Package Designators
Package Codes Included in PCN #02_0011
| CP |
LFCSP |
Leadless Chip Scale Package |
| |
| N |
PDIP |
Plastic DIP (plating only, will not be +255°C (+ 5/-0°C) compliant) |
| |
| P |
PLCC |
Plastic Leaded Chip Carrier, 50 mil Pitch |
| |
| R |
SOIC |
Small Line Packages |
| RM |
Mini_SO |
Mini Small Outline Package/Micro-SO |
| RN or R |
SOIC_N |
Small Outline Package - Narrow Body 150 mils |
| RQ |
QSOP |
SOIC with .025 mil pitch |
| RS |
SSOP |
Shrink Small Outline Package |
| RT |
SOT_23 |
SOT-23 (All Leads) |
| RU |
TSSOP_4.4 |
Thin Shrink Small Outline Package, 4.4 mm Body |
| RV |
TSSOP_6.1 |
Thin Shrink Small Outline Package, 6.1 mm Body |
| RW |
SOIC_W |
Small Outline Package - Wide Body 300 mils |
| RB |
SOIC_W_BAT |
Small Outline Package with Thermal "Batwing" Leads - Wide Body 300 mils |
| |
| S |
MQFP |
Metric Plastic Quad Flatpack, PQFP 2.0-3.5 mm |
| ST |
LQFP |
Low Profile Plastic Quad Flatpack, PQFP 1.4 mm |
| SU |
TQFP |
Thin Plastic Quad Flatpack, PQFP 1.0 mm |
SP (Power PQFP with Heat Slug), SQ (Power Thin PQFP 1.4 mm), and SV (Ultra Thin Power PQFP 1.0 mm)
packages are not included in the PCN and will be covered in a separate PCN.
A few legacy products have the following codes PDIP - P and SOIC - S.
Package Codes Included in PCN #04_0065
| BC |
CSP_BGA |
Chip Scale Package BGA |
| B |
BGA |
Plastic Ball Grid Array |
| BP |
BGA_ED |
Ball Grid Array Thermally Enhanced w/heat sink (SBGA, EBGA, Super FC BGA) |
| |
| CC |
LGA |
Chip Array Small outline No Lead Package (Cason, LGA) |
| |
| P |
PLCC |
Plastic Leaded Chip Carrier, 50 mil pitch |
| |
| ST |
LQFP |
Low Profile Plastic Quad Flat Pack, 1.4 mm Body Thickness |
| S |
MQFP |
Metric Plastic Quad Flat Pack, 2.0-3.5 mm Body Thickness |
| SQ |
LQFP_ED |
Edquad Low Profile Quad Flat Package Thermally Enhanced w/heat sink |
| SP |
MQFP_ED |
Edquad Metric Quad Flat Package Thermally Enhanced w/heat sink |
| |
| PP |
PLCC_ED_C |
Edquad with Ceramic Plastic Leaded Chip Carrier Thermally Enhanced w/heat sink |
| |
| SV |
TQFP_EP |
Exposed Paddle Thin Quad Flat Packages, 1.0 mm Body Thickness |
| |
| RA |
SOT_143 |
Small Outline Transistor Package |
| RE |
TSSOP_EP |
Exposed Pad Think Shrink Small Outline Package, 4.4 mm Body |
| RC |
QSOP_EP |
Exposed Pad Shrink Small Outline Package, 150 mil Body |
| RD |
SOIC_N_EP |
Exposed Pad Small Outline Package, 150 mil Body |
| RP |
PSOP_2 |
Small Outline Thermally Enhanced w/heat sink, 300 mil Body |
| RR |
PSOP_3 |
Small Outline Thermally Enhanced w/heat sink, 11 mm Body |
| |
| T |
TO-92 |
Plastic Header Package (flat index) |
| |
| KC |
SOT_223 |
Small Outline Transistor Package |
| KS |
SC70 |
Thin Shrink Small Outline Transistor Package |
|
