ADF7024
warning : NOT RECOMMENDED FOR NEW DESIGNS
searchIcon
cartIcon

ADF7024

Easy To Use, Low Power, Sub GHz, ISM/SRD, FSK/GFSK, Transceiver IC

Show More showmore-icon

warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 2
1ku List Price Starting From $1.27
Features
  • Radio frequency bands:
    431 MHz to 435 MHz and
    862 MHz to 928 MHz
  • Data rates supported:
    9.6 kbps, 38.4 kbps, 50 kbps, 100 kbps, 200 kbps, and 300 kbps
  • Modulation: two-level frequency (FSK) and Gaussian frequency (GFSK) shift keying
  • 2.2 V to 3.6 V power supply
  • Ultralow power sleep modes for long battery life
  • See datasheet for additional features
Additional Details
show more Icon

The ADF7024 is an ultralow power, integrated transceiver for use in the license-free ISM bands at 433 MHz, 868 MHz, and 915 MHz. Its ease of use and high performance make it suitable for a wide variety of wireless applications. The ADF7024 is suitable for operation under the European ETSI EN 300-220 regulation, the North American FCC Part 15 regulation, and other similar regulatory standards.

The ADF7024 can operate under a number of predefined radio profiles. For each radio profile, optimized register settings are provided for the ADF7024 radio. This ensures that the RF communication layer works seamlessly, allowing the user to concentrate on the protocol and system level design and prototyping. The radio profiles cover common data rate and modulation options. There are six radio profiles in total, as shown in Table 1.

The ADF7024 operates with a power supply range of 2.2 V to 3.6 V and has very low power consumption in both Tx and Rx modes, enabling long lifetimes in battery-operated systems while maintaining excellent RF performance.

The low IF receiver minimizes power consumption and provides excellent sensitivity. The receiver is exceptionally linear and, therefore, is very resilient to the presence of interferers in spectrally noisy environments. The highly efficient transmitter has programmable output power up to 13.5 dBm and automatic power amplifier (PA) ramping to meet transient spurious specifications. The RF synthesizer comprises a voltage controlled oscillator (VCO), a low noise fractional-N phase-locked loop (PLL) and a loop filter, all of which are fully integrated and automatically calibrated. This agile frequency synthesizer facilitates the implementation of frequency-hopping spread spectrum (FHSS) systems.

The smart wake mode (SWM) allows the ADF7024 to wake up autonomously from sleep using the internal wake-up timer without intervention from the host processor. This functionality allows carrier sense, packet sniffing, and packet reception while the host processor is in sleep, thereby reducing overall system current consumption.

The ADF7024 eases the processing burden of the host processor by integrating the lower layers of a typical communication protocol stack. The host processor can configure the ADF7024 using a simple command-based protocol over a standard 4-wire SPI interface. A single-byte command transitions the radio between states or performs a radio function.

A complete wireless solution can be built using a small number of external discrete components and a host processor (typically a microcontroller).

For more information, see the ADF7024 Hardware Reference Manual, UG-698, which is only available as part of the ADF7024 design resource package.

APPLICATIONS

  • Wireless sensor networks (WSNs)
  • Home and building automation
  • Asset tracking
  • Process and building control
  • Industrial control
  • Internet of Things (IoT)
Part Models 2
1ku List Price Starting From $1.27

close icon

Documentation

Video

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADF7024BCPZ
  • HTML
  • HTML
ADF7024BCPZ-RL
  • HTML
  • HTML

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Feb 1, 2024

- 24_0009

Qualification of alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process

Jul 5, 2022

- 21_0271

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Jun 25, 2014

- 13_0246

Assembly and Test Transfer of Select 3x3, 4x4, 5x5 and 7x7 mm LFCSP Pre-plated Leadframe Products to STATS ChipPAC China

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Feb 1, 2024

- 24_0009

arrow down

Qualification of alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process

Jul 5, 2022

- 21_0271

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Oct 18, 2016

- 16_0036

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Jun 25, 2014

- 13_0246

arrow down

Assembly and Test Transfer of Select 3x3, 4x4, 5x5 and 7x7 mm LFCSP Pre-plated Leadframe Products to STATS ChipPAC China

Software & Part Ecosystem

Evaluation Kits 2

reference details image

EVAL-WSN

Wireless Sensor Network (WSN) Development Kits for Your IoT Solutions

zoom

EVAL-WSN

Wireless Sensor Network (WSN) Development Kits for Your IoT Solutions

Wireless Sensor Network (WSN) Development Kits for Your IoT Solutions

Features and Benefits

Wireless Sensor Network Development Kit – Bunch Version includes:
  • Two Multi-Sensor Node Boards which include the following components
    • ADuCRF101 Integrated TRx + ARM Cortex M3 MCU
    • ADT75 Temperature Sensor
    • ADXL362 Ultra-low Power Triple Axis Accelerometer
    • Humidity & Temperature Sensor (Sensirion SHT21)
    • Photodiode + Ambient Light Sensor (Avago APDS-9005)
    • Passive Infrared Sensor (Panasonic EKMB1201112)
    • ADP160 Power Management device
    • General Purpose Input Connector for other sensors (supports both analog and digital
    • CR2032 Coin cell battery
    • Form factor: 60mm x 33mm (2.4" x 1.3")
  • One Gateway Node
    • ADuCRF101 Integrated TRx + ARM Cortex M3 MCU development system
  • One Emulator Platform for development and debugging

Wireless Sensor Network Development Kit – Cluster Version includes:
  • Three Multi-Sensor Node Boards which include the following components
    • ADF7024 Sub-GHz ISM band Transceiver
    • 16-bit MCU (RL78-G13)
    • ADT75 Temperature Sensor
    • ADXL362 Ultra-low Power Triple Axis Accelerometer
    • Humidity & Temperature Sensor (Sensirion SHT21)
    • Photodiode + Ambient Light Sensor (Avago APDS-9005)
    • Passive Infrared Sensor (Panasonic EKMB1201112)
    • ADP160 Power Management device
    • General Purpose Input Connector for other sensors (support both analog and digital)
    • CR2032 Coin cell battery
    • Form factor: 60mm x 33mm (2.4" x 1.3")
  • One Emulator Platform for development and debugging

Product Detail

The Wireless Sensor Network (WSN) demo platform is a flexible, modular system for evaluating all aspects of a WSN. It offers both an out-of-the-box demonstration system, and can also be used as a development platform. It contains all of the hardware and software necessary to implement a plug-and-play WSN. The hardware includes a base station node along with multiple sensor nodes that support many different sensors. The system is flexible in that sensors can be connected in any combination to any of the sensor nodes. The out-of-the-box utility of the WSN development kits significantly reduces the time and effort required to move a customer’s design from proof-of-concept phase to production release through the marriage of three Multi-Sensor Node Boards, a gateway connector, an emulator platform, and a full featured software package.

EVAL-ADF7024

ADF7024 Evaluation Board

zoom

EVAL-ADF7024

ADF7024 Evaluation Board

ADF7024 Evaluation Board

Product Detail

The ADF7024 daughter boards are intended for use with the EVAL-ADF7XXXMB4Z mother board, which needs to be ordered separately.


Two different board layouts are available for the ADF7024. In the first layout there are separate matching circuits for the single ended PA and differential LNA. This layout is used on the EVAL-ADF7024DB1 (matched for 862-928MHz) and EVAL-ADF7024DB3 (matched for 431-435MHz) evaluation boards.


In the second layout there is a single combined matching network connecting the single ended PA and the differential LNA. This layout is used on the EVAL-ADF7023DB2 (matched for 862-928MHz) and EVAL-ADF7023DB4 (matched for 431- 435MHz) evaluation boards.


Both layouts are 4-layer boards and use 0402 passives.


For detailed information on the ADF7024 daughter boards please download the ADF7024 design resource package.

Recently Viewed