Thermally Enhanced Ball Grid Array with Heatsink
The footprints created for each individual package should be used as a reference only. Since these footprints are not part specific you will have to adjust the dimension to best fit your requirements.
| Package | Outline | Material Information |
|---|---|---|
| 256 ball SBGA (bp-256) | ||
| 304 Ball SBGA (bp-304) | ||
| 432 ball SBGA (bp-432) |
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