SOIC-W image

Small Outline, 300 mil body, 50 mil pitch. Note: For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location

The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements

Package Outline Material Information
16 ld SOIC (increased Creepage) (RI-16-1) PDF PDF
16 ld SOIC (increased Creepage) (RI-16-2) PDF PDF
20 ld SOIC (increased Creepage)  (RI-20-1) PDF PDF
14 ld SOIC - Wide (rw-14) PDF PDF
16 ld SOIC - Wide (rw-16) PDF PDF
18 ld SOIC - Wide (rw-18) PDF PDF
20 ld SOIC - Wide (rw-20) PDF PDF
24 ld SOIC - Wide (rw-24) PDF PDF
28 ld SOIC - Wide (rw-28) PDF PDF
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