Small Outline, thermally enhanced with heatsink
The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements
| パッケージ | 外寸 | 成分情報 | フットプリント |
|---|---|---|---|
| 24 ld SOIC w/Batwing (rb-24) | |||
| 8 ld SOIC-EP (rd-8-1) | |||
| 8 ld SOIC-EP (2.41mm Exposed pad) (rd-8-2) | |||
| 20 ld PSOP (rp-20) | |||
| 28 ld PSOP (17.90 x 7.5mm) (rp-28) |
