Small Outline, thermally enhanced with heatsink

The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements

Package Outline Material Information
24 ld SOIC w/Batwing  (rb-24) PDF PDF
16 ld SOIC-EP (rd-16-1) PDF PDF
8 ld SOIC-EP (rd-8-1) PDF PDF
8 ld SOIC-EP (2.41mm Exposed pad) (rd-8-2) PDF PDF
20 ld PSOP (rp-20) PDF PDF
28 ld PSOP (17.90 x 7.5mm) (rp-28) PDF
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