LFCSP-CS（侧面可焊接）(CS-)

引脚架构芯片级封装，侧面可焊接（封装图纸CS-）

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Package	Outline	Material Information
12-Lead LFCSP (3mm x 3mm w/ EP) (cs-12-4)	PDF Outline PDF
12-Lead LFCSP (4mm x 4mm w/ EP) (cs-12-1)	PDF Outline PDF	PDF Material Information PDF
12-Lead LFCSP (4mm x 4mm w/ EP) (cs-12-2)	PDF Outline PDF	PDF Material Information PDF
12-Lead LFCSP (4mm x 4mm w/ EP) (cs-12-3)	PDF Outline PDF	PDF Material Information PDF
16-Lead LFCSP (3mm x 3mm w/ EP) (cs-16-1)	PDF Outline PDF
32-Lead LFCSP (5mm x 5mm w/ EP) (cs-32-1)	PDF Outline PDF	PDF Material Information PDF
32-Lead LFCSP (5mm x 5mm x 0.75mm w/ EP) (cs-32-2)	PDF Outline PDF	PDF Material Information PDF
32-Lead LFCSP (5mm x 5mm x 1.45 w/EP) (cs-32-4)	PDF Outline PDF	PDF Material Information PDF
48-Lead LFCSP (7mm x 7mm w/ EP) (cs-48-1)	PDF Outline PDF	PDF Material Information PDF
72-Lead LFCSP (10mm x 10mm w/ EP) (cs-72-1)	PDF Outline PDF