Features and Benefits
- 2-layer evaluation board with heat sink
- 75 Ω N-type RF male connectors
The ADCA5191-EVALZ evaluation board consists of a 2-layer printed circuit board (PCB) fabricated from a 62 mil laminate mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management.
The ADCA5191-EVALZ is populated with components to interface the IC to a typical CATV application. J1 (RF_IN) and J2 (RF_OUT) are 75 Ω, N type, male coaxial connectors. The respective RF traces of the ports have a 75 Ω characteristic impedance. The ADCA5191-EVALZ is populated with components suitable for use over the −40 °C to +100 °C operating temperature range of the ADCA5191.
Access to the supply voltage (VDD) and GND is through a 3-pin header (P1) on the ADCA5191-EVALZ.
RF traces are 75 Ω microstrip at the input and output RF connectors. The package ground leads and the exposed paddle connect directly to the ground plane. Multiple vias connect the LFCSP ground paddle to the bottom ground plane to provide adequate electrical conduction and thermal conduction to the heat sink. The transfer of heat from the ADCA5191-EVALZ ground to the heat sink is further facilitated by the insertion of a piece of indium approximately the footprint of the LFCSP between the ADCA5191-EVALZ bottom and the heat sink. There are no components on the bottom side of the PCB.
Consult the ADCA5191 data sheet in conjunction with the user guide when using the ADCA5191-EVALZ evaluation board.
Pricing displayed is based on 1-piece.
Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.