PB FREE ROHS COMPLIANT PRODUCT CHANGE NOTIFICATION (PCN), INCLUDING BGA AND THERMALLY ENHANCED, AND OTHER LEAD FRAME PACKAGES NOT COVERED IN PCN # 02-0011

PCN #04_0065
Date of Original PCN: April, 2004
Date of Revision 6: February 10, 2009

Proposed Change:
Analog Devices is changing molding compounds and, in some cases, die attach materials on several package families. The purpose of the change is to provide material sets that are RoHS compliant and that demonstrate capability to meet elevated Pb Free reflow conditions (+255°C (+5/-0°C) peak) . The PCN for high volume leadframe plastic packages has been issued in November, 2001 (PCN # 02-0011). This PCN covers laminate packages, thermally enhanced packages (i.e. heat slug, exposed pad packages…), and other packages not included in PCN # 02-0011.

Additionally, Analog Devices is offering a Pb Free finish on our plastic packages. For leadframe plastic packages, 85Sn/15Pb plating is changing to 100Sn (matte tin plating). For laminate BGA packages and WLCSP/Bumped Die, 62Sn36Pb2Ag or 63Sn37Pb solder ball composition is changing to Sn3.0-3.9Ag0.5-1.5Cu. The implementation of these new plating and ball compositions will be a result of customer choice.

Analog Devices is also offering a gold (Au) Pb Free finish on our hermetic packages, except cerdip/cerpak packages. ADI has no plan to convert cerdip/cerpak packages to Pb Free RoHS compliance.

Pb Free RoHS compliant product models will be designated with a "Z" suffix in the part number and will be identified with a Pb Free RoHS compliant label on the outer shipping container. If space permits, a "#" sign will also be marked on the Pb Free RoHS compliant devices. We will replace the "#" sign with an industry standard marking if one is suitable.

Customer Input:
Over the last several years, a number of customers have communicated their plans to ADI for Pb Free RoHS compliant conversion. There has been strong support from customers for converting mold compounds to more robust versions so that packages are compatible with a higher temperature. In preparation for conversion to Pb Free processes, many customers are conducting their own qualifications of new finishes, including Sn plating and SnAgCu solder spheres. We continue to poll our customers on their plans and needs but have deferred a general conversion to Sn plating and SnAgCu solder spheres.

Given the current needs of our customers, we will offer Pb Free solder balls and plating on request and will continue to offer SnPb solder ball for products currently available with SnPb finishes. SnPb plating will continue to be offered for device types currently available with SnPb finish; however, our suppliers continue to pressure us to migrate away from SnPb plating in favor of Pb Free solutions. Contact your Local Sales or Distributors as necessary with your SnPb requirements.

Implementation Plan:
Customers who have requested Pb Free RoHS compliant devices will not receive converted products earlier than the dates in this PCN. The dates in the table reflect the latest information on "the first date material may be received". For leadframe packages, we have also separated the implementation dates for Mold Compound/Die Attach Material and Plating Material. The exact date of customer receipt of the new materials will depend on materials and inventory depletion. For BGA packages, we will only move to the new mold compound and die attach material in parallel with the move to Pb Free solder spheres.

Where products and/or package body sizes require a change in MSL, the Moisture Barrier Bags will be labeled accordingly.

Additional information can be found at ADI Lead (Pb) Free RoHS compliance

** A few selective part types might not yet be converted within a package family. Consult the Contact listed at the end of the PCN for more information. Customers should contact their Local Sales and Distributors with Pb Free requests. Analog Customer Service is available to assist Local Sales and Distributors with these Pb Free requests.

Package Codes:
See following URL: Lead Free Package Designators

Reason for Change:
Customer demand for Pb elimination has driven Analog Devices’ Pb Free RoHS compatible program. Package material changes meet RoHS requirements and allow customers to convert to a higher peak reflow temperature of +255°C (+5/-0°C). ADI qualifies Pb Free RoHS compatible packages using reflow profiles per J-STD-020. In setting reflow profiles, customers must take precautions to ensure that time near peak reflow temperature is not excessive.

Summary of Supporting Information:
Analog Devices is following our standard qualification program. Qualification reports are available through the address in the Contact section.

Date Change Effective:
Conversion will commence per the "Affected Packages" section of this PCN. Conversion will be on a package-by-package basis. Pb Free RoHS compliant shipments might be gated by inventory positions of non-Pb Free units.

Analog Devices Contact:
ADI Quality Group
World Wide Manufacturing, Analog Devices
804 Woburn St., M/S 615
Wilmington, MA 01887
Fax: 781-461-4447