LFCSP-CAV(预制空腔)(CG-)

引脚架构芯片级封装,预制空腔(封装图纸CG-)

有关LFCSP封装的Via信息和焊接技术
请参考应用笔记AN-772
 

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Package Outline Material Information
16 ld LFCSP_CAV (3x3x1.25mm w/1.15mm EP) (CG-16-1) PDF    
32-Lead LFCSP_CAV (5mm x 5mm w/ EP) (cg-32-1) PDF PDF
32-Lead LFCSP (5mm x 5mm w/ EP) (CG-32-2) PDF PDF