CSP (芯片级封装)

CSP BGA(球栅阵列)

Chip Scale Package BGA, 0.5, 0.65, 0.8, and 1.0mm pitch   查看更多

EWLP (Embedded Wafer Level)

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Hittite Legacy LFCSP

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LFCSP(引脚架构)

Leadframe Chip Scale Package, 0.5 and 0.8mm pitch.   查看更多

LFCSP-CAV (Pre-molded)

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LTC Legacy DFN (dual flat no lead)

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LFCSP-CS (Side Solderable)

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LGA(基板栅格阵列)

Land Grid Array
Chip Array Small Outline No Lead Package   查看更多

LTC Legacy GQFN (Grid Array Quad Flat No Lead)

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LTC 传统 LGA(基板栅格阵列)

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LTC Legacy LGA (Land Grid Array) Trays

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LTC Legacy LQFN

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LTC Legacy QFN (Quad Flat No Lead)

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LTC Legacy UTDFN

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LTC Legacy UTQFN

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WLCSP(晶圆级)

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