-","●","●","●","●","●","●","●","●","-","-","-","-"]
[null,null,"LED-BD-02","New / change of backside metallization","P","P","Change of bottom layer of die (between die and leadframe/carrier). Change in process, material, or dimensions.","e.g. change from Au to Au alloy","Customer application needs to be checked due to potential sytem voltage differences","B",null,"-","-","M","●","●","●","●","D,M","D,M","-","-","-","●","-","●","●","●","●","●","●","-","-","●","-","-","-"]
[null,null,"LED-BD-03","Change of wafer setup or number of dies on wafer.","I","P","Needed information for pick & place machine.","e.g. information change for pick & place machine.","C in case no further evaluation for  processability necessary\nR (processability): Can the machine handle the dies/frames.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"PROCESS - ASSEMBLY"]
[null,null,"LED-PA-01","Change of leadframe/carrier base material","P","P","New leadframe/carrier material (new in composition)","e.g. change from copper alloy to bare copper","processability in customer assembly line","B",null,"-","●","●","P","●","●","-","-","-","-","-","-","●","●","-","A","-","A","A","P,1","●","●","●","-","P","-","Explanation should be provided in case H2S test is not applicable"]
[null,null,"LED-PA-02","Change of leadframe/carrier finishing material (internal)","P","P","Change of surface material of die attach pad and second bond area (e.g. influence in adhesion to mold compound, wedge bond reliability)","e.g. change from Ag flash to NiPd protection layer\ne.g. change from Ag spot to Au spot",null,"C",null,"-","●","●","P","●","●","●","-","-","-","-","-","●","●","-","A","-","A","A","P,1","●","●","●","-","-","-","H2S test should be considered for automotive exterrior applications.\nexplanation should be provided in case H2S test is not applicable"]
[null,null,"LED-PA-03","Change of lead and heat slug plating material/plating thickness (external)","P","P","Change in material and process technique for final pin termination (e.g. pure tin).","e.g. change in heat slug stack\ne.g. change from Sn into Ni/Pd/Au\ne.g. change of layer thickness ","Package, processability and reliability on board level can be verified by generic data. Classification depends on impact of change","B",null,"-","-","M","P","●","K","-","-","-",1,"-","-","●","●","-","A","-","A","A","P,1","-","-","-","-","K","-","Explanation should be provided in case H2S test is not applicable"]
[null,null,"LED-PA-04","Bump Material / Metall System (internal)","P","P","Stack die or die to substrate","e.g. change to Pb-free material",null,"C",null,"-","-","●","●","●","●","●","-","-","-","-","-","●","-","●","W","-","W","W","●","-","-","●","-","-","-"]
[null,null,"LED-PA-05","Die attach material","P","P","Change of die attach material (e.g. soft solder, epoxy, etc)","e.g. change of Ag glue to Au glue; ","thermal management","B",null,"-","●","●","●","●","●","●","-","-","-","N","N","●","-","N","Q","-","N","Q","●","-","-","●","-","-","-"]
[null,null,"LED-PA-06","Change of bond wire material / diameter","P","P","Material, wire diameter, change in process technique","e.g. change from Au to Al material",null,"C",null,"-","●","●","●","●","P,D","●","-","-","-","D","D","●","-","D","P,D","●","-","P,D","-","●","●","-","-","-","-","Site audit for material change with impact on bondprocess (e.g. from Au to Cu) recommended."]
[null,null,"LED-PA-07","Change in material for sub-components (excluding LED chip & LED package related items) with impact on agreed specifications","P","P","Change of sub-component supplier using different technology/materials","e.g. using a different ESD-diode in technology and material than previously","please refer also to change of specification","*",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-PA-08","Die Overcoat / Underfill","--","P","Supporting layers for complex packages like flip chip.",null,null,"B",null,"-","●","P","●","●","P","●","-","-","-","-","P","●","-","P","P","●","-","P","U","-","-","U","-","-","-"]
[null,null,"LED-PA-09","Change of mold compound/encapsulation/sealing material","P","P","Change of mold compound/encapsulation/sealing material","e.g. PPA mold compound","Optical function might be affected in case of package related effect (e.g. browning). Component assembly and board coating has to be assessed. MSL might be changed.","B",null,"-","●","●","●","-","●","●","-","-","D","D","D","●","T","P","P","P","P","P","P","-","-","-","-","-","-"]
[null,null,"LED-PA-10","Change of conversion material","P","P","change of material class","e.g. change from granats to nitrides","any  change in ageing behaviour should be connected to the data sheet area","C",null,"-","●","●","●","Y","●","●","-","-","-","Y","Y","●","-","Y","P","P","P","P","Y","-","-","-","-","-","●"]
[null,null,"LED-PA-11","Change of converter process technology","I","P","new technology for converter production","e.g. change from volume conversion to layer conversion; change from punching to printing of layer","any change in  electro-optical characteristics results in change of data sheet","C",null,"-","●","-","●","Y","●","●","-","-","-","Y","Y","●","-","Y","Z","Z","Z","Z","Y","-","-","-","-","-","●"]
[null,null,"LED-PA-12","Change of product marking","I","P","Marking on device.","e.g. marking of cathode","C in case no further evaluation for  processability necessary","B",null,"-","-","-","-","O","-","-","-","-","-","-","-","T","T","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"LED-PA-13","Change in process technique (e.g., die attach, bonding, moulding, plating, trim and form, …)","P","P","Any change in assembly process technique","e.g. change die attached from gluing to soldering; ","C in case no influence on processability and product performance","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-PA-14","Process Integrity: Tuning within specification","--","P","Variation within process specification","e.g. process control",null,"C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"LED-PA-15","Change of direct supplier for converter material","--","P","new supplier with same material specification",null,null,"C",null,"-","-","●","●","P","●","●","-","-","-","P","P","●","-","P","P","P","P","P","P","-","-","-","-","-","●"]
[null,null,"LED-PA-16","Change of direct material supplier without impact on specification","--","P","Change of suppliers e.g. for lead frames, wire material, die attach, electronical components …","Change of suppliers e.g. for lead frames, wire material, ESD-diode …","Assumption that change material specification remains unchanged. Otherwise see change of material.","C",null,"-","-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","See change of material."]
[null,null,"LED-PA-17","Change of specified assembly process sequence (additional or deletion of process step)","I","P","Additional or deletion process step in assembly process sequence","e.g. additional or deletion plasma cleaning process","Single case assessment necessary to identify possible interactions or risk.","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-PA-18","New assembly location or transfer of assembly to a different location/site/subcontractor ","P","P","New assembly location, assembly transfer or relocation","e.g. Dual source strategy","Transfer of known technology and equipment.","C",null,"●","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,"Headings",null,"PACKING/SHIPPING"]
[null,null,"LED-PS-01","Inner Packing/shipping specification change","P","P","dimension change of direct product packing","e.g. SMT pocket in tape changes",null,"B",null,"-","-","P","-","-","-","-","P","P","-","-","-","-","T","-","-","-","-","-","-","-","-","-",null,"-","-"]
[null,null,"LED-PS-02","Outer Packing/shipping specification change","I","P","dimension changes indirect product packing","e.g. pizza box",null,"C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,null,"LED-PS-03","Change of labelling","I","P","Change of labelling also on reel.","(I) e.g. additional information (RoHS stamp)\n(P) e.g. change of customer specific information","Update in customer specification/documentation necessary. Processabillity check in production flow.","B",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[null,"Headings",null,"EQUIPMENT"]
[null,null,"LED-EQ-01","Production from a new equipment/tool which uses a different basic technology ","P","P","Change in process technique which is not already covered above.\nNote: Major changes affecting the product not covered by the table require also a PCN.","Change from single wafer to batch process (e.g. over pad metalisation)\ne.g. dambar cutting (mechanical to laser cutting)","C in case no influence on processability and product reliability","B",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-EQ-02","Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process.","--","P","PCN required for dedicated equipment for sensitive component production.","e.g. change from single site to multi site handler.",null,"C",null,"-","●","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","Qualification effort depends on type of change."]
[null,null,"LED-EQ-03","Change in final test equipment type that uses a different technology","I","P","Change of tester platform (e.g. major test program changes , new tester interface, …).","e.g. change in test method from cd to lumen","C in case the technology is already used for other products (generic data)\nGage R&R / delta correlation ","B",null,"-","●","-","-","-","-","-","●","●","-","-","-","-","T","-","-","-","-","-","-","-","-","-","-","-","●","Gage R&R / delta correlation"]
[null,"Headings",null,"TEST FLOW"]
[null,null,"LED-TF-01","Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor","P","P","Tester transfer or relocation. ","e.g. Dual source strategy","Gage R&R / delta correlation","C",null,"●","-","-","B","●","●","B","●","●","-","-","-","●","T","B","-","B","-","-","-","B","B","B","-","-","●","Gage R&R / delta correlation; addtional specification check\nB should be considered for Wafer testing"]
[null,"Headings",null,"Q-GATE"]
[null,null,"LED-QG-01","Change of the test coverage/testing process flow used by the supplier to ensure data sheet compliance (e.g. elimination/addition of electrical measurement/test flow block; relaxation/enhancement of monitoring procedure or sampling)","--","P","E. g. test flow block like Final test / final clearance","e.g. test flow block like Final test / final clearance","C or B has to be evaluated\nR (electr. funct.): test coverage \nR (reliability) only for change in burn in process ","C",null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","●"]
[]
[]
[]
[null,null,"Tests, which should be considered for the appropriate process change.",null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Tests, which should be considered for the appropriate process change after selection of condition table.",null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,"Suppliers performed tests (mark with an 'X' for done  or 'G' for generic) "]
[]
[null,null,"Reason for exception of tests:"]
[]
[]
[]
[]
[]
[null,null,"--","Not required."]
[null,null,"I","Information Note required."]
[null,null,"P","PCN required."]
[]
[null,null,"A letter or \"●\" indicates that performance of that stress test should be considered for the appropriate process change."]
[]
[null,null,null,"CONDITIONS","No"]
[null,null,"A","Not for Ag plated devices applicable (Ag intended to fail for this test)"]
[null,null,"B","Only if Bondarea/Wirebond is changed/affected"]
[null,null,"C","Only if dopand/implantation material is changed"]
[null,null,"D","Only if Dimensions are changing"]
[null,null,"E","Only if min/max Values are changing"]
[null,null,"F","Sequence change only"]
[null,null,"H","Non Epoxy Casted Devices only"]
[null,null,"J","Only for chip technology using wafer bonding"]
[null,null,"K","Not for Au plated devices"]
[null,null,"L","Only if Leadframe/Substrate Dimensions are changed"]
[null,null,"M","Only if metal composition is changed including sequence"]
[null,null,"N","Only for glued chips "]
[null,null,"O","Only if process is changing"]
[null,null,"P","Only if material properties are changed"]
[null,null,"Q","Only if glue components are changing"]
[null,null,"R","Only if marking technology changes"]
[null,null,"S","Only if Floor Life is affected"]
[null,null,"T","Only if Board Reliability is affected"]
[null,null,"U","only if underfill is affected"]
[null,null,"V","Only for non-hermetic devices"]
[null,null,"W","Only if risk of corrosion is increasing"]
[null,null,"Y","Only for layer technology"]
[null,null,"Z","Only if conversion technology changes"]
[null,null,1,"Only if data sheet parameters are affected"]
[]
[null,null,null,"=> Please mark 'NO' with 'x', default is 'YES'"]
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[null,null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]
[]
[null,null,null,null,null,null,null,null,null,null,null,"-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-","-"]