PACKAGE DESIGNATORS

Package Codes Included in PCN #02_0011

Package Code	Package Name	Package Description
CP	LFCSP	Leadless Chip Scale Package
N	PDIP	Plastic DIP (plating only, will not be +255°C (+ 5/-0°C) compliant)
P	PLCC	Plastic Leaded Chip Carrier, 50 mil Pitch
R	SOIC	Small Line Packages
RM	Mini_SO	Mini Small Outline Package/Micro-SO
RN or R	SOIC_N	Small Outline Package - Narrow Body 150 mils
RQ	QSOP	SOIC with .025 mil pitch
RS	SSOP	Shrink Small Outline Package
RT	SOT_23	SOT-23 (All Leads)
RU	TSSOP_4.4	Thin Shrink Small Outline Package, 4.4 mm Body
RV	TSSOP_6.1	Thin Shrink Small Outline Package, 6.1 mm Body
RW	SOIC_W	Small Outline Package - Wide Body 300 mils
RB	SOIC_W_BAT	Small Outline Package with Thermal "Batwing" Leads - Wide Body 300 mils
S	MQFP	Metric Plastic Quad Flatpack, PQFP 2.0-3.5 mm
ST	LQFP	Low Profile Plastic Quad Flatpack, PQFP 1.4 mm
SU	TQFP	Thin Plastic Quad Flatpack, PQFP 1.0 mm

SP (Power PQFP with Heat Slug), SQ (Power Thin PQFP 1.4 mm), and SV (Ultra Thin Power PQFP 1.0 mm)
packages are not included in the PCN and will be covered in a separate PCN.

A few legacy products have the following codes PDIP - P and SOIC - S.

Last Updated 4/04