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This ZIP File is associated with Rev 1 of the Application Note


    Soldering Considerations for Exposed-Pad Packages (EE-352)  


that can be found at http://www.analog.com/ee-notes.


Date Created:	May 17th, 2012


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The archive contains a datasheet from the solder paste vendor (Indium Corporation) for 
the solder paste used for most Analog Devices, Inc. EZ-KIT evaluation boards.


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