EVAL-ADPA7007

製品概要

The ADPA7007-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat sink. The ADPA7007-EVALZ uses the same PCB as the ADPA7005-EVALZ but with the ADPA7007 populated on the board. The heat sink assists in providing thermal relief to the ADPA7007 as well as mechanical support to the PCB. Mounting holes on the heat sink allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device.

RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the evaluation board represent the configuration that was used to characterize and qualify the device. The number of capacitors can be reduced but this scope varies from system to system. The general guidance is to first remove or combine the largest capacitors that are farthest from the device.

Consult the ADPA7007 data sheet in conjunction with this user guide when working with the ADPA7007-EVALZ board.