Small Outline, 300 mil body, 50 mil pitch. Note: For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location
| 封装 | 外形图 | 材料信息 |
|---|---|---|
| 16 ld SOIC (increased Creepage) (RI-16-1) | ||
| 20 ld SOIC (increased Creepage) (RI-20-1) | ||
| 14 ld SOIC - Wide (rw-14) | ||
| 16 ld SOIC - Wide (rw-16) | ||
| 18 ld SOIC - Wide (rw-18) | ||
| 20 ld SOIC - Wide (rw-20) | ||
| 24 ld SOIC - Wide (rw-24) | ||
| 28 ld SOIC - Wide (rw-28) |