The ADAQ23875 is a precision, high speed, μModule^® data acquisition solution that reduces the development cycle of a precision measurement systems by transferring the design burden of component selection, optimization, and layout from the designer to the device.

Using system-in-package (SIP) technology, the ADAQ23875 reduces end system component count by combining multiple common signal processing and conditioning blocks in a single device, solving many design challenges. These blocks include a low noise, fully differential analog-to-digital converter (ADC) driver (FDA), a stable reference buffer, and a high speed, 16-bit, 15 MSPS successive approximation register (SAR) ADC.

Using Analog Devices, Inc., iPassives^® technology, the ADAQ23875 also incorporates crucial passive components with superior matching and drift characteristics to minimize temperature dependent error sources and to offer optimized performance (see Figure 1). The fast settling of the ADC driver stage, with fully differential or single-ended to differential input and no latency of the SAR ADC, provides a unique solution for high channel count multiplexed signal chain architectures and control loop applications.

The small footprint, 9 mm × 9 mm CSP_BGA package enables smaller form factor instruments without sacrificing performance. Single, 5 V supply operation is possible while achieving optimum performance from the device. The ADAQ23875 features a serial low voltage differential signaling (LVDS) digital interface with one-lane or two-lane output modes, allowing the user to optimize the interface data rate for each application. The specified operation of the μModule is from −40°C to +85°C.

APPLICATIONS

• ATE
• Data acquisition
• Hardware in the Loop (HiL)
• Power analyzers
• Nondestructive test (acoustic emissions)
• Mass spectrometry
• Travelling wave fault location
• Medical imaging and instruments
• Ultrasonic flow meters