There are three basic "components" employed by the MultiChip Products Group to address the needs of our customers: Monolithic silicon devices, high-density interconnect and application targeted test.
The first "component" is high-performance monolithic silicon devices. We have direct access to the full range of silicon and intellectual property developed by Analog Devices (ADI), as well as other third-party products. By understanding and leveraging the full "silicon" performance potential, and by extending device performance with highly integrated system interconnect, it is possible to address the more stressing electrical, thermal and mechanical requirements.
The second element of ADI's integrated module solutions is the high-density interconnect design expertise and implementation. In essence, ADI's interconnect technology is a "component" to be leveraged throughout the development and manufacturing process, which improves and optimizes system performance.
Finally, the third facet is application targeted test. Just as the interconnect technology can extend the performance of the silicon, a targeted test and screening flow can also substantially improve performance and reliability at the sub-system level. These multi-chip sub-system components are tested, characterized, and qualified to the same stringent levels as any monolithic Analog Devices component.