LFCSP-CS(侧面可焊接)(CS-)

引脚架构芯片级封装,侧面可焊接(封装图纸CS-)

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Package Outline Material Information
12-Lead LFCSP (3mm x 3mm w/ EP) (cs-12-4) PDF    
12-Lead LFCSP (4mm x 4mm w/ EP) (cs-12-1) PDF PDF
12-Lead LFCSP (4mm x 4mm w/ EP) (cs-12-2) PDF PDF
12-Lead LFCSP (4mm x 4mm w/ EP) (cs-12-3) PDF PDF
16-Lead LFCSP (3mm x 3mm w/ EP) (cs-16-1) PDF    
32-Lead LFCSP (5mm x 5mm w/ EP) (cs-32-1) PDF PDF
32-Lead LFCSP (5mm x 5mm x 0.75mm w/ EP) (cs-32-2) PDF PDF
32-Lead LFCSP (5mm x 5mm x 1.45 w/EP) (cs-32-4) PDF PDF
48-Lead LFCSP (7mm x 7mm w/ EP) (cs-48-1) PDF PDF
72-Lead LFCSP (10mm x 10mm w/ EP) (cs-72-1) PDF