SOIC (Wide)

Small Outline, 300 mil body, 50 mil pitch. Note: For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location

chip image

Filter packages by entering lead count or product description into the search box below:

Package Outline Material Information
16-Lead SOIC (Increased Creepage) (ri-16-1) pdf pdf
16-Lead SOIC (Increased Creepage) (ri-16-2) pdf pdf
20-Lead SOIC (Increased Creepage) (ri-20-1) pdf pdf
6-Lead SOIC (Increased Creepage) (ri-6-1) PDF    
8-Lead SOIC (Increased Creepage) (ri-8-1) PDF PDF
28-Lead SOIC (Wide, Finer Pitch) (rn-28-1) PDF    
14-Lead SOIC (Wide) (rw-14) pdf  
16-Lead SOIC Wide (rw-16) pdf PDF
18-Lead SOIC (Wide) (rw-18) pdf PDF
20-Lead SOIC (Wide) (rw-20) pdf PDF
24-Lead SOIC (Wide) (rw-24) PDF PDF
28-Lead SOIC (Wide) (rw-28) pdf PDF