LEAD FREE PRODUCT CHANGE NOTIFICATION (PCN)

PCN #02-0011
Date of Original PCN: November 2, 2001
Date of Revision 8 (Final Revision): May 15, 2004

Proposed Change:
Analog Devices is changing molding compounds and, in some cases, die attach materials on high volume plastic package families. The purpose of the change is to provide material sets that demonstrate capability to meet elevated reflow conditions (+255°C (+5/-0°C) peak) for Pb Free reflow.

Additionally, Analog Devices is offering Pb Free lead finish on these high volume leaded plastic packages from 85Sn/15Pb to 100Sn (tin plating) to eliminate Pb from these package types.

Product models that have been converted to Pb Free will be identified on the outer packaging label, and if space permits, a "#" sign will be marked on converted devices. If developed, we will replace the "#" with an industry standing marking.

Changes From Original Version of PCN - Customer Input
As a result of issuing the original PCN on November 2, 2001, a number of customers communicated their plans to ADI for Pb Free conversion. There was strong support from customers for converting mold compounds to more robust versions so that packages are compatible with a higher temp reflow as many customers are targeting conversion to Pb Free processes in 2004 or 2005. In preparation for conversion, many customers are conducting their own qualifications of new lead finishes including tin plating. We will continue to poll our customers as to their plans and needs, but will defer a general conversion to Sn finish until an industry consensus is reached. At that time, we will provide a minimum of 90 days notice of our intent to convert plating finishes.

Given the current needs of our customers, we have decided to offer Pb Free plating for volume applications in addition to continuing to offer SnPb plating for all device types. Devices with Sn plating will be designated with a "Z" suffix in the part number and a Pb Free label will be placed on the shipping container.

Also, with each revision, we have continued to update our schedule for offering these new Pb Free versions. With revision 8 we have completed our qualifications with the package families included in this PCN.

Implementation Plan:
Customers who have not requested Pb Free devices will not receive converted products earlier than the dates in the original PCN. We have already converted the material sets for some LQFP, TSSOP, SSOP, SOIC, TQFP, MQFP, MSOP, QSOP, SOT, and LFCSP products to +255°C (+ 5/-0°C) peak compatible. The dates in the table reflect the information on "the first date material may be received". We have also separated the implementation dates for Mold Compound/Die Attach Material and Plating Material. The exact date of customer receipt of the new materials will depend on materials and inventory depletion.

We will continue to advise customers of our overall Pb free program via our Pb Free Updates which can be found at ADI Lead (Pb) Free

A separate PCN (#04_0065) has been issued at a later date to address heat slug and exposed pad packages, power and specialty QFP, BGA/PBGA, SC70, and eventually hermetics.

Analog Devices has focused on mold compounds which are compatible with +255°C (+5/-0°C) reflow. As 'halide-free' mold compounds become available, Analog Devices will characterize, qualify and implement these compounds in order to meet Pb-Free and halide-free requests. Halide-free changes will be covered on a separate PCN.

Where products and/or package/body sizes required a change in MSL, the Moisture Barrier Bags have been labeled accordingly. MSL downgrades or upgrades are listed here.

Package Codes:
See following URL: Lead Free Package Designators

Reason for Change:
Customer demand for Pb elimination, especially from Japan and Europe, has driven Analog Device's Pb Free program. Conversion to Sn plating will satisfy customer Pb Free requests. The materials change will allow customers to convert to a higher peak reflow temperature of +255°C (+5/-0°C). In setting reflow profiles, customers must take precautions to ensure that time near peak reflow temperature is not excessive. We assume Pb Free profiles do not put a device in an environment exceeding +250°C for more than 20 seconds.

Summary of Supporting Information:
Analog Devices is following our standard qualification program. Qualification reports are available per the address in the Contact Section.

Date Change Effective:
Conversion was completed per the "Affected Leaded Packages" section of this PCN.

Analog Devices Contact:
ADI Pb-Free Group:
World Wide Manufacturing, Analog Devices
804 Woburn St., M/S 611
Wilmington, MA 01887
Fax: 781-937-1741
E-mail: ADI.PbFree@analog.com.