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Small Outline, 150 mil body, 50 mil pitch. Note:For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location.
The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements
| パッケージ | 外寸 | 成分情報 | フットプリント |
|---|---|---|---|
| 14 ld SOIC (r-14) | |||
| 16 ld SOIC (r-16) | |||
| 8 ld SOIC (r-8) |
