HMC7992
Info : RECOMMENDED FOR NEW DESIGNS
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HMC7992

Nonreflective, Silicon SP4T Switch, 0.1 GHz to 6.0 GHz

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 2
1ku List Price
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Features
  • Nonreflective, 50 Ω design
  • High isolation: 45 dB typical at 2 GHz
  • Low insertion loss: 0.6 dB at 2 GHz
  • High power handling
    • 33 dBm through path
    • 27 dBm terminated path
  • High linearity
    • 1 dB compression (P1dB): 35 dBm typical
    • Input third-order intercept (IIP3): 58 dBm typical
  • ESD rating: 2 kV human body model (HBM), Class 2
  • Single positive supply: 3.3 V to 5.0 V
  • Standard TTL-, CMOS-, and 1.8 V-compatible control 16-lead, 3 mm × 3 mm LFCSP package (9 mm2)
  • Pin compatible with the HMC241ALP3E
Additional Details
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The HMC7992 is a general-purpose, nonreflective, 0.1 GHz to 6.0 GHz, silicon, single-pole, four-throw (SP4T) switch in a leadless, surface-mount package. The switch is ideal for cellular infrastructure applications, offers high isolation of 45 dB typical at 2 GHz, and a low insertion loss of 0.6 dB at 2 GHz. It offers excellent power handling capability up to 6.0 GHz, with input power of 1 dB compression point (P1dB) of 35 dBm at 5 V operation. The HMC7992 has good low frequency input power handling below 0.1 GHz and can operate well down to 10 kHz, with a typical 1 dB compression of 21 dBm and an IIP3 of 37 dBm at 1 MHz.

The on-chip circuitry allows the HMC7992 to operate at a single, positive supply voltage range from 3.3 V to 5 V, and as well as a single, positive control voltage from 0 V to 1.8 V/3.3 V/5.0 V. A 2:4 decoder integrated in the switch requires only two controlled input signals, with a positive control voltage range from 0 V to 1.8 V/3.3 V/5.0 V, to select one of the four radio frequency (RF) paths.

Applications

  • Cellular/4G infrastructure
  • Wireless infrastructure
  • Automotive telematics
  • Mobile radios
  • Test equipment

Part Models 2
1ku List Price
price unavailable

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
HMC7992LP3DE
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HMC7992LP3DETR
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Product Lifecycle

PCN

Apr 19, 2022

- 22_0048

Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products

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Apr 19, 2022

- 22_0048

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Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products

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Software & Part Ecosystem

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