Wafer Fabrication Data:
High
Temperature Operating Life (HTOL), Failures in Time (FIT), Mean Time to Fail (MTTF).
Assembly/Package Process Data:
Autoclave (PCT), Highly Accelerated Stress Test (HAST), High Temperature Storage (HTS), Temperature Cycling Test (TCT),
Temperature Humidity Bias (THB), Thermal Stock Test (TST), Unbiased HAST.
