中途採用 募集要項

アナログ・デバイセズでは現在、半導体パッケージエンジニアを募集しています。

 

弊社への採用募集にご応募頂ける方は、履歴書・職務経歴書(日英)を添付し、Recruit.Japan@analog.comへご連絡ください。
採用担当者より、折り返しご連絡いたします。


 

Position Package and Assembly Engineer (半導体パッケージエンジニア)
Location Japan (東京本社)
Education Graduate B.S in Engineering
Job Summary
The Package and Assembly Engineer who supports the ADKK sales, FAE and CQE activities in Japan and work closely with US and Asia based Package engineering teams. The Package and Assembly Engineer understands the Package / Assembly process / Product / Structure / Materials / Machines and tools for ADI and supports business win by clear explanation and communication with Customer.
Key Responsibilities
  1. Provide ADI’s best solution to customer and guide them to choose the optimum package types which will fit design and application needs.

  2. Get customer approval and agreement by Trouble shooting and providing explanation with FTA and Engineering DOE data which provided by Package & Assembly engineering teams.

  3. Keep contact and Provide updated technology roadmap of Materials, Machines and Subcons information in Japan to ADI Package & Assembly Team.

  4. Contact suppliers to resolve material issues and being contact window for further update.

  5. Review TRB questions and provide the answers for PCN.

  6. Would need short term Oversea(Singapore/Philippines) relocation and/or Multiple visits as training purpose.

Experiences
  • Around 10 years of semiconductor Package and Assembly experience
  • Experience of Wirebond/Mold/WLCSP related Engineering preferred
  • Experience of resolving Assembly and Packaging issues
Competences
  • Good in English Speaking/Writing communication Skills
  • Good in English Presentation Skills 
  • MS Office (Powerpoint, Excel, Word) user skills
  • Knowledge in FMEA, 8D, SPC, DOE

 

新卒採用情報はこちらをご覧ください。