The SSM2304 features a high efficiency, low noise modulation scheme. It operates with 85% efficiency at 1.4 W into 8 Ω from a 5.0 V supply and has a signal-to-noise ratio (SNR) that is better than 98 dB. PDM modulation is used to provide lower EMI-radiated emissions compared with other Class-D architectures.
The SSM2304 has a micropower shutdown mode with a typical shutdown current of 20 nA. Shutdown is enabled by applying a logic low to the SD pin.
The architecture of the device allows it to achieve a very low level of pop and click. This minimizes voltage glitches at the output during turn-on and turn-off, thus reducing audible noise on activation and deactivation.
The fully differential input of the SSM2304 provides excellent rejection of common-mode noise on the input. Input coupling capacitors can be omitted if the dc input common-mode voltage is approximately VDD/2.
The SSM2304 also has excellent rejection of power supply noise, including noise caused by GSM transmission bursts and RF rectification.
The SSM2304 has a preset gain of 18 dB, which can be reduced by using external resistors.
The SSM2304 is specified over the commercial temperature range (−40°C to +85°C). It has built-in thermal shutdown and output short-circuit protection. It is available in a 16-lead, 3 mm × 3 mm lead-frame chip scale package (LFCSP).Applications
- Notebooks and PCs
- Mobile phones
- MP3 players
- Portable gaming
- Portable electronics
- Educational toys
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