ADSP-BF514: Low Power Blackfin with Consumer Devices Connectivity
The Blackfin processor family is extended further into the portable market with the availability of an on chip removable storage interface including SDIO, CE-ATA and eMMC. The high performance ...More
ADSP-BF514: Low Power Blackfin with Consumer Devices Connectivity
Product Description
The Blackfin processor family is extended further into the portable market with the availability of an on chip removable storage interface including SDIO, CE-ATA and eMMC. The high performance 16/32-bit Blackfin embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of connected applications, including PMP and WiFi devices.
IP protection has become a necessary part of today’s embedded computing applications. The ADSP-BF514 provides a security scheme which balances flexibility and upgradeability with performance through the inclusion of a firmware-based solution including OTP (One Time Programmable) memory to enable users to implement private keys for secure access to program code.
- Data Sheet Rev PrE, 03/2009 (pdf 1758kB)
- (About Data Sheets)
Development Tools
VisualDSP++
Easy-to-use integrated software development and debugging environment (DDE)...
Blackfin Evaluation Kits
EZ-KIT Lite evaluation kits provide developers with a cost-effective method...
Starter Kits
Starter kits provide you with an EZ-KIT Lite evaluation kit and EZ-Extender...
USB Emulators
Rapid on-chip debugging allows developers to load code, set breakpoints, an...
Features
- Blackfin processor core with up to 400 MHz (800 MMACS) performance
- 2 dual-channel, full-duplex synchronous serial ports supporting 8 stereo I2S channels
- 12 peripheral DMA channels supporting one- and two-dimensional data transfers
- Connectivity: SDIO, CE-ATA, eMMC, UART’s, SPORT’s, SPI and TWI
- Lockbox Secure Technology: Hardware-enabled security for code and content protection
- Memory controller providing glue-less connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
- 176-p, 0.5 mm pitch, 24 X 24 LQFP (Industrial temperature range -40°C to +85°C)
- 168-ball, 0.8 mm pitch, 12x12 mm CSP-BGA (Commercial temperature range
0°C to +70°C)
Diagrams
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Functional Block Diagram for ADSP-BF514
Low Power Blackfin with Consumer Devices Connectivity
Functional Block Diagram for ADSP-BF514
