| Chapter: N/A | Page: 35 |
| DOC ID: DOC-609 | |
| Change | |
Recommendations for solder mask opening and ball pad size are missing from the Outline dimensions figure. Add the following note:
Recommended solder mask opening is X.XXmm, recommended ball pad size is Y.YYmm.The information for X.XX and Y.YY comes from the table at http://www.analog.com/processors/bgapackage. | |
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