ADV7125
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ADV7125

330MHz Triple 8-Bit High Speed Video DAC

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Info: : PRODUCTION tooltip
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Part Details
Part Models 10
1ku List Price Starting From $5.59
Features
  • 330 MSPS throughput rate
  • Triple 8-bit DACs
  • RS-343A-/RS-170-compatible output
  • Complementary outputs
  • DAC output current range: 2.0 mA to 26.5 mA
  • TTL-compatible inputs
  • Internal reference (1.235 V)
  • Single-supply +5 V/+3.3 V operation
  • 48-lead LQFP and LFCSP
  • Low power dissipation (30 mW minimum at 3 V)
  • Low power standby mode (6 mW typical at 3 V)
  • Industrial temperature range (−40°C to +85°C)
  • RoHS compliant packages
  • Qualified for automotive applications
Additional Details
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The ADV7125 (ADV®) is a triple high speed, digital-to-analog converter (DAC) on a single monolithic chip. It consists of three high speed, 8-bit video DACs with complementary outputs, a standard TTL input interface, and a high impedance, analog output current source.

The ADV7125 has three separate 8-bit-wide input ports. A single +5 V/+3.3 V power supply and clock are all that are required to make the device functional. The ADV7125 has additional video control signals, composite SYNC and BLANK as well as a power save mode.

The ADV7125 is fabricated in a 5 V CMOS process. Its monolithic CMOS construction ensures greater functionality with lower power dissipation. The ADV7125 is available in 48- lead LQFP and 48-lead LFCSP packages.

Product Highlights

  1. 330 MSPS (3.3 V only) throughput.
  2. Guaranteed monotonic to eight bits.
  3. Compatible with a wide variety of high resolution color graphics systems, including RS-343A and RS-170.

Applications

  • Digital video systems
  • High resolution color graphics
  • Digital radio modulation
  • Image processing
  • Instrumentation
  • Video signal reconstruction
  • Automotive infotainment units
Part Models 10
1ku List Price Starting From $5.59

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADV7125BCPZ170
  • HTML
  • HTML
ADV7125BCPZ170-RL
  • HTML
  • HTML
ADV7125JSTZ240
  • HTML
  • HTML
ADV7125JSTZ330
  • HTML
  • HTML
ADV7125KSTZ140
  • HTML
  • HTML
ADV7125KSTZ50
  • HTML
  • HTML
ADV7125KSTZ50-REEL
  • HTML
  • HTML
ADV7125WBCPZ170
  • HTML
  • HTML
ADV7125WBSTZ170
  • HTML
  • HTML
ADV7125WBSTZ170-RL
  • HTML
  • HTML

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Product Lifecycle

PCN

Sep 13, 2017

- 16_0077

CANCELLED: Conversion of Select 4x4, 5x5, 6x6 and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE Korea.

Dec 10, 2014

- 14_0049

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Dec 7, 2016

- 16_0033

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select QFP Products

ADV7125JSTZ240

PRODUCTION

ADV7125JSTZ330

PRODUCTION

ADV7125KSTZ140

PRODUCTION

ADV7125KSTZ50

PRODUCTION

ADV7125KSTZ50-REEL

PRODUCTION

ADV7125WBSTZ170

PRODUCTION

ADV7125WBSTZ170-RL

PRODUCTION

Sep 22, 2010

- 10_0164

ADV7123 & ADV7125 Additional Wafer Fab Location

ADV7125JSTZ240

PRODUCTION

ADV7125JSTZ330

PRODUCTION

ADV7125KSTZ140

PRODUCTION

ADV7125KSTZ50

PRODUCTION

ADV7125KSTZ50-REEL

PRODUCTION

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

ADV7125JSTZ240

PRODUCTION

ADV7125KSTZ140

PRODUCTION

ADV7125KSTZ50

PRODUCTION

Jan 5, 2009

- 07_0077

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

Apr 29, 2015

- 14_0049

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Sep 13, 2017

- 16_0077

arrow down

CANCELLED: Conversion of Select 4x4, 5x5, 6x6 and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE Korea.

Dec 10, 2014

- 14_0049

arrow down

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Dec 7, 2016

- 16_0033

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select QFP Products

ADV7125JSTZ240

PRODUCTION

ADV7125JSTZ330

PRODUCTION

ADV7125KSTZ140

PRODUCTION

ADV7125KSTZ50

PRODUCTION

ADV7125KSTZ50-REEL

PRODUCTION

ADV7125WBSTZ170

PRODUCTION

ADV7125WBSTZ170-RL

PRODUCTION

Sep 22, 2010

- 10_0164

arrow down

ADV7123 & ADV7125 Additional Wafer Fab Location

ADV7125JSTZ240

PRODUCTION

ADV7125JSTZ330

PRODUCTION

ADV7125KSTZ140

PRODUCTION

ADV7125KSTZ50

PRODUCTION

ADV7125KSTZ50-REEL

PRODUCTION

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

ADV7125JSTZ240

PRODUCTION

ADV7125KSTZ140

PRODUCTION

ADV7125KSTZ50

PRODUCTION

Jan 5, 2009

- 07_0077

arrow down

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

Apr 29, 2015

- 14_0049

arrow down

Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

Tools & Simulations

Tools & Simulations 1

Reference Designs

Reference Designs 1

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