EVAL-20LFCSP

製品概要

The EVAL-20LFCSPEBZ enables easy evaluation of the 20-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-20LFCSPEBZ is supplied with a socket to secure a 20-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 shows the EVAL-20LFCSPEBZ. A 20-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding 3-pin header link, from K1 to K20, which can either be connected to an external signal source by removing the corresponding link or by using the link to choose between VDD or GND. A wire screw terminal, J1, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-20LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 20-lead LFCSP pads (4 mm × 4 mm and 5 mm × 5 mm) available on top of the EVAL-20LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-20LFCSPEBZ user guide when using the EVAL-20LFCSPEBZ.