Small Outline, 150 mil body, 50 mil pitch. Note:For
SOIC packages when pin 1 dot or notch is absent,
use bevelled edge to identify location.
The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements
|14 ld SOIC (r-14)|
|16 ld SOIC (r-16)|
|8 ld SOIC (r-8)|