μModule Design and Manufacturing Resources

A µModule® power product simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function in a compact molded plastic package. Below is a list of guides for product selection, design, evaluation, simulation, layout, PCB assembly, and packaging.

Design Resources

Manufacturing Resources

uModule Chip

Design Resources

µModule® Power products simplify implementation, verification, and manufacturing of Power Circuits by integrating Power Functions in a compact package.


View the Power µModule® Products brochure

uModule Brochure

Simulation Tools

Download LTspice, our powerful, free schematic capture and simulation program for models and demo circuits of DC/DC μModule products.


LTpowerCAD is an alternative DC/DC μModule product selection tool. The tool also assists you through the external component selection process and confirms stability for your unique application. Once complete, the design is easily exportable to LTspice for simulation.

LTpowerPlay is a powerful, Windows-based development environment supporting Linear Technology's Digital Power System Management (PSM) products.


Demo Boards, Software, & Gerber Files

Visit the appropriate product page to view evaluation boards, Gerber files, manuals, and associated software.

FPGA Reference Designs

Electrical Performance

For other design information and applications information, please refer to the product datasheets or the following documents:

  • AN119A - Powering Complex FPGA-Based Systems Using Highly Integrated DC/DC µModule Regulator Systems
  • DN385 - 10A High Performance Point-of-Load DC/DC µModule Regulator
  • DN411 - Simple and Compact 4-Output Point-of-Load DC/DC µModule System
  • DN430 - 8A Low Voltage, Low Profile DC/DC Module Regulator in 9mm x 15mm Package Weighs Only 1g
  • DN438 - µModule Buck-Boost Regulators Offer a Simple and Efficient Solution For Wide Input and Output Voltage Range Applications
  • DN1021 - How to Produce Negative Output Voltages from Positive Inputs Using a μModule Step-Down Regulator
  • DN530 - Increasing Output Voltage and Current Range Using Series- Connected Isolated μModule Converters

Thermal Performance

  • AN103 - LTM4600 DC/DC μModule Regulator Thermal Performance
  • AN110 - LTM4601 DC/DC μModule Regulator Thermal Performance
  • AN119B - Powering Complex FPGA-Based Systems Using Highly Integrated DC/DC µModule Regulator Systems

Manufacturing Resources

Quick Start Guide

A brief reference on handling moisture sensitivity, reflow and assembly for the LGA and BGA packages

Shipping Quantities & Tray Dimensions

Materials Declarations & RoHS

Visit our Material Declaration Search page.

For general information on our RoHS program, please visit our Lead Free Program and RoHS Compliance page.

PCB Assembly and Manufacturing Guidelines

LGA Packages: Assembly Considerations for Analog Devices µModule LGA Packages

BGA Packages: Assembly Considerations for Analog Devices µModule BGA Packages

Provides a complete guide to:

  • Package Construction
  • PCB Design Guidelines
  • Moisture Sensitivity, Pack, Ship & Bake
  • Board Assembly Process
    • Screen Print
    • Stencil Design
    • Solder Paste, Key Process Parameters
    • Placement
    • Reflow Profile
    • Cleaning
    • Removal and Rework

Package & Board Level Reliability

Data reports from ongoing reliability test are updated regularly and may be accessed from the following links.

Moisture Sensitivity

For moisture sensitivity of µModule devices, please click here or see page 2 of datasheet.