LTM2883
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LTM2883

SPI/Digital or I2C μModule Isolator with Adjustable ±12.5V and 5V Regulated Power

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Info: : PRODUCTION tooltip
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Part Details
Part Models 12
1ku List Price Starting From $14.07
Features
  • 2500VRMS for One Minute per UL1577
  • UL Recognized File #E151738
  • Isolated Adjustable DC Power:
    • 3V to 5V at Up to 30mA
    • ±12.5V at Up to 20mA
  • No External Components Required
  • SPI (LTM2883-S) or I2C (LTM2883-I) Options
  • High Common Mode Transient Immunity: 30kV/μs
  • High Speed Operation:
    • 10MHz Digital Isolation
    • 4MHz/8MHz SPI Isolation
    • 400kHz I2C Isolation
  • 3.3V (LTM2883-3) or 5V (LTM2883-5) Operation
  • 1.62V to 5.5V Logic Supply
  • ±10kV ESD HBM Across the Isolation Barrier
  • Maximum Continuous Working Voltage: 560VPEAK
  • Low Current Shutdown Mode (<10μA)
  • Low Profile (15mm × 11.25mm × 3.42mm) BGA Package
Additional Details
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The LTM2883 is a complete galvanic 6-channel digital μModule® (micromodule) isolator. No external components are required. A single 3.3V or 5V supply powers both sides of the interface through an integrated, isolated DC/DC converter. A logic supply pin allows easy interfacing with different logic levels from 1.62V to 5.5V, independent of the main supply.

Available options are compliant with SPI and I2C (master mode only) specifications.

The isolated side includes ±12.5V and 5V nominal power supplies, each capable of providing more than 20mA of load current. Each supply may be adjusted from its nominal value using a single external resistor.

Coupled inductors and an isolation power transformer provide 2500VRMS of isolation between the input and output logic interface. This device is ideal for systems where the ground loop is broken, allowing for a large common mode voltage range. Communication is uninterrupted for common mode transients greater than 30kV/μs.

Applications

  • Isolated SPI or I2C Interfaces
  • Industrial Systems
  • Test and Measurement Equipment
  • Breaking Ground Loops
Part Models 12
1ku List Price Starting From $14.07

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Documentation

Documentation

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Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
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Product Lifecycle

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Jul 21, 2021

- 21_0159

Ink Mark to Laser Mark Conversion for µModule

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Feb 28, 2020

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Micro-Module, Test Site Transfer from Analog Devices Singapore to Analog Devices Penang, Malaysia

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Jul 21, 2021

- 21_0159

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Ink Mark to Laser Mark Conversion for µModule

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LTM2883CY-5I#PBF

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LTM2883CY-5S#PBF

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LTM2883IY-3S#PBF

PRODUCTION

LTM2883IY-5I#PBF

PRODUCTION

LTM2883IY-5S#PBF

PRODUCTION

Feb 28, 2020

- 20_0123

arrow down

Micro-Module, Test Site Transfer from Analog Devices Singapore to Analog Devices Penang, Malaysia

LTM2883CY-3I#PBF

PRODUCTION

LTM2883CY-3S#PBF

PRODUCTION

LTM2883CY-5I#PBF

PRODUCTION

LTM2883CY-5S#PBF

PRODUCTION

LTM2883HY-3I#PBF

PRODUCTION

LTM2883HY-3S#PBF

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Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 4

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DC1748A-D

LTM2883-5I I2C µModule Isolator Demo Board (5.0V Supply)

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DC1748A-B

LTM2883-5S SPI µModule Isolator Demo Board (5.0V Supply)

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DC1748A-A

LTM2883-3S SPI µModule Isolator Demo Board (3.3V Supply)

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DC1748A-C

LTM2883-3I I2C µModule Isolator Demo Board (3.3V Supply)

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