Small Outline, 300 mil body, 50 mil pitch. Note: For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location
The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements
| Package | Outline | Material Information |
|---|---|---|
| 16 ld SOIC (increased Creepage) (RI-16-1) | ||
| 20 ld SOIC (increased Creepage) (RI-20-1) | ||
| 14 ld SOIC - Wide (rw-14) | ||
| 16 ld SOIC - Wide (rw-16) | ||
| 18 ld SOIC - Wide (rw-18) | ||
| 20 ld SOIC - Wide (rw-20) | ||
| 24 ld SOIC - Wide (rw-24) | ||
| 28 ld SOIC - Wide (rw-28) |
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