ADG212A
NOT RECOMMENDED FOR NEW DESIGNSQuad SPST Switch
- Part Models
- 4
- 1ku List Price
- Starting From $2.03
Part Details
- 44 V Supply Maximum Ratings
- ± 15 V Analog Signal Range
- Low On-Resistance (115 O max)
- Low Leakage: 0.5 nA typical
- Break-Before-Make Switching Action
- Extended Plastic Temperature Range: (-40°C to +85°C)
- See datasheet for additional features
The ADG211A and ADG212A are monolithic CMOS devices comprising four independently selectable switches. They are designed on an enhanced LC2 MOS process, which gives an increased signal handling capability of ±15 V. These switches also feature high switching speeds and low RON.
The ADG211A and ADG212A consist of four SPST switches. They differ only in that the digital control logic is inverted. In multiplexer applications, all switches exhibit break-before-make switching action when driven simultaneously. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
PRODUCT HIGHLIGHTS
- Extended Signal Range.
These switches are fabricated on an enhanced LC2 MOS process, resulting in high breakdown and an increased analog signal range of ±15 V. - Single Supply Operation.
For applications where the analog signal is unipolar (0 V to 15 V), the switches can be operated from a single 15 V supply. - Low Leakage.
Leakage currents in the range of 500 pA make these switches suitable for high precision circuits. The added feature of break-before-make allows for multiple outputs to be tied together for multiplexer applications while keeping leakage errors to a minimum.
Documentation
Data Sheet 1
Technical Articles 3
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG212AKNZ | 16-Lead PDIP | ||
| ADG212AKPZ | 20-Lead Flatpack | ||
| ADG212AKRZ | 16-Lead SOIC | ||
| ADG212AKRZ-REEL | 16-Lead SOIC |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Mar 29, 2021 - 21_0033 Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek |
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| ADG212AKNZ | ||
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Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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| ADG212AKNZ | ||
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Feb 6, 2014 - 13_0234 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages |
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| ADG212AKRZ | ||
| ADG212AKRZ-REEL | ||
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Oct 5, 2010 - 10_0146 Halogen Free Material Change for 14/16L SOIC_N Products |
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| ADG212AKRZ | ||
| ADG212AKRZ-REEL | ||
This is the most up-to-date revision of the Data Sheet.