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Packages Index

For RoHS info, MSL, Peak reflow solder temp and pkg weight please refer to the RoHS material declaration page, this is not a full declaration. For a full Material Declaration please click on desired package below.

Brominated flame retardant additives (if present) in the mold compounds used by ADI are incorporated into the epoxy matrix during the curing process and are not present in the free state in the final product.

The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements.

For further assistance please contact 1-800-ANALOGD.