ADCLK944
RECOMMENDED FOR NEW DESIGNS2.5 V/3.3 V, Four LVPECL Outputs, SiGe Clock Fanout Buffer
- Part Models
- 3
- 1ku List Price
- Starting From $3.94
Part Details
- Operating frequency: 7.0 GHz
- Broadband random jitter: 50 fs rms
- On-chip input terminations
- Power supply (VCC − VEE): 2.5 V to 3.3 V
The ADCLK944 is an ultrafast clock fanout buffer fabricated on the Analog Devices, Inc., proprietary XFCB3 silicon germanium (SiGe) bipolar process. This device is designed for high speed applications requiring low jitter.
The device has a differential input equipped with center-tapped, differential, 100 Ω on-chip termination resistors. The input can accept dc-coupled LVPECL, CML, 3.3 V CMOS (single-ended), and ac-coupled 1.8 V CMOS, LVDS, and LVPECL inputs. A VREF pin is available for biasing ac-coupled inputs.
The ADCLK944 features four full-swing emitter-coupled logic (ECL) output drivers. For LVPECL (positive ECL) operation, bias VCC to the positive supply and VEE to ground. For ECL operation, bias VCC to ground and VEE to the negative supply.
The ECL output stages are designed to directly drive 800 mV each side into 50 Ω terminated to VCC − 2 V for a total differential output swing of 1.6 V.
The ADCLK944 is available in a 16-lead LFCSP and is specified for operation over the standard industrial temperature range of −40°C to +85°C.
APPLICATIONS
- Low jitter clock distribution
- Clock and data signal restoration
- Level translation
- Wireless communications
- Wired communications
- Medical and industrial imaging
- ATE and high performance instrumentation
Documentation
Data Sheet 1
User Guide 1
Application Note 1
Technical Articles 3
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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ADCLK944BCPZ-R2 | 16-Lead LFCSP (3mm x 3mm x 0.85mm w/ EP) | ||
ADCLK944BCPZ-R7 | 16-Lead LFCSP (3mm x 3mm x 0.85mm w/ EP) | ||
ADCLK944BCPZ-WP | 16-Lead LFCSP (3mm x 3mm x 0.85mm w/ EP) |
Part Models | Product Lifecycle | PCN |
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No Match Found | ||
Jul 18, 2022 - 21_0271 Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
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ADCLK944BCPZ-R2 | ||
ADCLK944BCPZ-R7 | PRODUCTION | |
ADCLK944BCPZ-WP | PRODUCTION | |
Oct 18, 2016 - 16_0036 Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products |
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ADCLK944BCPZ-R2 | ||
ADCLK944BCPZ-R7 | PRODUCTION | |
Aug 6, 2014 - 13_0223 Assembly and Test Transfer of Select 2x3mm and 3x3mm LFCSP Products to STATS ChipPAC China |
||
ADCLK944BCPZ-R2 | ||
ADCLK944BCPZ-R7 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
ADCLK944 IBIS Model 1
ADIsimCLK Design and Evaluation Software
ADIsimCLK is the design tool developed specifically for Analog Devices' range of ultra-low jitter clock distribution and clock generation products. Whether your application is in wireless infrastructure, instrumentation, networking, broadband, ATE or other areas demanding predictable clock performance, ADIsimCLK will enable you to rapidly develop, evaluate and optimize your design.
Open Tool