LFCSP-CAV（预制空腔）(CG-)

引脚架构芯片级封装，预制空腔（封装图纸CG-）

有关LFCSP封装的Via信息和焊接技术
请参考应用笔记AN-772

Filter packages by entering lead count or product description into the search box below:

Package	Outline	Material Information
16 ld LFCSP_CAV (3x3x1.25mm w/1.15mm EP) (CG-16-1)	PDF Outline PDF
32-Lead LFCSP (5mm x 5mm w/ EP) (CG-32-2)	PDF Outline PDF	PDF Material Information PDF
32-Lead LFCSP_CAV (5mm x 5mm w/ EP) (cg-32-1)	PDF Outline PDF	PDF Material Information PDF