DS2482-100
Single-Channel 1-Wire Master
Show MoreI²C to 1-Wire Bridge Device that Interfaces Directly to Standard (100kHz max) or Fast (400kHz max) I²C Masters to Perform Bidirectional Protocol Conversion Between the I²C Master and Any Downstream 1-Wire Slave Device
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- Allows Easy Interface Between a I2C Microport and a 1-Wire Slave
- I2C Host Interface Supports 100kHz and 400kHz I2C Communication Speeds
- 1-Wire Master IO with Selectable Active or Passive 1-Wire Pullup
- Provides Reset/Presence, 8-Bit, Single-Bit, and 3-Bit 1-Wire IO Sequences
- Standard and Overdrive 1-Wire Communication Speeds
- Two Address Inputs for I2C Address Assignment
- Minimizes Line Noise Reducing System EMI
- Slew-Controlled 1-Wire Edges
- Supports EEPROMs, Temperature Sensors, or Other 1-Wire Slaves That Have Momentary High Source
Current Modes
- Strong 1-Wire Pullup Provided by an Internal Low-Impedance Signal Path
- PCTLZ Output to Optionally Control an External MOSFET for Stronger Pullup Requirements
- Operating Range: 2.9V to 5.5V, -40°C to +85°C
- 8-Pin (150 mils) SO and 8-Bump WLP Packages
The DS2482-100 is an I2C to 1-Wire® bridge device that interfaces directly to standard (100kHz max) or fast (400kHz max) I2C masters to perform bidirectional protocol conversion between the I2C master and any downstream 1-Wire slave devices. Relative to any attached 1-Wire slave device, the DS2482-100 is a 1-Wire master. Internal factory trimmed timers relieve the system host processor from generating time-critical 1-Wire waveforms, supporting both standard and Overdrive 1-Wire communication speeds. To optimize 1-Wire waveform generation, the DS2482-100 performs slew rate control on rising and falling 1-Wire edges and provides additional programmable features to match drive characteristics to the 1-Wire slave environment. Programmable strong pullup features support 1-Wire power delivery to 1-Wire devices such as EEPROMs and sensors. The DS2482-100 combines these features with an output to control an external MOSFET for enhanced strong pullup application. The I2C slave address assignment is controlled by two binary address inputs, resolving potential conflicts with other I2C slave devices in the system.
Applications
- Cell Phones/PDAs
- Industrial Sensors
- Medical Instruments
- Printers
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DS2482-100
Documentation
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Data Sheet
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Reliability Data
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Documentation
Data Sheet 1
Reliability Data 1
Application Note 1
Design Note 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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DS2482S-100+ | Small-Outline IC, Narrow (0.15in) |
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DS2482S-100+T&R | Small-Outline IC, Narrow (0.15in) |
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DS2482X-100+T | Wafer-Level Package 3x3 Bump, Depopulated |
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DS2482X-100+U | Wafer-Level Package 3x3 Bump, Depopulated |
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- DS2482S-100+
- Pin/Package Drawing
- Small-Outline IC, Narrow (0.15in)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- DS2482S-100+T&R
- Pin/Package Drawing
- Small-Outline IC, Narrow (0.15in)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- DS2482X-100+T
- Pin/Package Drawing
- Wafer-Level Package 3x3 Bump, Depopulated
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- DS2482X-100+U
- Pin/Package Drawing
- Wafer-Level Package 3x3 Bump, Depopulated
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Oct 30, 2020
- 1702R2
ASSEMBLY
DS2482S-100+
PRODUCTION
DS2482S-100+T&R
PRODUCTION
Dec 21, 2016
- 1671A
ASSEMBLY
DS2482X-100+T
PRODUCTION
DS2482X-100+U
PRODUCTION
Jul 19, 2016
- 1594_AMENDED
ASSEMBLY
DS2482X-100+T
PRODUCTION
DS2482X-100+U
PRODUCTION
Dec 8, 2015
- 1594_PRE-PCN
WAFER FAB
DS2482X-100+T
PRODUCTION
DS2482X-100+U
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Oct 30, 2020
- 1702R2
ASSEMBLY
Dec 21, 2016
- 1671A
ASSEMBLY
Jul 19, 2016
- 1594_AMENDED
ASSEMBLY
Dec 8, 2015
- 1594_PRE-PCN
WAFER FAB
Software & Part Ecosystem
Parts | Product Life Cycle | Description | ||
---|---|---|---|---|
1-Wire Interface Products2 |
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PRODUCTION |
8-Channel 1-Wire Master |
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PRODUCTION |
Serial to 1-Wire Line Driver |
Can't find the software or driver you need?
Request a Driver/SoftwareEvaluation Kits 1
DS28EA00EVKIT
Evaluation Kit for the DS28EA00
Product Detail
The DS28EA00 evaluation system (EV system) consists of a single evaluation kit (EV kit) that includes an evaluation board (EV board) made up of three subsections that can be broken/snapped off into three independently exercisable boards. See Figure 1 (in the full data sheet) for a picture of the standalone EV board and Figure 2 (in the full data sheet) for a picture of the EV board snapped and cabled together. Three DS28EA00 temperature chips with GPIO and sequence detect can be found on the EV board, one per subsection. Also included in the kit are connectivity items, such as serial cables, a 1-Wire® USB adapter, and jumpers. Free evaluation software, the OneWireViewer, is available for download from the web page listed in the Support Resources (in the full data sheet) section.
Since one of the major features of the DS28EA00 is detection of physical sequence, a block of dip switches are provided on each subsection of the EV board to re-order the physical connection between the chips. Optionally, the customer can break off the subsections of the eval board, connect them together with the provided cables, and re-order the physical sequence of the DS28EA00s that way. The OneWireViewer evaluation software can then be used to exercise the functionality of the chips and provide a way for an evaluator to see the actual physical connection sequence of the chips. The algorithm to detect the connection order is called chain mode. More information on chain mode can be found in Application Note 4037.
Applications
- Any Rack-Based Electronic System
- Climate Control
- Data communication equipment
- Process Temperature Monitoring
- Servers
- Wireless Basestations