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Features
- 4.7 Ω maximum on resistance at 25°C
- 0.5 Ω on-resistance flatness
- Up to 190 mA continuous current
- Fully specified at ±15 V/+12 V/±5 V
- 3 V logic-compatible inputs
- Rail-to-rail operation
- Break-before-make switching action
- 16-lead TSSOP and 4 mm × 4 mm LFCSP
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The ADG1408 / ADG1409 are monolithic iCMOS® analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG1408 switches one of eight inputs to a common output, as determined by the 3-bit binary address lines, A0, A1, and A2. The ADG1409 switches one of four differential inputs to a common differential output, as determined by the 2-bit binary address lines, A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched off.
The industrial CMOS (iCMOS) modular manufacturing process combines high voltage complementary metal-oxide semiconductor (CMOS) and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no other generation of high voltage parts has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.
The ultralow on resistance and on resistance flatness of these switches make them ideal solutions for data acquisition and gain switching applications where low distortion is critical. iCMOS construction ensures ultralow power dissipation, making the parts ideally suited for portable and battery-powered instruments.
Product Highlights
- 4 Ω on resistance.
- 0.5 Ω on-resistance flatness.
- 3 V logic compatible digital input, VIH = 2.0 V, VIL = 0.8 V.
- 16-lead TSSOP and 4 mm × 4 mm LFCSP.
Applications
- Relay replacement
- Audio and video routing
- Automatic test equipment
- Data acquisition systems
- Temperature measurement systems
- Avionics
- Battery-powered systems
- Communication systems
- Medical equipment
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ADG1409
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1409SRUZ-EP |
16-Lead TSSOP
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| ADG1409SRUZ-EP-RL7 |
16-Lead TSSOP
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| ADG1409YCPZ-REEL7 |
16-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG1409YRUZ |
16-Lead TSSOP
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| ADG1409YRUZ-REEL |
16-Lead TSSOP
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| ADG1409YRUZ-REEL7 |
16-Lead TSSOP
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- ADG1409SRUZ-EP
- Pin/Package Drawing
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16-Lead TSSOP
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADG1409SRUZ-EP-RL7
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- ADG1409YCPZ-REEL7
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
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HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- ADG1409YRUZ
- Pin/Package Drawing
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16-Lead TSSOP
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADG1409YRUZ-REEL
- Pin/Package Drawing
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16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- ADG1409YRUZ-REEL7
- Pin/Package Drawing
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16-Lead TSSOP
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1409YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG1409YCPZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1409YCPZ-REEL7
PRODUCTION
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Oct 13, 2008
- 06_0084
Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.
ADG1409YCPZ-REEL7
PRODUCTION
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1409YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG1409YCPZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1409YCPZ-REEL7
PRODUCTION
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Oct 13, 2008
- 06_0084
Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.
ADG1409YCPZ-REEL7
PRODUCTION
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1409YRUZ
PRODUCTION
ADG1409YRUZ-REEL
PRODUCTION
ADG1409YRUZ-REEL7
PRODUCTION
Software & Part Ecosystem
| Parts | Product Life Cycle | Description |
|---|---|---|
|
RECOMMENDED FOR NEW DESIGNS |
High Voltage Latch-up Proof 4-Channel Multiplexer |
Evaluation Kits 2
EVAL-16LFCSP
Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.
Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.
EVAL-16TSSOP
Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio
Product Detail
The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
To launch ready-to-run LTspice demonstration circuits for this part:
Step 1: Download and install LTspice on your computer.
Step 2: Click on the link in the section below to download a demonstration circuit.
Step 3: If LTspice does not automatically open after clicking the link below, you can instead run the simulation by right clicking on the link and selecting “Save Target As.” After saving the file to your computer, start LTspice and open the demonstration circuit by selecting ‘Open’ from the ‘File’ menu.
Lt Spice
Reference Designs 1
CN0251
24-Bit, 4.7 Hz, 4-Channel Analog Data Acquisiton System
Circuits from the lab
Info:Circuits from the lab
