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| Chapter: N/A |
Page: 1 |
| Reference Number: 4577 |
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| In Figure 1 (Functional Block Diagram), the Sequencer and Cache should be connected to an input from the PM Data Bus (instead of the DM Data Bus) and should show an output to the PM Address Bus. (See the Functional Block Diagram in the ADSP-21060 data sheet.) |
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| Chapter: N/A |
Page: 16 |
| Reference Number: 4578 |
| Change |
| In the footnotes beneath the table (Memory Read—Bus Master), the Hold Time Cycle is indicated as equal to tCK. It is not. This footnote (on page 16, 17, 28, and others) should be corrected to H = tCK/2. |
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| Chapter: N/A |
Page: 22 |
| Reference Number: 4579 |
| Change |
| In footnote 1 beneath the table (Multiprocessor Bus Request and Host Bus Request), the note refers to the 2nd Edition of the ADSP-21065L User's Manual. At this time (May 2003), only the 1st edition of this manual is available. |
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| Chapter: N/A |
Page: 44 |
| Reference Number: 4709 |
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The OUTLINE DIMENSIONS diagram for the 196-Ball Mini-BGA does not indicate how pin 1 is marked on the mini-bga package. The pin 1 indicators are:
--On the TOP side, pin 1 is indicated with a white dot in the upper left corner.
--On the BOTTOM side, pin 1 is indicated with a gold triangle in its corner. |
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| Chapter: N/A |
Page: 44 |
| Reference Number: 23148 |
| Change |
In the outline dimensions figure, the remove following (or similarly worded) note:
THE ACTUAL POSITION OF EACH BALL IS WITHIN ... mm OF ITS IDEAL POSITION RELATIVE TO THE BALL GRID. |
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| Chapter: N/A |
Page: 44 |
| Reference Number: 24410 |
| Change |
Recommendations for solder mask opening and ball pad size are missing from the Outline dimensions figure. Add the following note:
Recommended solder mask opening is X.XXmm, recommended ball pad size is Y.YYmm.
The information for X.XX and Y.YY comes from the table at http://www.analog.com/processors/bgapackage. |
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