集成式子组件
ADI applies expertise in system analysis, MMIC, complex ICs, and module design, mechanical packaging, automated manufacturing, RF testing, screening, and qualification. Since the majority of ICs are ADI products, there are significant benefits in controlling performance, scheduling, screening, qualification, packaging, part obsolescence, troubleshooting, and design optimization.
ADI Manufacturing and Test Abilities Include
- ISO 9001:2008 and AS9100:2009 certified
- Automatic hybrid assembly equipment; includes
- Die inspect/pick
- Die/substrate attach
- Wire bond
- IR reflow equipment for PCB-based assemblies
- Automated digital product test to 40 Gbps
- Automated RF, microwave, and millimeter wave product tests to 110 GHz
GaN and High Power Amplifiers
ADI’s leading edge GaN power amplifiers provide best-in-class in efficiency and power handling from L to Ka-band. Leading edge MMIC design and packaging simplifies integration and system development for aerospace and defense wide range of applications, with an expanding portfolio of non-ITAR and non-export controlled solutions.
Integrated solutions, utilizing advanced power combining techniques provide high power amplifiers supporting up to 32 kW output power from L band to Ka-band, provides alternative solutions to traditional traveling wave tube devices with increased reliability and efficiency.
技术文章
- Power Supply Management of GaN MMIC Power Amplifiers for Pulsed Radar
- 面向高效电机控制的无传感器矢量控制技术继续发展
- 宽带高动态范围限幅放大器
- 从直流到宽带的高速模拟信号链设计
- 模拟提示—— ADC 的抽取
- Mechanical Design for Microphonic-Sensitive Electronics
- SWaP：“翱翔高空”抑 或“望空兴叹”可能取决 于RF解决方案
- Mastering the Thermal Challenges of Advanced Defense Subsystems
解决方案通报和手册
