Thermally Enhanced Ball Grid Array with Heatsink
The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements.
| パッケージ | 外寸 | 成分情報 | フットプリント |
|---|---|---|---|
| 256 ball SBGA (BP-256) (bp-256) | |||
| 304 Ball SBGA (bp-304) | |||
| 432 ball SBGA (bp-432) |
