Overview

Features and Benefits

  • Glueless Clusters of up to six SHARCs
  • Link Ports for 2D & 3D Arrays
  • Distributed Bus Arbitration
  • Unified Memory Space
  • Link Ports Provide Up To 80MB/sec I/O Each
  • 320 MB/sec External Port
  • Hardware Support for Semaphores

Product Details

The ADSP-21160M DSP is a SHARC processor that is optimized for applications such as telephony, medical imaging, radar/sonar electronics, communications, 3D graphics and imaging. The ADSP-21160M features a Single-Instruction-Multiple-Data (SIMD) architecture.

Using two computational units (ALU, Barrel Shifter, MAC, Register files), the ADSP-21160M can have a five fold performance increase versus the ADSP-2106x on a range of DSP algorithms. It is code compatible with ADI's popular first generation ADSP-2106x SHARC DSPs. Like other SHARCs, the ADSP-21160M is a 32-bit processor that is optimized for high performance DSP applications. The ADSP-21160M includes an 80 MHz core for processing both 32-bit fixed-point and (32-bit, 40-bit) floating-point data types, a dual-ported 4 Mbit on-chip SRAM, an integrated I/O processor with multiprocessing support, and multiple internal busses to eliminate I/O bottlenecks.

The ADSP-21160M is optimized for multiprocessing topologies; SHARC supports multiprocessing via link ports or an external port. In the diagram below, both cluster and link port multiprocessing is shown. Over the external port up to six 21160Ms may be connected together without any additional support logic. The arbitration for this shared bus is integrated on-chip. Each SHARC in the cluster has access to every SHARC's internal memory. Through the external port connection, optional external memory may be shared as well.

The six link ports are another way to gluelessly connect a multiprocessing system. Both, the links and the cluster can be used simultaneously and systems with hundreds of SHARC DSPs can be developed using both peripherals.

Maximize Speed, Minimize Size
The ADSP-21160M is offered in a 27mm x 27mm 400-ball PBGA (Plastic Ball Grid Array) package 40% smaller than processors in this performance class.

More Processing Per Watt
In addition to small size and high performance, the 21160M's power dissipation enables new levels of MFLOPS per watt. The ADSP-21160M typical power dissipation is 2 watts, enabling 240 MFLOPS of performance per watt. This allows designers to use multiple processors on a PCI card within the PCI power limit of 25 watts. With eight 21160M DSPs, providing 480 MFLOPS each, a standard PCI card design can obtain 3.84 GFLOPS performance and leave 9 watts for other circuitry.

The ADSP-21160M is supported by hundreds of readily available third-party hardware and software products and ADI's powerful VisualDSP++ development system, allowing for fast and easy development, debug and deployment.

Product Lifecycle icon-recommended Production

At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.

Evaluation Kits (1)

Documentation

Application Notes (35)

Software & Systems Requirements

Software & Tools Anomalies

Tools & Simulations

BSDL Model Files

Designing with BGA

Surface Mount Assembly Recommendations for Plastic Ball Grid Array (PBGA) Packages

Design Resources

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.

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