SOIC-W image

Small Outline, 300 mil body, 50 mil pitch. Note: For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location

The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements

パッケージ 外寸 成分情報
16 ld SOIC (increased Creepage) (RI-16-1) PDF PDF
16 ld SOIC (increased Creepage) (RI-16-2) PDF PDF
20 ld SOIC (increased Creepage)  (RI-20-1) PDF PDF
14 ld SOIC - Wide (rw-14) PDF PDF
16 ld SOIC - Wide (rw-16) PDF PDF
18 ld SOIC - Wide (rw-18) PDF PDF
20 ld SOIC - Wide (rw-20) PDF PDF
24 ld SOIC - Wide (rw-24) PDF PDF
28 ld SOIC - Wide (rw-28) PDF PDF
感想、意見を送る X
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