ADG1404
1.8 Ω Maximum On Resistance, ±15 V/12 V/±5 V, 4:1, iCMOS Multiplexer
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Features
- 1.5 Ω on resistance
- 0.3 Ω on-resistance flatness
- 0.1 Ω on-resistance match between channels
- Up to 400 mA continuous current
- Fully specified at +12 V, ±15 V, and ±5 V
- No VL supply required
- 3 V logic-compatible inputs
- Rail-to-rail operation
- 14-lead TSSOP and 4 mm × 4 mm, 16-lead LFCSP
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The ADG1404 is a complementary metal-oxide semiconductor (CMOS) analog multiplexer, comprising four single channels designed on an iCMOS® process. iCMOS (industrial CMOS) is a modular manufacturing process that combines high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.
The on-resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching audio signals.
iCMOS construction ensures ultralow power dissipation, making the device ideally suited for portable and battery-powered instruments.
The ADG1404 switches one of four inputs to a common output, D, as determined by the 3-bit binary address lines, A0, A1, and EN. Logic 0 on the EN pin disables the device. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
Product Highlights
- 2.6 Ω maximum on resistance over temperature.
- Minimum distortion.
- Ultralow power dissipation: <0.03 μW.
- 14-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP package.
Applications
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Sample-and-hold systems
- Audio signal routing
- Communication systems
- Relay replacement
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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ADG1404
Documentation
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1404YCPZ-REEL |
16-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG1404YCPZ-REEL7 |
16-Lead LFCSP (4mm x 4mm w/ EP)
|
|
|
| ADG1404YRUZ |
14-Lead TSSOP
|
|
|
| ADG1404YRUZ-REEL7 |
14-Lead TSSOP
|
|
- ADG1404YCPZ-REEL
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1404YCPZ-REEL7
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1404YRUZ
- Pin/Package Drawing
-
14-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1404YRUZ-REEL7
- Pin/Package Drawing
-
14-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1404YCPZ-REEL
PRODUCTION
ADG1404YCPZ-REEL7
PRODUCTION
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1404YRUZ
PRODUCTION
ADG1404YRUZ-REEL7
PRODUCTION
Evaluation Kits 2
EVAL-16LFCSP
Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.
Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.
EVAL-14TSSOPEBZ
EVAL-14TSSOPEBZ Evaluation Board
Product Detail
A 14-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device that the eval board evaluates has a corresponding link from K1 to K14 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
For full details, see the corresponding product data sheet, which must be used in conjunction with this user guide when using the evaluation board.
