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AN-1389: リード・フレーム・チップ・スケール・パッケージ(LFCSP)のリワーク推奨手順 (Rev. 0)1/25/2016PDF133K
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AN-772: リード・フレーム・チップ・スケール・パッケージ(LFCSP)の設計および製造ガイド2/1/2006
製品概要
製品概要
As is the case with many high speed line driver applications, careful attention to printed circuit board (PCB) layout can improve performance and help maintain stability while preventing excessive die temperatures during normal operation. Differential signal balance can be maintained by using symmetry in the PCB layout of input and output signal traces. See AN-772 for complete details.